SBIR Phase I: Thermal Spray Fabrication of Anti-Ferroelectrics for ESD Protection
SBIR Phase I: Thermal Spray Fabrication of Anti-Ferroelectrics for ESD Protection
批准号:
1248825
负责人:
James Wobith
金额:
$15.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2013
资助国家:
美国
项目状态:
已结题
起止时间:
2013-01-01 至 2013-12-31
中文摘要
这个小型企业创新研究第一阶段项目将展示使用新型激光辅助大气等离子体沉积平台制造用于静电放电(ESD)保护的反铁电(AFE)薄膜的可行性。最先进的ESD保护技术无法为日益紧凑和敏感的电子设备提供足够的保护,从而牺牲了信号带宽来实现电路保护,并限制了新应用的发展。一个可扩展的等离子体喷涂制造工艺将被开发用于AFE陶瓷,该陶瓷先前已在实验室规模上被证明具有用于多层陶瓷电容器(MLCC)的无与伦比的电容变化。流延和其他传统的制造方法已被证明不足以用于这种MLCC应用,而等离子体喷涂制造技术已经成功地生产了电池组件和具有类似特性的功能涂层,并且预计它可以产生约5微米的膜,所述膜是使开关场和电容去耦所需的,并且产生在低电压下耗散大能量的MLCC。 完成第一阶段SBIR项目将产生对前体,沉积参数,和组件规格,以便在第二阶段开发和扩展制造工具,并将颠覆性技术引入数十亿美元的ESD市场。该项目更广泛的影响/商业潜力是建立一种可扩展的技术,用于大规模生产,随着元件尺寸在摩尔定律下持续减小,MLCC的制造可以解决ESD对电子产品日益增长的威胁。 这种AFE材料制造/沉积创新将允许创建新的MLCC,这些MLCC提供信号带宽和电路保护之间的改进的权衡,以实现低电压下的AFE切换。 部署这样的制造工具将使该团队成为汽车电子制造商的控制模块和其他电路系统MLCC的主要供应商。它还将实现MLCC和组件的利基供应,这些组件的效率比目前可用的产品高10-15倍,适用于航空航天,国防和其他工业和军事应用的高电压,高能量密度和脉冲功率应用。 除了支持美国的技术领先地位和国内制造业的复苏外,该项目还将提高对相关技术的平行私人资助进步所需的技术理解,如用于高频的AFE陶瓷电容器,快速放电电力电子和固态薄膜电池。
英文摘要
This Small Business Innovation Research Phase I project will demonstrate the feasibility of fabricating anti-ferroelectric (AFE) thin-films for electrostatic discharge (ESD) protection using a novel laser-assisted atmospheric plasma deposition platform. The state-of-the-art in ESD protection offers inadequate protection to increasingly compact and sensitive electronic devices, trading off signal bandwidth for circuit protection and limiting the evolution of new applications. A scalable plasma spray fabrication process will be developed for an AFE ceramic which has previously been demonstrated at laboratory scale to have unmatched capacitance change for use in multi-layered ceramic capacitors (MLCC). Tape-casting and other conventional fabrication approaches have proven inadequate for this MLCC application whereas the plasma spray fabrication technology has already successfully produced battery components and functional coatings with similar properties, and it is anticipated that it can create the approximately five-micron films required for decoupling the switching field and capacitance and creating an MLCC that dissipates large energies at low voltages. Completion of this Phase I SBIR project will yield a technical understanding of the precursors, deposition parameters, and component specifications necessary to develop and scale a manufacturing tool in Phase II and introduce a disruptive technology into the multi-billion dollar ESD market.The broader impact/commercial potential of this project is the establishment of a scalable technique for the mass-manufacture of MLCCs which can address the increasing threat of ESD to electronics as component sizes continue to decrease under Moore's Law. This AFE material fabrication/deposition innovation will allow the creation of new MLCCs which offer an improved trade-off between signal bandwidth and circuit protection be achieving AFE switching at low voltages. Deployment of such a manufacturing tool will position the team as a key supplier to automotive electronics manufacturers for MLCCs on control modules and other circuit systems. It will also enable the niche supply of MLCCs and components that are 10-15 times more efficient than currently available products for high voltage, high energy density and pulse power applications for aerospace, defense, and other industrial and military applications. In addition to supporting U.S. technology leadership and the resurgence of domestic manufacturing, this project will increase the technical understanding required to make parallel, privately-funded advances in related technologies such as AFE ceramic capacitors for high frequency, fast discharge power electronics, and solid-state thin-film batteries.
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