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SBIR Phase I: Thermal Spray Fabrication of Anti-Ferroelectrics for ESD Protection

SBIR Phase I: Thermal Spray Fabrication of Anti-Ferroelectrics for ESD Protection
SBIR 第一阶段:用于 ESD 保护的反铁电体热喷涂制造
批准号:
1248825
负责人:
James Wobith
金额:
$15.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2013
资助国家:
美国
项目状态:
已结题
起止时间:
2013-01-01 至 2013-12-31

项目摘要

项目成果

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中文摘要
翻译
这个小企业创新研究第一阶段项目将展示使用新型激光辅助大气等离子体沉积平台制造用于静电放电(ESD)保护的反铁电(AFE)薄膜的可行性。对于日益紧凑和敏感的电子设备,最先进的ESD保护提供了不足的保护,牺牲了电路保护的信号带宽,限制了新应用的发展。将为AFE陶瓷开发可扩展的等离子喷涂制造工艺,该陶瓷先前已在实验室规模上被证明具有用于多层陶瓷电容器(MLCC)的无与伦比的电容变化。胶带铸造和其他传统制造方法已被证明不适合这种MLCC应用,而等离子喷涂制造技术已经成功地生产出具有类似性能的电池组件和功能涂层,预计它可以制造出大约5微米的薄膜,以实现开关场和电容的解耦,并制造出在低电压下耗散大量能量的MLCC。第一阶段SBIR项目的完成将对前驱体、沉积参数和组件规格产生技术上的理解,这些都是开发和扩展第二阶段制造工具所必需的,并将一项颠覆性技术引入数十亿美元的ESD市场。该项目的更广泛的影响/商业潜力是建立一种大规模生产mlcc的可扩展技术,该技术可以解决随着摩尔定律下组件尺寸不断减小而日益增加的ESD对电子产品的威胁。这种AFE材料制造/沉积创新将允许创建新的mlcc,从而在信号带宽和电路保护之间提供更好的权衡,从而在低电压下实现AFE开关。部署这种制造工具将使该团队成为汽车电子制造商在控制模块和其他电路系统上的mlcc的主要供应商。它还将使mlcc和组件的利基供应比目前可用的高电压、高能量密度和脉冲功率应用产品的效率高10-15倍,用于航空航天、国防和其他工业和军事应用。除了支持美国的技术领先地位和国内制造业的复苏之外,该项目还将增加对相关技术的技术理解,这些技术需要在私人资助的相关技术方面取得平行进展,例如用于高频,快速放电电力电子设备的AFE陶瓷电容器和固态薄膜电池。
英文摘要
This Small Business Innovation Research Phase I project will demonstrate the feasibility of fabricating anti-ferroelectric (AFE) thin-films for electrostatic discharge (ESD) protection using a novel laser-assisted atmospheric plasma deposition platform. The state-of-the-art in ESD protection offers inadequate protection to increasingly compact and sensitive electronic devices, trading off signal bandwidth for circuit protection and limiting the evolution of new applications. A scalable plasma spray fabrication process will be developed for an AFE ceramic which has previously been demonstrated at laboratory scale to have unmatched capacitance change for use in multi-layered ceramic capacitors (MLCC). Tape-casting and other conventional fabrication approaches have proven inadequate for this MLCC application whereas the plasma spray fabrication technology has already successfully produced battery components and functional coatings with similar properties, and it is anticipated that it can create the approximately five-micron films required for decoupling the switching field and capacitance and creating an MLCC that dissipates large energies at low voltages. Completion of this Phase I SBIR project will yield a technical understanding of the precursors, deposition parameters, and component specifications necessary to develop and scale a manufacturing tool in Phase II and introduce a disruptive technology into the multi-billion dollar ESD market.The broader impact/commercial potential of this project is the establishment of a scalable technique for the mass-manufacture of MLCCs which can address the increasing threat of ESD to electronics as component sizes continue to decrease under Moore's Law. This AFE material fabrication/deposition innovation will allow the creation of new MLCCs which offer an improved trade-off between signal bandwidth and circuit protection be achieving AFE switching at low voltages. Deployment of such a manufacturing tool will position the team as a key supplier to automotive electronics manufacturers for MLCCs on control modules and other circuit systems. It will also enable the niche supply of MLCCs and components that are 10-15 times more efficient than currently available products for high voltage, high energy density and pulse power applications for aerospace, defense, and other industrial and military applications. In addition to supporting U.S. technology leadership and the resurgence of domestic manufacturing, this project will increase the technical understanding required to make parallel, privately-funded advances in related technologies such as AFE ceramic capacitors for high frequency, fast discharge power electronics, and solid-state thin-film batteries.
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