Collaborative Research: Monolithic on-chip resonant cavity isolators for photonic integrated circuits

本研究的目的是展示磁光隔离器在半导体衬底上的单片集成，并表征其性能。该方法是基于开发一种非互易谐振光学腔器件，使用单片生长的多晶铈钇铁石榴石作为磁光介质，和新的光敏硫系玻璃材料，用于强大的制造后微调。该研究将利用灰度处理技术和高阶Fano谐振腔架构来实现破纪录的器件性能。这项工作的智力价值是新材料和创新器件设计的结合。先前的片上隔离器在很大程度上依赖于磁光石榴石的晶片键合，传统上被认为与半导体上的单片集成不兼容。拟议的工作将联合收割机新的生长方法和材料与新的器件设计相结合，以同时实现单片集成、无源器件操作、大隔离比、最小插入损耗、小占地面积以及上级制造公差，从而解决了长期存在的问题，芯片光隔离。这项工作的更广泛影响包括其对光通信和光子信号领域的潜在变革性影响通过提供单片片上隔离的第一个实用解决方案，当光子芯片中的元件数量增加时，元件之间的寄生反射可能会使激光器和电路操作不稳定，从而严重危及电路功能。因此，随着光子集成水平的不断提高，对片上隔离的需求变得势在必行。科学研究将与研究生课程开发，本科生培训以及两个研究所K-12教室的实践模块开发紧密结合。

The objective of this research is to demonstrate monolithic integration of magneto-optical isolators on semiconductor substrates and to characterize their performance. The approach is based on developing a nonreciprocal resonant optical cavity device using monolithically grown polycrystalline cerium-yttrium-iron-garnet as the magneto-optical medium, and new photosensitive chalcogenide glass materials for robust post-fabrication trimming. The research will leverage gray-scale processing technologies and high-order Fano resonant cavity architectures to realize record-breaking device performance.The intellectual merit of this work is the combination of new materials and innovative device designs. Prior on-chip isolators have largely relied on wafer bonding of magneto-optical garnets, traditionally considered incompatible with monolithic integration on semiconductors. The proposed work will combine new growth methods and materials with new device designs to simultaneously achieve monolithic integration, passive device operation, large isolation ratio, minimal insertion loss, small footprint, as well as superior fabrication tolerance, thus resolving the standing challenge of efficient on-chip optical isolation.The broader impacts of this work include its potentially transformative impact on the field of optical communications and photonic signal processing by providing the first practical solution for monolithic on-chip isolation. When the number of components in a photonic chip increases, parasitic reflections between components can seriously jeopardize circuit functionalities by destabilizing laser and circuitry operation. The need for on-chip isolation therefore becomes imperative as the level of photonic integration continues to scale. The scientific research will be tightly integrated with graduate course development, undergraduate training, and development of hands-on modules for K-12 classrooms at both institutes.