SBIR Phase II: Ultrasoft Thermal Interface Elastomer for Microelectronics

SBIR 第二阶段：微电子用超软热界面弹性体

• 批准号: 2233069
• 负责人: Navid Kazem
• 金额: $ 85.87万
• 依托单位: Arieca Inc.
• 依托单位国家: 美国
• 项目类别: Cooperative Agreement
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-04-15 至 2025-03-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2233069&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Ultrasoft; Thermal

The broader/commercial impact of this Small Business Innovation Research (SBIR) Phase II project is in improving the efficiency and performance of electronic devices. Modern devices, including cell phones, laptops, and electric vehicles contain high-powered semiconductor components which generate unwanted heat that, in turn, reduces their efficiency. If left unchecked, this heat may destroy the devices and even injure users or cause damage to the environment. This project addresses excessing heating in electronic devices by introducing new high-performance thermal interface materials based upon embedding liquid metal droplets inside of stretchable polymers. These so-called liquid metal embedded elastomer (LMEE) materials can be applied to computer processors, graphics cards, advanced artificial intelligence (AI) chips, and even power modules in electric vehicles, to help keep electronic devices operating at peak performance at all times. The growing prevalence of the Internet of Things, 5G network infrastructure, and electric cars all necessitate better thermal solutions so that devices can function properly. This project could contribute to the semiconductor, automotive, and healthcare industries.This project’s goal is to develop and commercialize a thermal interface material (TIM) for packaged microelectronics, building upon the LMEE composite architecture. The technology will outperform existing TTIMs by combining the superior thermal resistance of metal-based solid TIMs (S-TIMs) with the mechanical reliability of polymer-based TIMs and the high-volume manufacturing compatibility of thermal greases. Specifically, LMEEs possess a unique combination of metal-like thermal resistance, rubber-like elasticity, and liquid emulsion-like rheology prior to curing, thereby solving two main challenges present with existing S-TIMs: (i) poor mechanical reliability over long durations and (ii) incompatibility with syringe-based dispensing for high volume manufacturing. The strategy proposed in this project is to synthesize an LMEE-based TIM that forms a robust bond between the surfaces of the semiconductor chip and surrounding enclosure, maintains a controlled thickness between the chip and enclosure, and ensures the necessary rheology for syringe-based dispensing. Specific project tasks build around a comprehensive technical plan that includes materials synthesis, performance characterization, and in-package evaluation. In parallel, the project will examine methods for storage, shipment, and dispensing to ensure a product that is ready for integrated device manufacturers and semiconductor assembly and testing industry by the end of this project.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这项小型企业创新研究（SBIR）II期项目的更广泛/商业影响在于提高电子设备的效率和性能。现代设备，包括手机，笔记本电脑和电动汽车，都包含高功率的半导体组件，从而产生不必要的热量，从而降低了它们的效率。如果不受组织的检查，这种热量可能会破坏设备，甚至伤害使用者或对环境造成损害。该项目通过引入基于嵌入液体金属液滴内部的可拉伸聚合物内的新型高性能热界面材料来解决电子设备中的加热。这些所谓的液体金属嵌入式弹性体（LMEE）材料可以应用于计算机处理器，图形卡，高级人工智能（AI）芯片，甚至是电动汽车中的电源模块，以帮助使电子设备始终保持高峰性能。物联网，5G网络基础架构和电动汽车的越来越多的流行率都是必要的更好的热解决方案，以便设备可以正常运行。该项目可能有助于半导体，汽车和医疗保健行业。该项目的目标是建立在LMEE复合体系结构的基础上，开发和商业化包装微电子的热接口材料（TIM）。该技术将通过将基于金属的固体TIMS（S-TIM）与聚合物基的TIM的机械可靠性和高体积制造兼容性的机械可靠性相结合，从而胜过现有的TTIM。具体而言，LMEE具有类似金属的热阻力，类似橡胶的弹性和类似液体乳液的流变性的独特组合，从而解决了现有S-TIMS面临的两个主要挑战：（i）在长时间的机械可靠性和（II）基于基于Syring的基于Syring的用于高体积制造的机械可靠性。该项目中提出的策略是合成基于LMEE的TIM，该TIM在半导体芯片和周围封闭的表面之间形成牢固的键，并保持芯片和外壳之间的受控厚度，并确保基于注射器的分配的必要流变学。特定的项目任务围绕着一项全面的技术计划，其中包括材料综合，性能表征和包装评估。同时，该项目将在该项目结束时研究用于确保为集成设备制造商和半导体组装和测试行业准备的产品的方法，以确保该项目的综合设备制造商和半导体组装和测试行业。该奖项反映了NSF的法定任务，并通过使用该基金会的知识分子的智力和更广泛的影响来评估NSF的法定任务，并被视为珍贵的支持。