EAGER: Understanding and Developing A Supercritical Fluid Process for Recycling of Printed Circuit Boards

0962533Dai这个探索性项目建议为开发回收印刷电路板的超临界流体(SCF)工艺奠定基本基础。首先，系统地研究了超临界流体工艺条件下印制电路板键合材料的分层/降解机理。假设这些结果将为创造在低温和压力下回收印刷电路板的超临界流体工艺提供基础。如果这一假设得到证实，将有可能改变废弃印刷电路板的处理方式，使其成分能够回收利用。该项目为印刷电路板的回收提供了一个突破性的机会。与传统冶金技术相比，建议的超临界流体工艺潜在地具有重要的优势，预计将对环境无害，并节省成本和能源。此外，课堂教学将通过纳入该项目的超临界流体的实际应用而得到加强。计划与行业合作伙伴进行合作。

0962533DaiThis exploratory project proposes to establish the fundamental basis for developing a supercritical fluid (SCF) process for recycling printed circuit boards. First, the delamination/degradation mechanism of the bonding materials in printed circuit boards under supercritical fluid process conditions will be systematically investigated. The hypothesis is that these results will provide a basis for creating a supercritical fluid process to recycle printed circuit boards at low temperatures and pressures. If this hypothesis is proven out, there will be potential to transform the handling of discarded printed circuit boards, enabling the recycle of their make-up. The project offers a breakthrough opportunity for the recycling of printed circuit boards. The proposed SCF process potentially has important advantages compared to traditional metallurgical technologies and is anticipated to be environmentally benign as well as cost and energy saving. Additionally, classroom teaching will be enhanced by incorporating practical applications of SCF from the project. Collaborations with industrial partners are planned.