MRI: Acquisition of Precision Wafer Aligner and Bonder for Research, Education, and Training in 3-D Micro- and Nano- Mechanical, Electrical and Optical Systems

MRI：采购精密晶圆对准器和键合机，用于 3D 微纳米机械、电气和光学系统的研究、教育和培训

• 批准号: 1126077
• 负责人: Kevin Turner
• 金额: $ 40万
• 依托单位: University of Pennsylvania
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2011
• 资助国家: 美国
• 起止时间: 2011-09-01 至 2013-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1126077&HistoricalAwards=false
• 关键词: MRI; Acquisition; Precision; Wafer; Aligner

This Major Research Instrumentation (MRI) grant supports the acquisition of a wafer aligner and bonder system that will be placed in a shared user nanofabrication facility at the University of Pennsylvania. Aligned wafer bonding technology provides the ability to precisely stack and join multiple semiconductor substrates to realize new types of micro- and nano-devices. The technology significantly expands the capability of traditional microfabrication processes based on lithography, deposition, and etching by allowing wafers of various materials and thicknesses that are either patterned or unpatterned to be bonded together. As a result, the technology enables the fabrication of 3D microelectromechanical systems (MEMS), microfluidic platforms, and 3D integrated circuits and optical devices. The wafer bonding system will allow for the precise lateral alignment and bonding of large diameter substrates using several important processes, including direct, anodic, glass-frit, metal, and polymer bonding. The acquisition of the wafer aligner and bonder will enhance research capability in multiple areas, including micromechanical devices, small-scale fluidic systems, and the manufacturing of nanoelectronic and optical systems. This wafer aligner and bonder system will broadly impact both the research and training of a diverse body of students and researchers. Tools in the nanofabrication facility can be accessed by users from the University of Pennsylvania as well as users from other academic institutions, of which there are many in the surrounding region, and users from industry. Furthermore, the fabrication facility is used by undergraduate students in their senior projects and in their undergraduate research, as well as graduate students and postdocs from many different academic departments, many of whom will make use of the requested instrumentation. Thus, the tool will provide access to enhanced micro- and nano-manufacturing capability for a broad range of users developing leading edge small-scale devices.

这项主要研究仪器（MRI）资助支持收购晶圆对准器和焊接机系统，该系统将放置在宾夕法尼亚大学的共享用户纳米制造设施中。 对准晶片键合技术提供了精确堆叠和连接多个半导体衬底的能力，以实现新型的微型和纳米器件。 该技术通过允许将各种材料和厚度的图案化或未图案化的晶片结合在一起，显著扩展了基于光刻、沉积和蚀刻的传统微制造工艺的能力。 因此，该技术能够制造3D微机电系统（MEMS），微流体平台，3D集成电路和光学器件。 晶圆键合系统将允许使用几种重要工艺对大直径基板进行精确的横向对准和键合，包括直接、阳极、玻璃料、金属和聚合物键合。 收购晶圆对准器和键合机将增强多个领域的研究能力，包括微机械器件、小规模流体系统以及纳米电子和光学系统的制造。 这种晶圆对准器和焊接机系统将广泛影响学生和研究人员的研究和培训。来自宾夕法尼亚大学的用户以及来自其他学术机构的用户可以访问纳米实验室设施中的工具，其中有许多在周边地区，以及来自行业的用户。 此外，制造设施被本科生用于他们的高级项目和本科研究，以及来自许多不同学术部门的研究生和博士后，其中许多人将使用所要求的仪器。 因此，该工具将为开发领先的小型设备的广泛用户提供增强的微米和纳米制造能力。