CSR: Small: Collaborative Research: Application-Aware Many-Core Virtualization for Real-Time Embedded Computing

CSR：小型：协作研究：实时嵌入式计算的应用感知众核虚拟化

• 批准号: 1018731
• 负责人: Shangping Ren
• 金额: $ 29.98万
• 依托单位: Illinois Institute of Technology
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2010
• 资助国家: 美国
• 起止时间: 2010-08-01 至 2015-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1018731&HistoricalAwards=false
• 关键词: CSR; Small; Collaborative; Research; Application

Continued advancements in semiconductor technology make it possible to integrate hundreds of processing cores into one silicon die. However, as the transistor size continues to shrink, increasing manufacturing defects have resulted in severe yield loss and made chip products? profit to drop substantially. Process variations also cause the performance and power characteristics differ significantly from chip to chip. In addition, this non-determinism greatly exacerbates the complexity of developing, validating, and maintaining software built upon these chips, especially for mission-critical real-time embedded applications. This project explores the hypothesis that architectural virtualization is an effective strategy and will be the norm to address extensive process variations and manufacturing defect problems on many-core platforms. This collaborative research effort seeks to develop effective methods and techniques to virtualize hardware resources on many-core platform and thus isolate the underlying hardware non-determinisms without changing the operating system and application software.This project seeks to improve the robustness and reliability of software and systems developed on many-core platforms. Techniques developed in the research may also help to address the component upgrade and obsolescence issue, which has been challenging military and avionics industry for decades. The collaborations between PIs and their international collaborators provide a unique opportunity to build an international research and educational collaboration structure, to share research expertise, to enhance the educational opportunity, and to promote cultural exchange. In addition, this project provides opportunity to nurture, encourage and attract students from under-represented groups to engage in this exciting research.

半导体技术的不断进步使得将数百个处理核心集成到一个硅芯片中成为可能。然而，随着晶体管尺寸的不断缩小，制造缺陷的增加导致了严重的良率损失，并使芯片产品？利润大幅下降。工艺变化也会导致芯片之间的性能和功率特性显著不同。此外，这种非确定性大大加剧了开发、验证和维护构建在这些芯片上的软件的复杂性，特别是对于任务关键型实时嵌入式应用。该项目探讨了架构虚拟化是一种有效策略的假设，并将成为解决众核平台上广泛的过程变化和制造缺陷问题的规范。这项合作研究旨在发展有效的方法和技术，在众核平台上虚拟化硬件资源，从而在不改变操作系统和应用软件的情况下隔离底层硬件的不确定性，提高在众核平台上开发的软件和系统的健壮性和可靠性。研究中开发的技术也可能有助于解决几十年来一直挑战军事和航空电子工业的部件升级和过时问题。PI及其国际合作者之间的合作提供了一个独特的机会，以建立一个国际研究和教育合作结构，分享研究专业知识，提高教育机会，并促进文化交流。此外，该项目提供了机会，培养，鼓励和吸引来自代表性不足的群体的学生从事这项令人兴奋的研究。