EAGER/Collaborative Research: Exploratory Study of Nano Ultrasonic Machining Process

EAGER/合作研究：纳米超声波加工工艺的探索性研究

• 批准号: 1137968
• 负责人: Murali Sundaram
• 金额: $ 5万
• 依托单位: University of Cincinnati Main Campus
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2011
• 资助国家: 美国
• 起止时间: 2011-08-15 至 2013-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1137968&HistoricalAwards=false
• 关键词: EAGER; Collaborative; Research; Exploratory; Study

Collaborative research: EAGER: Exploratory Study of Nano Ultrasonic Machining ProcessAbstract. This collaborative research work will study the feasibility of vibration assisted target specific nanoscale machining of brittle material. The goal of the research is to generate fundamental knowledge of nano ultrasonic machining process by conducting rigorous analytical and experimental investigations to understand the mechanism of material removal, the range of machinable feature sizes, effect of machining parameters on the productivity of the machined feature, and the uncertainty and sustainability of the nano ultrasonic machining process. A commercial atomic force microscope (AFM) will be used in this exploratory research as an experimental platform to perform ultrasonic nano abrasive machining, as well as nano measurement. The scope of the research includes a process model formulation to predict the material removal, based on appropriate set of process parameters. The scientific barriers such as lack of knowledge base of ductile and brittle mode erosion at nano scale models, and technical barriers such as behavior of abrasive powder at ultrasonic frequency and nanoscale, form the main risks of this study. However, if successful, this project will lead to a new and very effective process for the accurate nano scale machining of brittle materials used in electronic, medical, automotive and aviation industries.Success of this research is expected to have a transformative effect on the target specific nanomachinability of a wide variety of both conductive and nonconductive materials. Potential applications include high precision DNA detection devices, interconnects nano packaging, and low cost mask correction for electronics manufacturing. Results of this study may serve as prelude to abrasive based picofinishing technology. Outcome of this project will be synergized with our other nano machining activities to educate graduate and undergraduate students in manufacturing courses offered at University of Cincinnati and University of Nebraska-Lincoln. This experience will be used to nurture training and learning within underrepresented minorities and to augment the ongoing partnership with area school community. The results of this research will be disseminated through peer-reviewed publications, presentations and university?s websites, short courses at professional society meetings and reports to NSF.

合作研究：ENGER：纳米超声加工过程的探索性研究。这项合作研究工作将研究振动辅助靶特定纳米级加工脆性材料的可行性。这项研究的目的是通过严格的分析和实验研究来了解纳米超声加工过程的基础知识，以了解材料去除的机理、可加工特征尺寸的范围、加工参数对加工特征生产率的影响以及纳米超声加工过程的不确定性和可持续性。这项探索性研究将使用商用原子力显微镜(AFM)作为实验平台，进行超声纳米磨料加工以及纳米测量。研究的范围包括基于一组适当的工艺参数来预测材料去除的工艺模型公式。缺乏纳米尺度模型延性和脆性模式侵蚀的知识基础等科学障碍，以及磨料在超声频率和纳米尺度下的行为等技术障碍，构成了本研究的主要风险。然而，如果该项目成功，将为电子、医疗、汽车和航空工业中使用的脆性材料的精确纳米级加工带来一种新的非常有效的工艺。这项研究的成功有望对各种导电和非导电材料的靶标特定纳米加工能力产生革命性的影响。潜在的应用包括高精度DNA检测设备、互连纳米封装以及用于电子制造的低成本掩模校正。本研究结果可作为基于磨料的微细抛光技术的前奏。该项目的成果将与我们的其他纳米加工活动相结合，在辛辛那提大学和内布拉斯加-林肯大学提供的制造课程中教育研究生和本科生。这一经验将用于在代表性不足的少数群体中培养培训和学习，并加强与地区学校社区的持续伙伴关系。这项研究的结果将通过同行评议的出版物、演讲和大学S网站、专业学会会议上的短期课程和向国家科学基金会提交的报告来传播。