Collaborative Research:XPS:CLCCA: Cross-layer Thermal Reliability Management in 3D Integrated Heterogeneous Processor for Breaking the Power and Bandwidth Walls

通过TSV（硅通孔）垂直互连的CPU、GPU和DRAM芯片的3D堆叠集成正在成为未来并行和可扩展计算系统的关键使能技术。这样的3D异构处理器（3DHP）被期望提供高得多的带宽、更低的延迟和功耗以打破功率和带宽墙。尽管有这些显著的好处，但3DHP带来了从未被充分探索和解决的新的特定领域挑战。显著更高的功率密度、更薄的衬底和层间电介质材料的低导热率都使得热管理成为威胁3DHP的整体可靠性和性能的严重问题。该项目旨在通过整体跨层方法解决3DHP的热完整性问题。三个主要的热完整性问题在各自的目标系统层，包括物理，架构和运行时层及其相互关系将广泛调查的三个PI具有必要的背景和专业知识的团队。所提出的新颖的跨层方法包括：1）在物理层的自校准片上温度/应力协同传感器框架，2）在架构层的自适应错误检测&校正（EDAC）和DRAM刷新引擎，用于在CPU、GPU和DRAM管芯之间可靠地存储和传输数据，以及3）动态热可靠性管理（DTRM）框架，用于在运行时层对工作负载和硬件资源之间的交互进行细粒度控制。拟议的分层技术将紧密交织，以产生最协同的结果。该项目的研究将为可行的基于3DHP的并行和可扩展计算系统提供可靠的热完整性设计和仿真框架。

3D stacked integration of CPU, GPU and DRAM dies vertically interconnected by TSVs (Through-Silicon Vias) is emerging as a key enabling technology for parallel and scalable computing systems of tomorrow. Such 3D Heterogeneous Processor (3DHP) is expected to deliver much higher bandwidth, lower latency and power consumption to break the power and bandwidth walls. Despite such significant benefits, 3DHP comes with new domain-specific challenges that have never been fully explored and addressed. Significantly higher power density, thinned substrate and low thermal conductivity of inter-layer dielectric material all make thermal management a serious problem that threatens overall reliability and performance of 3DHP. This project aims to address this thermal-integrity issue of 3DHP through a holistic cross-layer approach. Three major thermal integrity issues at respective target system layers including physical, architecture and runtime layers and their correlations will be extensively investigated by a team of three PIs with necessary background and expertise. The proposed novel cross-layer approach includes: 1) Self-calibrated on-chip temperature/stress co-sensor framework at physical layer, 2) Adaptive Error Detection & Correction (EDAC) and DRAM refresh engine at architecture layer for reliable storage and transfer of data among CPU, GPU and DRAM dies, and 3) Dynamic Thermal Reliability Management (DTRM) framework for fine-grained control of interaction between workloads and HW resources at runtime layer. The proposed layered techniques will be tightly interwoven to bring out the most synergistic results. The research in this project will result in a solid thermal-integrity design and simulation framework for viable 3DHP-based parallel and scalable computing systems.