GOALI: Collaborative Research: Interactions of Polishing and Incidental Nanoparticles in Chemical Mechanical Planarization Processes with Artificial Membranes and Human Cell Lines

PI: Chen, Kai Loon#: 1605815COLLABORATIVEPI: Aravamudhan， Shyam #: 1604647化学机械平面化（CMP）是用于生产计算机、智能手机、平板电脑等先进电子设备的重要半导体制造工艺之一。CMP工艺在制造过程中使用大量（数百万吨）的二氧化硅、铈或氧化铝颗粒，以研磨浆料的形式使电子电路平坦化。然而，含有纳米颗粒的使用过的CMP浆料释放到自然环境和工作场所暴露对环境安全和健康（ESH）的影响在很大程度上是未知的。本研究的目的是研究原始和使用的CMP纳米颗粒与人工细胞膜和人类细胞系的ESH影响和相互作用。尽管集成电路制造过程中大规模使用纳米粒子，但对其环境和人类健康的影响知之甚少，特别是纳米粒子在CMP过程中的转化及其相应的工作场所暴露、命运、行为和毒性。这主要是由于无法从CMP过程中获得转化的纳米颗粒浆料。该项目的主要目标是：(1)系统地研究、检测和表征纳米颗粒浆料在CMP过程中的转化；(2)研究CMP和附带的纳米颗粒附着和破坏人造细胞膜的影响及其影响人类细胞系的能力；(3)确定纳米颗粒-膜相互作用对纳米颗粒毒性的作用。这项研究具有变革性的潜力，因为对原始和转化的CMP NPs的生物相互作用的深刻理解不仅与电子工业有关，而且对许多其他纳米颗粒应用具有更广泛的适用性，这些纳米颗粒通常通过不同的物理和化学过程进行生命周期转化。研究结果将通过同行评议期刊的出版物和学生在国家科学会议上的报告传播。它们还将被纳入本科和研究生课程以及社区外展项目，包括巴尔的摩市内城小学/中学的K-12科学活动、当地社区的NanoDay活动、NanoBus课后项目和社区大学参与。最后，工业合作伙伴的积极参与将导致实施更好的工程控制和更安全的CMP过程。

PI: Chen, Kai Loon#: 1605815COLLABORATIVEPI: Aravamudhan, Shyam #: 1604647Chemical Mechanical Planarization (CMP) is one of the important semiconductor manufacturing processes used in the production of advanced electronic devices such as computers, smart phones, and tablets. The CMP process uses huge volumes (millions of tons) of silica, ceria, or alumina particles in the form of abrasive slurries to planarize electronic circuits during the manufacturing process. However, environmental safety and health (ESH) impacts from the release of used CMP slurries containing nanoparticles into the natural environment and workplace exposure are largely unknown. The objective of this research is to study the ESH impacts and interactions of both pristine and used CMP nanoparticles with artificial cell membranes and human cell lines.Even though NPs are used in a large-scale in the CMP process during the manufacture of integrated circuits, little is known about their environmental and human health impacts, particularly the transformation of nanoparticles during the CMP process and their corresponding workplace exposure, fate, behavior, and toxicity. This is mainly due to the inability to obtain access to the transformed nanoparticle slurries from the CMP process. The main objectives of this project are to (1) systematically investigate, detect, and characterize the transformation of nanoparticle slurries during the CMP processes; (2) examine the influence of CMP and incidental nanoparticles to attach to and disrupt artificial cell membranes and their ability to affect human cell lines; and (3) determine the role of nanoparticle-membrane interactions on nanoparticle toxicity.This research has the potential to be transformative because a strong understanding of the biological interactions of pristine and transformed CMP NPs is not only relevant to the electronics industry, but also has wider applicability for a number of other nanoparticle applications, which routinely undergo life-cycle transformations through different physical and chemical processes. The research results will be disseminated through publications in peer-reviewed journals and student presentations at national scientific meetings. They will also be incorporated into undergraduate and graduate courses and community outreach programs, including K-12 scientific activities for an inner-city Baltimore elementary/middle school, NanoDay activities for the local community, NanoBus after-school program, and community college engagement. Lastly, the active involvement of an industrial partner will result in implementation of better engineering controls and safer CMP processes.