Nanomechanical Material Size Effects Using an In-Situ, On-Chip Test Platform

使用现场、片上测试平台的纳米机械材料尺寸效应在设计和制造可靠的纳米级器件时，精确测量小尺度的材料强度至关重要。许多纳米材料的强度的统计表示需要在实用的平台上执行大量高精度、可重复的强度测试。该项目的目标不仅是实现大量准确的小规模强度测量，而且还促进对样品尺寸的纳米级与尺寸相关的强度效应的理解。为了实现这一目标，我们将扩展芯片微/纳米级测试平台的功能，使其能够快速测试各种材料的大量样品，并具有原位扫描电子显微镜(SEM)观察的能力。这将是一个由卡内基梅隆大学(CMU)牵头，与桑迪亚国家实验室(SNL)和国家标准与技术研究所(NIST)合作的合作项目。该项目将建立在CMU和SNL目前的研究基础上，并得到Sandia的支持，用于初步测试平台的开发。此外，该项目还将利用位于阿尔伯克基桑迪亚的独特制造设施。PI将与NIST研究人员合作，后者正在开发互补的测试方法和独特的局部应变测量技术。这项研究的学术价值在于它对纳米尺度尺寸效应的独特研究，这将量化并提供对尺寸依赖强度的基本理解。结合NIST提供的原位扫描电子显微镜观察和应力映射技术，拟议的研究将以迄今尚未实现的方式探索纳米材料强度的本质。它还将首次为设计微/纳米级部件提供一个基本基础，充分利用材料强度的统计性质。拟议研究的最大更广泛的影响将是开发和应用一个精确校准的测试平台，用于现场观察和测试可以以薄膜形式沉积在多晶硅上的几乎任何材料的大量样品。尽管进行了大量的研究工作，但微米/纳米级拉伸测试技术尚未开发出能够对大量样品进行高精度测试的技术。这将是微电子机械系统(MEMS)和微/纳米材料测试领域的突破，影响新的微/纳米产品的开发。

Nanomechanical Material Size Effects Using an In-Situ, On-Chip Test PlatformAccurate measurement of material strength at small scales is of critical importance in the design and manufacture of reliable nano-scale devices. Statistical representations of strength for many nano-scale materials require large numbers of high-precision, repeatable strength tests executed on a platform that is practical to use. The objective of this project is to not only allow large numbers of accurate small-scale strength measurements, but to also advance the understanding of size-related strength effects in specimen sizes down to the nanoscale. To achieve this goal, we will extend the capabilities of an on-chip micro/nanoscale testing platform, allowing the rapid testing of large numbers of specimens of a variety of materials with the capability of in-situ scanning electron microscope (SEM) observation. This will be a collaborative project led by Carnegie Mellon University (CMU), partnering with Sandia National Laboratories (SNL) and the National Institute of Standards and Technology (NIST). This project will build upon current research at CMU and SNL, supported by Sandia, for initial test platform development. Furthermore, this project will leverage access to unique fabrication facilities located at Sandia, Albuquerque. The PIs will collaborate with NIST researchers who are developing complementary testing approaches and unique localized strain measurement techniques. The intellectual merit of this research lies in its unique study of nanoscale size effects, which will quantify and provide a fundamental understanding of size-dependent strengths. Coupled with in-situ SEM observation and stress mapping techniques available at NIST, the proposed research will explore the nature of nanoscale material strengths in a way that has not been achieved to date. It will also offer, for the first time, a fundamental basis for designing micro/nanoscale components, fully exploiting the statistical nature of material strengths. The greatest broader impact of the proposed research will be its development and application of a precision-calibrated testing platform for in-situ observation and testing of large numbers of specimens of nearly any material that can be deposited on polysilicon in thin film form. Despite being the subject of considerable research effort, micro/nanoscale tensile testing techniques have not been developed that allow the high-precision testing of large numbers of specimens. This will be a breakthrough in the microelectromechanical systems (MEMS) and micro/nanoscale materials testing communities, impacting the development of new micro/nano-scale products.