MRI: Acquisition of Precision Wafer Aligner and Bonder for Research, Education, and Training in 3-D Micro- and Nano- Mechanical, Electrical and Optical Systems

MRI：采购精密晶圆对准器和键合机，用于 3D 微纳米机械、电气和光学系统的研究、教育和培训

• 批准号: 1126077
• 负责人: Kevin Turner
• 金额: $ 40万
• 依托单位: University of Pennsylvania
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2011
• 资助国家: 美国
• 起止时间: 2011-09-01 至 2013-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1126077&HistoricalAwards=false
• 关键词: MRI; Acquisition; Precision; Wafer; Aligner

This Major Research Instrumentation (MRI) grant supports the acquisition of a wafer aligner and bonder system that will be placed in a shared user nanofabrication facility at the University of Pennsylvania. Aligned wafer bonding technology provides the ability to precisely stack and join multiple semiconductor substrates to realize new types of micro- and nano-devices. The technology significantly expands the capability of traditional microfabrication processes based on lithography, deposition, and etching by allowing wafers of various materials and thicknesses that are either patterned or unpatterned to be bonded together. As a result, the technology enables the fabrication of 3D microelectromechanical systems (MEMS), microfluidic platforms, and 3D integrated circuits and optical devices. The wafer bonding system will allow for the precise lateral alignment and bonding of large diameter substrates using several important processes, including direct, anodic, glass-frit, metal, and polymer bonding. The acquisition of the wafer aligner and bonder will enhance research capability in multiple areas, including micromechanical devices, small-scale fluidic systems, and the manufacturing of nanoelectronic and optical systems. This wafer aligner and bonder system will broadly impact both the research and training of a diverse body of students and researchers. Tools in the nanofabrication facility can be accessed by users from the University of Pennsylvania as well as users from other academic institutions, of which there are many in the surrounding region, and users from industry. Furthermore, the fabrication facility is used by undergraduate students in their senior projects and in their undergraduate research, as well as graduate students and postdocs from many different academic departments, many of whom will make use of the requested instrumentation. Thus, the tool will provide access to enhanced micro- and nano-manufacturing capability for a broad range of users developing leading edge small-scale devices.

这项主要的研究工具（MRI）赠款支持将收购晶圆对准器和粘液系统，该系统将放置在宾夕法尼亚大学的共享用户纳米制造设施中。 对齐的晶圆键合技术提供了精确堆叠并加入多个半导体底物以实现新型的微型和纳米驱动器的能力。 该技术通过允许各种材料和厚度的晶片将具有图案图案或不公平的各种材料和厚度的晶片结合在一起，从而显着扩展了基于光刻，沉积和蚀刻的传统微加工过程的能力。 结果，该技术可以制造3D微电动系统（MEMS），微流体平台以及3D集成电路和光学设备。 晶圆键合系统将使用多个重要过程，包括直接，阳极，玻璃，金属和聚合物键合，可以确切的横向对齐和键合大直径底物。 获取晶圆对准器和Bonder将增强多个领域的研究能力，包括微机械设备，小规模的流体系统以及纳米电子和光学系统的制造。 这种晶圆的对准器和螺旋体系统将广泛影响各种​​学生和研究人员的研究和培训。宾夕法尼亚大学的用户以及其他学术机构的用户可以访问纳米制造设施中的工具，其周围地区有许多和行业的用户。 此外，本科生在高级项目和本科研究中以及来自许多不同学术部门的研究生和博士后都使用了制造设施，其中许多人将利用所请求的仪器。 因此，该工具将为开发领先的小规模设备的广泛用户提供对增强的微型和纳米制造能力的访问。