EAGER: Electrochemical Underpotential Co-deposition of Alloys: A Novel Manufacturing Technology

EAGER：合金的电化学欠电位共沉积：一种新颖的制造技术

• 批准号: 1029915
• 负责人: Giovanni Zangari
• 金额: $ 10万
• 依托单位: University of Virginia Main Campus
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2010
• 资助国家: 美国
• 起止时间: 2010-05-01 至 2012-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1029915&HistoricalAwards=false
• 关键词: EAGER; Electrochemical; Underpotential; Co; deposition

EAGER ? Electrochemical underpotential co-deposition of alloys: a novel manufacturing technologyAbstractThis EArly-concept Grants for Exploratory Research (EAGER) grant provides funding for the development of a novel electrochemical film deposition process for metallic alloys, of potential use in the manufacturing of microelectronic, microsensors and information storage devices. This process exploits the energy of formation of the alloy to induce the deposition of the more reactive element under conditions where deposition of the pure element would otherwise not occur. At low deposition rates, i.e. in the thermodynamic limit, the deposition process will be dominated by the alloy energetics, making it insensitive to the reactor geometry and enhancing uniformity. This work will focus on the synthesis of platinum based binary and ternary alloys with the objective to demonstrate the viability of the process for manufacturing purposes, as well as to produce novel materials for information storage. Manufacturing issues to be explored include composition and thickness uniformity in blanket films and lithographic patterns and limits in the achievable deposition rates. Finally, the possibility to produce ordered structures and alloys including highly reactive elements will be investigated.If successful, this research will validate the proposed deposition method as a viable manufacturing process. In particular, this work will determine the relative importance of thermodynamic predictions and growth rate in controlling alloy composition and uniformity, establishing optimal processing variables to achieve the required material properties in a predetermined device geometry. Additionally, novel materials could be manufactured by electrochemical methods, widening the materials palette available for microfabrication processes. This will lead in turn to innovation in electrodeposition practice, and will pave the way to a variety of novel device designs and functionalities.

渴望？电化学欠电位共沉积合金：一种新的制造技术摘要这早期概念的探索性研究赠款（EAGER）赠款提供资金，用于开发一种新的电化学薄膜沉积工艺的金属合金，在微电子，微传感器和信息存储设备的制造中的潜在用途。该工艺利用合金形成的能量，在纯元素沉积不会发生的条件下，诱导反应性更强的元素沉积。在低沉积速率下，即在热力学极限下，沉积过程将由合金能量学支配，使其对反应器几何形状不敏感并提高均匀性。这项工作将集中在铂基二元和三元合金的合成，目的是证明该工艺用于制造目的的可行性，以及生产用于信息存储的新型材料。要探讨的制造问题包括毯式薄膜和光刻图案的成分和厚度均匀性以及可实现的沉积速率的限制。最后，将研究生产有序结构和包含高活性元素的合金的可能性。如果成功，这项研究将验证所提出的沉积方法作为一种可行的制造工艺。特别是，这项工作将确定在控制合金成分和均匀性的热力学预测和生长速率的相对重要性，建立最佳的工艺变量，以实现所需的材料性能在预定的设备几何形状。此外，新型材料可以通过电化学方法制造，从而拓宽了可用于微细加工工艺的材料选择范围。这将反过来导致电沉积实践的创新，并将为各种新颖的器件设计和功能铺平道路。