PFI:AIR - TT: Novel Nanocomposite Solders for High Reliability Electronics Applications

该PFI：AIR技术翻译项目的重点是翻译一种新的高度可靠的无铅纳米复合焊膏（“NanoPaste”），以满足目前豁免的电子行业，如国防，医疗和航空航天的需求。纳米浆料很重要，因为它将使这些行业获得一种更环保的产品，而不依赖于含铅组件和制造设施。 这些行业目前不受禁止使用铅基焊料和组件的国际法规的约束，因为目前无铅材料缺乏可靠性。此外，获得含铅部件和制造设施变得越来越困难，使得可靠材料供应的前景变得不确定。 这项技术也可以使其他需要高可靠性的电子行业受益，例如电力电子和通信。该项目将开发一种新的纳米复合材料焊膏原型，适用于商业评估和生产测试。NanoPaste具有两个独特的特点：均匀的元素和成分，以及制造过程中较低的加工温度。这些特性提供了显著的优势，包括降低印刷电路板（PCB）上的热应力和增强焊点的可靠性，与这些细分市场中领先的竞争铅基焊料相比。为了开发均匀的NanoPaste以转化为商业应用，本项目将执行以下任务：（1）按比例放大合成和配制，（2）通过电路板设计、模板印刷和焊料回流，使用NanoPaste对多组分测试车辆进行原型制作，以及（3）通过执行工业标准的电气和机械测试进行全面的商业表征（剪切和拉力测试）和可靠性测试（热循环、腐蚀、振动和跌落测试）。此外，参与该项目的人员，包括本科生、研究生和博士后，将通过实验和分析、工业现场访问、定制访谈和业务开发获得创新、创业和技术翻译经验。该项目涉及AIM Solder、Benchmark Electronics和其他新英格兰无铅电子联盟相关成员（如雷神公司，飞利浦医疗保健，泰瑞达和EMC），以增强研究能力，提供测试环境，并指导商业化方面的技术转化工作，从研究发现到商业实现。

This PFI: AIR Technology Translation project focuses on translating a new highly reliable lead-free nanocomposite solder paste ("NanoPaste") to fill the need for the currently exempted electronic sectors such as defense, medical, and aerospace. The NanoPaste is important because it would give these industries access to a more environmentally friendly product that would not depend on leaded components and manufacturing facilities. These industries are currently exempt from international regulations banning the use of lead-based solders and components because of the lack of proven reliability of current lead-free materials. In addition, access to leaded components and manufacturing facilities is becoming increasingly difficult, making for an uncertain future of reliable supplies of materials. This technology could also benefit other electronic sectors that require high reliability, such as power electronics and communications. A prototype of the new nanocomposite solder paste will be developed under this project that is suitable for commercial evaluation and production testing. The NanoPaste has two unique features: homogeneous elements and compositions, and lower processing temperature during manufacturing. These features provide significant advantages, including reduced thermal stress on the printed circuit board (PCB) and enhanced reliability of solder joints, as compared to the leading competing lead-based solders in these market segments.The following tasks will be performed in this project in order to develop a homogeneous NanoPaste to translate to commercial application: (1) scale-up synthesis and formulation, (2) prototyping multi-component test vehicles with NanoPaste through board design, stencil printing, and solder reflow, and (3) full commercial characterization by performing industry-standard electrical and mechanical tests (shear and pull tests) and reliability tests (thermal cycling, corrosion, vibration and drop tests). In addition, personnel involved in this project, including undergraduates, graduates, and post-docs, will receive innovation, entrepreneurship, and technology translation experiences through experimentation and analysis, industrial site visits, custom interviews, and business development.The project engages AIM Solder, Benchmark Electronics, and other New England Lead-free Electronics Consortium associated members (such as Raytheon, Philips Healthcare, Teradyne and EMC) to augment research capability, provide test environment, and guide commercialization aspects in this technology translation effort from research discovery toward commercial realization.