Collaborative Research: Understanding and Optimizing A Supercritical Fluid Process for Recycling of Printed Circuit Boards

合作研究:了解和优化印刷电路板回收的超临界流体工艺

基本信息

  • 批准号:
    1133984
  • 负责人:
  • 金额:
    $ 9.97万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Continuing Grant
  • 财政年份:
    2011
  • 资助国家:
    美国
  • 起止时间:
    2011-09-01 至 2015-08-31
  • 项目状态:
    已结题

项目摘要

1133984 (Zhang). Widespread use of electronic equipment and shortening of product life cycles have created the challenging task of dealing with the ever-increasing quantity of obsolete electronic equipment. The huge amount of electronic waste (E-waste) generated each year and the lack of established methodologies capable of handling the increasing volumes of E-waste pose a severe environmental threat. Among the challenges to successful electronic equipment recycling, printed circuit board (PCB, primary components in every type of electronic product) recycling is recognized as one of the most difficult problems because of the complex construction and complicated materials composition of PCBs. The current PCB recycling industry uses traditional metallurgical technologies in which the fiber reinforced polymer matrix materials are incinerated. Although great effort has been made in the traditional metallurgical technologies for increasing the recycling efficiency for the end-of-life electronic products, the PCB recycling industry still faces the problems of poor environmental performance and limited economic returns. Recently, under an EAGER grant, the PIs of this award demonstrated proof-of-concept preliminary work for developing a novel supercritical fluid (SCF) CO2-based PCB recycling process at relatively low/medium temperatures and pressures. The exploratory experiments demonstrated that PCBs are delaminated with metals and glass fiber maintain their original form, making it possible to increase recovery rates not only for precious metals but also for non-metal materials. Such a process opens a new dimension for recycling of PCB and provides the possibility of satisfying economical and environmental demands. In the current project, the research team will systematically investigate the delamination mechanism of the bonding materials in PCBs under supercritical fluid processes and seek to understand structure/process relationships. Although literature documents the application of supercritical fluids in polymer synthesis and processing, there is limited existing work on revealing the performance of polymeric materials in supercritical fluids. In addition, the research team will optimize the SCF process by implementing process conditions based on the mechanism study and systematically evaluate process performance. Finally, the team will model and validate the recycling process for scale-up in terms of cost, energy, and environmental impact. The team will collaborate with industrial collaborators to promote transferring fundamental research to practical application. In addition, research and education will be integrated throughout the entire project duration.
1133984(张)。电子设备的广泛使用和产品寿命周期的缩短,使处理数量不断增加的过时电子设备成为一项具有挑战性的任务。每年产生的大量电子废物以及缺乏能够处理日益增加的电子废物的既定方法构成了严重的环境威胁。在成功回收电子设备所面临的挑战中,印刷电路板(PCB,每种电子产品的主要部件)的回收被认为是最困难的问题之一,因为PCB的结构和材料组成复杂。目前的PCB回收行业使用传统的冶金技术,其中纤维增强聚合物基质材料被焚烧。虽然传统的冶金技术在提高废旧电子产品的回收利用率方面做出了很大努力,但PCB回收行业仍然面临着环境效益差和经济效益有限的问题。 最近,在EAGER的资助下,该奖项的PI展示了在相对低/中等温度和压力下开发新型超临界流体(SCF)CO2基PCB回收工艺的概念验证初步工作。探索性实验表明,多氯联苯与金属分层,玻璃纤维保持其原始形态,因此不仅可以提高贵金属的回收率,还可以提高非金属材料的回收率。这一过程为多氯联苯的再循环开辟了一个新的领域,并提供了满足经济和环境要求的可能性。在目前的项目中,研究小组将系统地研究超临界流体工艺下PCB中键合材料的分层机制,并寻求理解结构/工艺关系。尽管文献记载了超临界流体在聚合物合成和加工中的应用,但是在揭示聚合物材料在超临界流体中的性能方面存在有限的现有工作。此外,研究小组将通过实施基于机理研究的工艺条件来优化SCF工艺,并系统地评估工艺性能。最后,该团队将对回收过程进行建模和验证,以便在成本、能源和环境影响方面扩大规模。 该团队将与工业合作者合作,促进基础研究向实际应用的转移。此外,研究和教育将贯穿整个项目期间。

项目成果

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Hong-Chao Zhang其他文献

Clinically approved small-molecule drugs for the treatment of rheumatoid arthritis
用于治疗类风湿关节炎的临床批准的小分子药物
  • DOI:
    10.1016/j.ejmech.2023.115434
  • 发表时间:
    2023-08-05
  • 期刊:
  • 影响因子:
    5.900
  • 作者:
    Jian-Hui Zhao;Shuai Ma;Chao-Yuan Li;Hong-Chao Zhang;Li-Jie Zhao;Zi-Yan Zhang
  • 通讯作者:
    Zi-Yan Zhang
Investigation of a multiple trigger active disassembly element
  • DOI:
    10.1016/j.cirp.2012.03.109
  • 发表时间:
    2012-01-01
  • 期刊:
  • 影响因子:
  • 作者:
    Hong-Chao Zhang;John Carrell;Shiren Wang;Derrick Tate;Senay Imam
  • 通讯作者:
    Senay Imam
Experimental study on opto-acoustic nonlinear frequency-mixing technique with separated basic temperature
  • DOI:
    10.1016/j.ultras.2024.107331
  • 发表时间:
    2024-07-01
  • 期刊:
  • 影响因子:
  • 作者:
    Chen-Yin Ni;Ling Yuan;Yi-Fei Zhang;Kai-Ning Ying;Zhong-Hua Shen;Hong-Chao Zhang
  • 通讯作者:
    Hong-Chao Zhang
Catalyst-and additive-free [3+3] cyclization-aromatization of β,γ-dioxobutanoate with amines for synthesis of p-aminophenols
  • DOI:
  • 发表时间:
    2022
  • 期刊:
  • 影响因子:
  • 作者:
    Hang Qian;Cui-Cui Wang;Zi-Chen Shen;Ming-Xue Sun;Hong-Chao Zhang;Shiming Fan;Juan Feng;Shouxin Liu;Zhi-Wei Zhang
  • 通讯作者:
    Zhi-Wei Zhang
Catalyst- and additive-free [3 + 3] cyclization–aromatization of β,γ-dioxobutanoate with amines for synthesis of emp/em-aminophenols
β,γ-二氧代丁酸酯与胺的无催化剂和添加剂的[3 + 3]环化-芳构化用于合成恩帕/恩美-氨基酚
  • DOI:
    10.1039/d2gc03936b
  • 发表时间:
    2022-01-01
  • 期刊:
  • 影响因子:
    9.200
  • 作者:
    Hang Qian;Cui-Cui Wang;Zi-Chen Shen;Ming-Xue Sun;Hong-Chao Zhang;Shiming Fan;Juan Feng;Shouxin Liu;Zhi-Wei Zhang
  • 通讯作者:
    Zhi-Wei Zhang

Hong-Chao Zhang的其他文献

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{{ truncateString('Hong-Chao Zhang', 18)}}的其他基金

GOALI: Modeling and Optimization of a Responsive Reverse Logistics Channel for Electronic Products
GOALI:电子产品响应式逆向物流渠道的建模和优化
  • 批准号:
    0423465
  • 财政年份:
    2004
  • 资助金额:
    $ 9.97万
  • 项目类别:
    Standard Grant
PREMISE: Exploratory Research: An Alternative Process Model for Printed Circuit Board Recycling
前提:探索性研究:印刷电路板回收的替代工艺模型
  • 批准号:
    0225927
  • 财政年份:
    2002
  • 资助金额:
    $ 9.97万
  • 项目类别:
    Standard Grant
Tolerance Graph for Tolerance Control in Process Planning
工艺规划中公差控制的公差图
  • 批准号:
    9714029
  • 财政年份:
    1997
  • 资助金额:
    $ 9.97万
  • 项目类别:
    Standard Grant
Research Initiation: A Test Bed of Integrated Process Planning Systems
研究启动:集成流程规划系统的试验台
  • 批准号:
    9211657
  • 财政年份:
    1992
  • 资助金额:
    $ 9.97万
  • 项目类别:
    Continuing Grant

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