SBIR Phase I: Integrated Thermal Scanning Probe Development

SBIR 第一阶段：集成热扫描探头开发

• 批准号: 1113523
• 负责人: Ami Chand
• 金额: $ 14.97万
• 依托单位: Applied Nanostructures, inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2011
• 资助国家: 美国
• 起止时间: 2011-07-01 至 2011-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1113523&HistoricalAwards=false
• 关键词: SBIR; Phase; Integrated; Thermal; Scanning

This Small Business Innovation Research Phase I project will develop high resolution thermal probes with sharp tips, integrated with highly sensitive thermal sensing elements that are capable of achieving very high lateral thermal resolution ( 20 nm) for scanning thermal microscopy. These tips will be used in various applications, such as mapping thermal effects on recording heads, for applications involving recording technologies which utilize integrated laser pulsing, and for thermal mapping of small soft and/or self-assembled structures. Thermal mapping with 20 nm resolution will create paradigm shifts in mapping molecular self-assembly and soft materials. The core intellectual merits include the creation of thermal sensor nanofabrication processes using scalable semiconductor processing techniques to minimize the cost of manufacturing and ensure repeatability and reproducibility. The probe will be designed to maximize the heat flow from the sample to the sharp probe and to minimize the background heat flow from the sample to the cantilever to achieve high spatial resolution. The position, size, and material of the sensing element will be designed to achieve high sensitivity.The broader impact/commercial potential of this project will be a new suite of products which will replace current thermal probe solutions and significantly increase the market potential of nano-thermal products. These new products will have significant impacts in industries such as semiconductors and magnetic recording, and will impact the emerging field of nanotechnology. The innovation will significantly help generate new research and applications in areas that are not currently being addressed. New efforts to integrate nanoelectronics with biomolecular self-assembled structures will be aided by the ability to map thermal conductivity and temperature with high resolution. Moreover, the measurement of thermal properties with high spatial resolution and sensitivity is a significant challenge but increasingly needed for process monitoring, material characterization, and failure analysis in the semiconductor and data storage industries, as well as for scientific research in nanotechnology.

这个小型企业创新研究第一阶段项目将开发尖端锋利的高分辨率热探头，与能够为扫描热显微镜实现非常高的横向热分辨率(20 Nm)的高灵敏度热传感元件集成在一起。这些尖端将用于各种应用中，例如映射记录头上的热效应，用于涉及利用集成激光脉冲的记录技术的应用，以及用于小型软和/或自组装结构的热映射。具有20纳米分辨率的热映射将在映射分子、自组装和软材料方面产生范式转变。核心智能优势包括使用可扩展的半导体加工技术创建热传感器纳米制造工艺，以最大限度地降低制造成本，并确保重复性和再现性。探头的设计将最大化从样品到尖锐探头的热流，并最大限度地减少从样品到悬臂的背景热流，以实现高空间分辨率。传感元件的位置、尺寸和材料将被设计成实现高灵敏度。该项目更广泛的影响/商业潜力将是一套新的产品，它将取代目前的热探头解决方案，并显著增加纳米热产品的市场潜力。这些新产品将对半导体和磁记录等行业产生重大影响，并将冲击新兴的纳米技术领域。这项创新将极大地帮助在目前尚未解决的领域产生新的研究和应用。将纳米电子学与生物分子自组装结构相结合的新努力将得到以高分辨率绘制热导率和温度图的能力的帮助。此外，高空间分辨率和高灵敏度的热性能测量是一个巨大的挑战，但在半导体和数据存储行业的过程监控、材料表征和失效分析以及纳米技术的科学研究中越来越需要。