SBIR Phase I: IoT2:IoT Energy and Power Systems

这个小企业创新研究（SBIR）第一阶段项目的更广泛的影响/商业潜力将是展示一种将能量收集技术集成到标准电子电路中的新方法。这为在偏远地区生产小型传感器和设备提供了机会，这些传感器和设备可以收集信息、监测情况和传输数据，而无需更换电池。小型电池不适合远程部署的电子设备，这促使人们对直接从机械的运动和振动中获取电能产生兴趣。目前，能量收集过于庞大、昂贵且效率低下，无法进行实际部署。如果能量收集可以变得小巧而廉价，它可以为工业、民用和农业远程监控提供大量的产品和服务。该项目提供了将能量收集引入电子设备的潜力，这种方式允许从振动或移动机械中高效地转换能量，同时保持小尺寸和低成本。在印刷电路中直接嵌入微小运动部件的能力是高度创新的，动态能量收集是这项技术的一个很好的应用。该专利制造工艺可以使用国内电子制造基础设施来执行，有助于将下一代制造带到美国。拟议的项目旨在展示一种将动态能量收集设备直接嵌入印刷电路板的新方法，从而实现低成本和小尺寸的微能量生产。该项目建立在利用传统电子制造基础设施的专利制造工艺之上。不需要昂贵的硅晶圆代工厂，就可以制造出微米尺寸的器件。该项目将探索小型，高效振动单元的设计和制造工艺，最终在单个小足迹电路板上生产多个设备。重要的工作将是开发小型、高效的振动单元，这种振动单元可以廉价、大批量地制造，而且可以直接嵌入印刷电路中。预计将进行三轮制造，生产出可以通过实验测试和测量的真实设备。该项目的成功完成将展示在一个小型印刷电路板（大约信用卡大小）上生产电能，目标是100微瓦的传感和遥测电子设备。

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase I project will be to demonstrate a new way of integrating energy harvesting technologies in standard electronic circuits. This offers the opportunity to produce small sensors and devices in remote locations that can collect information, monitor conditions, and transmit data without the need to replace batteries. Small batteries are unsuitable for electronics that are remotely deployed, driving interest to harvest electrical energy directly from the movement and vibration of machinery. Currently, energy harvesting is too large, expensive, and inefficient for practical deployment. If energy harvesting can be made small and inexpensive, it can enable a large suite of products and services for industrial, civil, and agricultural remote monitoring. This project offers the potential to bring energy harvesting to electronics in a way that allows highly efficient energy conversion from vibrating or moving machinery, while maintaining small size and low cost. The ability to embed tiny moving parts directly within printed circuits is highly innovative, and dynamic energy harvesting is an excellent application of this technology. The patented manufacturing processes can be performed using domestic electronics manufacturing infrastructure helping to bring next-generation manufacturing to the U.S.The proposed project seeks to demonstrate a new way to embed dynamic energy harvesting devices directly within printed circuit boards, enabling micro energy production at low cost and small size. The project builds on patented manufacturing processes that leverages conventional electronics manufacturing infrastructure?devices can be built having feature sizes in microns without the need for expensive silicon fabrication foundries. The project will explore designs and fabrication processes for small, efficient vibrating units, culminating in the production of multiple devices in a single small footprint circuit board. Significant effort will be on the development of small, efficient vibrating units that can be manufactured cheaply and in large quantities, yet embedded directly within printed circuits. Three manufacturing rounds are anticipated, producing real devices that can be experimentally tested and measured. The successful completion of this project will demonstrate electrical energy production in a small printed circuit board (approximately the size of a credit card), targeting 100 microwatts to power sensing and telemetry electronics.