SBIR Phase I: A Novel CMOS Device Architecture and Tools for beyond 14 nm Transistors

该小型企业创新研究（SBIR）第一阶段项目旨在展示一种创新的器件架构（UT-FET：超薄场效应晶体管），用于扩展超过14 nm节点的FinFET器件。 该项目的成果将是一个CMOS器件，可扩展，减少关态泄漏，以及最大限度地减少阈值电压的变化。 该项目将开发一种工艺技术，该技术与使用工业工具集的大批量生产兼容。 拟议SBIR项目第一阶段的主要目标是使用可制造的工具和工艺演示UT-FET器件原型。 UT-FET器件架构涉及一种新颖的器件隔离手段，其可以降低成本、减少泄漏并提高电子系统的速度。 在SBIR项目的第1阶段，将使用生产工具和流程来证明批量生产技术的可扩展性。该技术演示的成功完成可以将该技术插入到不断增长的低功耗移动的通信电子市场中。该项目的更广泛影响/商业潜力将被解决并克服当前低功耗电子设备扩展的限制。低功耗电子设备使用CMOS技术，这些设备的缩放在过去二十年中一直是通信革命背后的驱动力。这些设备的进一步扩展将实现更快的通信，更长的电池寿命和更节能的电子系统操作。此外，在开发和展示这项技术的过程中，对使用薄晶体器件和大批量制造它们的工具的新的科学和技术理解将使能源，RF信号处理和电源管理的其他应用成为可能。

This Small Business Innovation Research (SBIR) Phase I project aims to demonstrate a innovative device architecture (UT-FET: Ultra Thin Field Effect Transistor) for scaling of FinFET devices beyond the 14nm node. The outcome of this project will be a CMOS device that is scalable and reduce off-state leakage as well as minimize threshold voltage variation. This project will develop a process technology that is compatible with high volume manufacturing using industrial toolsets. The main objective for the phase 1 of the proposed SBIR project is to demonstrate prototype UT-FET devices using manufacturing-capable tools and processes. The UT-FET device architecture involves a novel means of isolation of the device that can reduce cost, reduce leakage and increase speed of electronics systems. In this phase 1 of the SBIR project, production capable tools and processes will be used to demonstrate scalability of the technology for volume manufacturing. Successful completion of this technology demonstration can allow insertion of this technology into the growing markets for low power mobile communications electronics.The broader impact/commercial potential of this project will be address and overcome the current limits to scaling in low power electronic devices. Low power electronics devices use CMOS technologies and the scaling of these devices have been the driving force behind the communication revolution over the last two decades. Further scaling of these devices will enable faster communication, longer battery life and more energy efficient operation of electronics systems. Additionally in the process of developing and demonstrating this technology new scientific and technological understanding of using thin crystalline devices and the tools to manufacture them in high volume will enable other applications in energy, RF signal processing and power management.