PFI:AIR - TT: Scalable Accelerated Power Simulation Program with Integrated Circuit Emphasis

PFI:AIR - TT：以集成电路为重点的可扩展加速功率仿真程序

• 批准号: 1700844
• 负责人: Young Cho
• 金额: $ 20万
• 依托单位: University of Southern California
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2017
• 资助国家: 美国
• 起止时间: 2017-07-01 至 2018-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1700844&HistoricalAwards=false
• 关键词: PFI; AIR; TT; Scalable; Accelerated

This PFI: AIR Technology Translation project focuses on translating a novel integrated circuit (IC) power estimation simulation technology into an integrated simulation tool that is superior to the current state-of-the-art. The Scalable Accelerated Power Simulation Program with Integrated Circuit Emphasis (SAP-SPICE) will drastically improve the way IC manufacturers design, fabricate, and test modern chips by significantly increasing the speed and the accuracy of the power estimation simulations. This project addresses the following technology gap as it translates from research discovery toward commercial application. While the gold-standard simulation tool HSPICE produces the most accurate result, it comes at a high computational cost. On the other hand, accelerated simulators are faster because they depend on larger component models but they produce less accurate average results. The SAP-SPICE project uses a different approach with logic design, a logic simulator, and a portion of power data to extract a more accurate result while maintaining fast computational speed. The goal of this project is to produce a preproduction quality prototype that will integrate with existing industry standard tools to demonstrate the advantages of the technology over other tools to potential customers. The SAP-SPICE will have broader impacts on several fronts. First, the tool can lead to significant societal and environmental benefit when it is used by the chip manufacturers to improve the chip yield. Second, the techniques developed for the product have potential broader applicability to other areas of computing such as large server systems, mobile devices, and consumer appliances; especially in a future where a fine-grained energy accounting will be an integral part of all computing devices. Beyond its impact on technology, the project will also contribute to workforce development through educational benefits to the students participating in the project who will be organized in a structure similar to a small business, encouraged to find innovative solutions on a short timeline, and will meet weekly with the business mentor.

该PFI：AIR技术转换项目的重点是将一种新颖的集成电路（IC）功耗估计仿真技术转换为上级当前最先进技术的集成仿真工具。 集成电路重点可扩展加速功耗仿真程序（SAP-SPICE）将通过显著提高功耗估计仿真的速度和准确性，极大地改善IC制造商设计、制造和测试现代芯片的方式。 该项目解决了以下技术差距，因为它从研究发现转化为商业应用。 虽然黄金标准的模拟工具HSPICE产生最准确的结果，但它的计算成本很高。 另一方面，加速模拟器更快，因为它们依赖于更大的组件模型，但它们产生的平均结果不太准确。 SAP-SPICE项目使用不同的方法进行逻辑设计，逻辑模拟器和一部分功率数据，以提取更准确的结果，同时保持快速的计算速度。 该项目的目标是生产一个预生产质量的原型，将与现有的行业标准工具集成，以展示该技术的优势，比其他工具的潜在客户。 SAP SPICE将在几个方面产生更广泛的影响。首先，当芯片制造商使用该工具来提高芯片产量时，该工具可以带来显著的社会和环境效益。其次，为该产品开发的技术具有潜在的更广泛的适用性，可用于其他计算领域，如大型服务器系统、移动的设备和消费电器;特别是在未来，细粒度的能源核算将成为所有计算设备的组成部分。除了对技术的影响外，该项目还将通过对参与该项目的学生的教育福利来促进劳动力发展，这些学生将以类似于小企业的结构组织起来，鼓励他们在短时间轴内找到创新的解决方案，并每周与企业导师会面。

项目成果

Fine-grained on-line power monitoring for soft microprocessor based system-on-chip

基于软微处理器的片上系统的细粒度在线功率监控

• DOI: 10.1109/reconfig.2017.8279794
• 发表时间: 2017
• 期刊: 2017 IEEE International Conference on ReConFigurable Computing and FPGAs (ReConFig
• 作者: Cho, Young H.;Bhargav, Siddharth S.
• 通讯作者: Bhargav, Siddharth S.