I-Corps: Commercialization of Lead-free Nanosolder Paste for Micro/Nano-Electronics Assembly and Packaging

I-Corps:用于微/纳米电子组装和封装的无铅纳米焊膏的商业化

基本信息

  • 批准号:
    1513896
  • 负责人:
  • 金额:
    $ 5万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2015
  • 资助国家:
    美国
  • 起止时间:
    2015-01-15 至 2016-06-30
  • 项目状态:
    已结题

项目摘要

Soldering is widely used in electronics manufacturing. Traditionally, tin/lead (Sn/Pb) solders are most widely used. Recently, due to the toxicity and health concerns of lead, Sn/Pb solders are being phased out and Pb-free solders are more widely used. However, most Pb-free solders have a higher melting temperature than Sn/Pb solders and thus impose thermal stress and reliability issues for the printed circuit boards (PCBs) and electronic devices. Nanosolders have the potential to replace or improve the existing micron-sized Pb-free solder powders and to meet the increasing demand in the electronics sector. Furthermore, with the electronics industry's focus on further miniaturization and push to 'nanoelectronics', nanosolders are expected to play a key role in assembling nano-components into nanoelectronics and nanosystems. The successful adoption of nanosolder materials will initiate a new epoch in micro/nano-electronics manufacturing. The smaller sized solder bumps will also promote the revolution of industrial soldering and electronics assembling methods. The lead-free formulation will reduce the usage of toxic material and provide a sustainable approach for future electronics manufacturing. The objective of this I-Corps proposal is to investigate the commercialization feasibility of lead-free nanosolder paste, which has great potential as a new soldering material for micro/nano-electronics assembly and packaging applications. Specific aims include the development of a technology transfer plan, determination of industrial target and market value of lead-free nanosolder materials, and completion of a detailed commercialization plan for the potential application of lead-free nanosolder materials and nano-soldering technique. Recently, the lead-free nanosolder formulated paste has been developed as the direct replacement of the typical microsolder paste. This innovation is able to satisfy the current solder paste printing technology which has been widely adopted by the electronics manufacturing industry. The mechanical property studies showed that the nanosolder composed solders resulted in enhanced strengthwhen compared to the currently commercial formulated solder paste. For the next generation nanoelectronics, multiple nanocomponents, such as nanowire, nanotube and graphene, can be effectively jointed by applying nanoscale solder materials to form a functional device.
焊接广泛应用于电子制造业。传统上,锡/铅(Sn/Pb)焊料使用最广泛。近年来,由于铅的毒性和健康问题,锡/铅焊料逐渐被淘汰,无铅焊料得到更广泛的应用。然而,大多数无铅焊料具有比锡/铅焊料更高的熔化温度,因此对印刷电路板(pcb)和电子设备造成热应力和可靠性问题。纳米焊料有潜力取代或改进现有的微米尺寸的无铅焊料粉末,并满足电子行业日益增长的需求。此外,随着电子工业对进一步小型化和推进“纳米电子学”的关注,纳米焊料有望在将纳米元件组装成纳米电子学和纳米系统方面发挥关键作用。纳米焊料材料的成功应用将开启微/纳米电子制造的新纪元。更小尺寸的焊料凸起也将促进工业焊接和电子组装方法的革命。无铅配方将减少有毒材料的使用,并为未来的电子制造提供可持续的方法。这项I-Corps提案的目的是研究无铅纳米锡膏的商业化可行性,无铅纳米锡膏作为微/纳米电子组装和封装应用的新型焊接材料具有巨大的潜力。具体目标包括制定技术转移计划,确定无铅纳米焊料材料的工业目标和市场价值,以及完成无铅纳米焊料材料和纳米焊接技术潜在应用的详细商业化计划。近年来,无铅纳米锡膏作为典型微锡膏的直接替代品被开发出来。这一创新能够满足目前已被电子制造行业广泛采用的锡膏印刷技术。力学性能研究表明,纳米焊料组成的焊料与目前市售的焊料膏相比,具有更高的强度。对于下一代纳米电子学来说,纳米线、纳米管和石墨烯等多个纳米元件可以通过应用纳米级焊料材料有效地连接,从而形成一个功能器件。

项目成果

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Zhiyong Gu其他文献

Evaporation of Water from Structured Surfactant Solutions
结构化表面活性剂溶液中水的蒸发
  • DOI:
  • 发表时间:
    2011
  • 期刊:
  • 影响因子:
    0
  • 作者:
    P. Alexandridis;Shushan Z. Munshi;Zhiyong Gu
  • 通讯作者:
    Zhiyong Gu
Generalized Gaussian decomposition for full waveform LiDAR processing
  • DOI:
    doi.org/10.1088/1361-6501/ac4eff
  • 发表时间:
    2022
  • 期刊:
  • 影响因子:
  • 作者:
    Zhiyong Gu;Jiancheng Lai;Chunyong Wang;Wei Yan;Yunjing Ji;Zhenhua Li
  • 通讯作者:
    Zhenhua Li
NANOWIRE ASSEMBLY AND INTEGRATION
纳米线组装和集成
  • DOI:
    10.1142/9789812790897_0006
  • 发表时间:
    2012
  • 期刊:
  • 影响因子:
    3.9
  • 作者:
    Zhiyong Gu;D. Gracias;D. Gracias
  • 通讯作者:
    D. Gracias
Green’s Function Method for Stability Analysis of Stochastic Structures
随机结构稳定性分析的格林函数法
  • DOI:
    10.1061/(asce)em.1943-7889.0000842
  • 发表时间:
    2015
  • 期刊:
  • 影响因子:
    0
  • 作者:
    C. Su;Xueming Fan;Haitao Ma;Zhiyong Gu
  • 通讯作者:
    Zhiyong Gu
Investigation of Lead-free Nanosolder Reflow and Wettability Property for Electronics/Nanoelectronics Assembly and Packaging
电子/纳米电子组装和封装的无铅纳米焊料回流和润湿性研究
  • DOI:
  • 发表时间:
    2011
  • 期刊:
  • 影响因子:
    0
  • 作者:
    P. Eliason;Ryan Farrell;F. Gao;Zhiyong Gu;Gregory Morose;Sammy G. Shina
  • 通讯作者:
    Sammy G. Shina

Zhiyong Gu的其他文献

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{{ truncateString('Zhiyong Gu', 18)}}的其他基金

PFI:AIR - TT: Novel Nanocomposite Solders for High Reliability Electronics Applications
PFI:AIR - TT:用于高可靠性电子应用的新型纳米复合焊料
  • 批准号:
    1640643
  • 财政年份:
    2016
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
Collaborative Research: Investigation of Fundamental Properties of Lead-free Nanosolders for Nanoscale Assembly and Nano-joining
合作研究:用于纳米级组装和纳米连接的无铅纳米焊料的基本特性研究
  • 批准号:
    1234532
  • 财政年份:
    2012
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
Collaborative Research: Microscale Joining Using Nanoheater Structures
合作研究:使用纳米加热器结构进行微尺度连接
  • 批准号:
    1031532
  • 财政年份:
    2010
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
NUE: Interdisciplinary Course - Nanoscale Transport Phenomena for Manufacturing Nanodevices
NUE:跨学科课程 - 制造纳米器件的纳米级传输现象
  • 批准号:
    1042119
  • 财政年份:
    2010
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant

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