SHF: Small: Collaborative Research: Algorithmic Techniques for Post-Silicon Characterization Using Infrared Emissions

SHF：小型：协作研究：使用红外发射进行硅后表征的算法技术

• 批准号: 1115424
• 负责人: Sherief Reda
• 金额: $ 20万
• 依托单位: Brown University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2011
• 资助国家: 美国
• 起止时间: 2011-07-01 至 2014-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1115424&HistoricalAwards=false
• 关键词: SHF; Small; Collaborative; Research; Algorithmic

Aggressive technology scaling has brought new challenges to the design and manufacturing of Integrated Circuits (ICs). A mounting challenge is the modeling and characterization of power consumption in face of possible operating and manufacturing variabilities. Accurate power characterization leads to extended battery life for mobile devices and to enhanced device reliability. A second challenge arises because manufacturing is increasingly outsourced to external foundries. Verifying that the manufacturer has not inserted any malware or "Trojan" circuitry that compromises the security of the final product is essential. The proposed research provides a unifying framework for these two challenges by detailed algorithmic analysis of infrared emissions from the backside of ICs. We propose techniques to convert the infrared emissions into accurate spatial and temporal power estimates, and to use the power and infrared ?fingerprints? to verify that the chip does not contain extra circuits inserted by the manufacturer, unbeknownst to the designer, that could cause a security breach. The successful completion of this project will lead to improved power modeling and characterization tools and increased confidence that there are no added malware in manufactured chips. The project will also lead to design prototypes and a large volume of valuable data and benchmarks that will be openly disseminated via NSF-funded Trust-Hub and other web-based portals. The methods and tools will find broad usage in the industry, government, and in academia. They will also impact the daily lives by increasing the battery lifetime and by improving the system's reliability and integrity. Education plan includes research experience for undergraduates, curriculum development, integration of material into graduate courses and emphasizing entrepreneurship within education. Recruitment and development of under-represented groups of students will be targeted.

激进的技术规模化给集成电路（ic）的设计和制造带来了新的挑战。面对可能的操作和制造变化，对功耗进行建模和表征是一个日益严峻的挑战。准确的功率特性可以延长移动设备的电池寿命，提高设备的可靠性。第二个挑战出现了，因为制造业越来越多地外包给外部代工厂。验证制造商没有插入任何危及最终产品安全性的恶意软件或“木马”电路是至关重要的。提出的研究通过对集成电路背面红外发射的详细算法分析，为这两个挑战提供了一个统一的框架。我们提出了将红外发射转换为精确的时空功率估计的技术，并利用功率和红外指纹。为了验证芯片不包含制造商在设计者不知情的情况下插入的额外电路，这可能会导致安全漏洞。该项目的成功完成将导致改进的功率建模和表征工具，并增加对制造芯片中没有添加恶意软件的信心。该项目还将导致设计原型和大量有价值的数据和基准，这些数据和基准将通过nsf资助的Trust-Hub和其他基于网络的门户网站公开传播。这些方法和工具将在工业界、政府和学术界得到广泛的应用。它们还将通过增加电池寿命和提高系统的可靠性和完整性来影响日常生活。教育计划包括本科生的研究经历、课程开发、材料与研究生课程的整合以及在教育中强调创业精神。将有针对性地招收和发展代表性不足的学生群体。