SBIR Phase I: Acoustic Slurry Monitor

SBIR 第一阶段：声学浆料监测仪

• 批准号: 1046659
• 负责人: Bingrong He
• 金额: $ 15万
• 依托单位: Uncopiers, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2011
• 资助国家: 美国
• 起止时间: 2011-01-01 至 2011-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1046659&HistoricalAwards=false
• 关键词: SBIR; Phase; Acoustic; Slurry; Monitor

This SBIR Phase-I project is to develop an acoustic CMP (Chemical Mechanical Polishing) slurry monitor?a fully in-line, real-time, point of use instrument that will detect and disperse any and all large agglomerates in the nanofine slurries used in IC manufacture. Left unchecked, these errant slurry particles/ agglomerates can "kill" (deeply scratch) a semiconductor wafer as it undergoes chemical mechanical planarizing or polishing. CMP has become the method of choice for restoring the surface trueness of wafers at all stages of IC manufacture. This acoustic slurry monitor makes use of a novel technology?Acoustic Coaxing Induced Microcavitation (ACIM), a means of constructively controlling acoustic microcavitation. It does so by facilitating controlled bubble nucleation preferentially on the large particle, in the midst of dense nano-fine slurry. This research is thus aimed at investigating a new principle of bubble nucleation. In operation the slurry monitor will inspect a 100ml of the slurry charge at final dispense point just before the slurry is fed to the polishing pad. It will complete the detection for large particles in fully dense CMP slurry in one minute. This slurry monitor can be mounted on the existing CMP tools. The broader impact/commercial potential of this project are to enable improved yields in semiconductor manufacturing by making CMP processing scratch free. No method currently exists that can implement a CMP-safe slurry at the point of use. An advanced device wafer scratched at the final stages of manufacture is a direct loss of $250k or more. Use of the Acoustic Slurry Monitor protects wafers and more than returns the $100k investment with the very first wafer it saves. The Slurry Monitor is a yield protecting tool reliably improving CMP performance. Ultimately, the principle of constructively controlled microcavitation, ACIM particle detection, relies on controlling the very fundamental process of phase change, the control of nucleation?the ability to convert a liquid into a gas in the vicinity of a solid phase. The study of this acoustically mediated nucleation control could form an active field/area of research and education. ACIM will be widely applicable in a variety of liquid-chemical processing, e.g. control of boiling processes in chemical and nuclear reactors, sonochemical synthesis, and bio-technology. This small business is a minority and woman-owned company that relies on diversity?ethnic, gender and age?for robust performance that is dedicated to training young researchers.

这个SBIR第一阶段的项目是开发一个声学CMP（化学机械抛光）浆料监测？这是一种完全在线的实时使用点仪器，可检测和分散IC制造中使用的纳米浆料中的任何和所有大团聚体。 如果不加以控制，这些错误的浆料颗粒/附聚物会在半导体晶片经历化学机械平坦化或抛光时“杀死”（深深地划伤）半导体晶片。 CMP已成为在IC制造的所有阶段恢复晶片表面真实性的首选方法。这种声波泥浆监测器采用了一种新技术？声诱导微空化（Acoustic Coaxing Induced Microcavitation，ACIM）是一种结构性控制声微空化的方法。 它通过促进在致密的纳米细浆料中优先在大颗粒上的受控气泡成核来实现。 因此，本研究旨在探讨一种新的气泡成核原理。在操作中，浆料监测器将在浆料被供给到抛光垫之前在最终分配点检查100 ml的浆料装料。 该系统可在1分钟内完成对全致密CMP浆料中大颗粒的检测。 该抛光液监控器可以安装在现有的CMP工具上。 该项目更广泛的影响/商业潜力是通过使CMP加工无划痕来提高半导体制造的产量。目前不存在可以在使用点实现CMP安全浆料的方法。在制造的最后阶段，一个先进的器件晶片被划伤，直接损失将达到25万美元或更多。 使用声波泥浆监测器可保护晶圆，并通过节省的第一个晶圆获得超过10万美元的投资回报。浆料监控器是一种良率保护工具，可可靠地提高CMP性能。最终，建设性控制微空蚀的原理，ACIM颗粒检测，依赖于控制非常基本的相变过程，即成核的控制？在固相附近将液体转化为气体的能力。这种声学介导的成核控制的研究可以形成研究和教育的活跃领域/区域。ACIM将广泛应用于各种液体化学处理，例如化学和核反应堆中的沸腾过程的控制，声化学合成和生物技术。这家小企业是一家依靠多样性的少数民族和女性所有的公司？种族、性别和年龄？致力于培养年轻研究人员的强大性能。