Failure-Resistant and Self-Healing Communication for Adaptive Mobile System

自适应移动系统的抗故障和自愈通信

• 批准号: 1255822
• 负责人: Gyungsu Byun
• 金额: $ 18万
• 依托单位: West Virginia University Research Corporation
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-04-01 至 2015-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1255822&HistoricalAwards=false
• 关键词: Failure; Resistant; Self; Healing; Communication

The need for failure-resistant circuit and system design is becoming critical as mobile devices continue to be constructed with enhanced computing and video processing capabilities using heterogeneous intellectual property blocks such as CPU, memory, sensors, and graphics/image processing units. Furthermore, ever-increasing miniaturization of integrated fabrication processes (e.g., 40 nanometer CMOS or below) is creating challenging problems including higher rates of failure at the device level, reliability degradation, and severe process/voltage/temperature variation, resulting in unpredictable behaviors and temporary or permanent failure of circuits and systems. This project proposes a failure-resistant and variation-tolerant interconnect system that will enhance the reliability of the system at the circuit level. The project will also enhance the self-healing capability of mobile platforms by developing adaptive and automatic fault detection techniques as well as by developing reconfigurable data access capabilities. Methodologies for developing failure-resistant computing and communication systems are critical for future semiconductor fabrication processes. An innovative failure-resistant and self-healing system could have significant impact on the industry and enhance national competitiveness. The microelectronic industry needs engineers trained in both analog/mixed-signal and radio frequency/microwave integrated circuit and system design. This project will thus contribute to the training of a competitive workforce.

随着移动设备不断使用 CPU、内存、传感器和图形/图像处理单元等异构知识产权块构建增强的计算和视频处理能力，对抗故障电路和系统设计的需求变得至关重要。此外，集成制造工艺（例如 40 纳米 CMOS 或以下）的不断小型化正在产生具有挑战性的问题，包括器件级故障率更高、可靠性下降以及严重的工艺/电压/温度变化，从而导致不可预测的行为以及电路和系统的暂时或永久故障。该项目提出了一种抗故障且容变的互连系统，该系统将增强电路级系统的可靠性。该项目还将通过开发自适应和自动故障检测技术以及开发可重新配置的数据访问功能来增强移动平台的自我修复能力。开发抗故障计算和通信系统的方法对于未来的半导体制造工艺至关重要。创新的抗故障和自愈系统可以对行业产生重大影响并提高国家竞争力。微电子行业需要接受过模拟/混合信号和射频/微波集成电路和系统设计培训的工程师。因此，该项目将有助于培训有竞争力的劳动力。