SBIR Phase I: Laser-Enabled Massively Parallel Die Transfer for ?LED Displays

这个小企业创新研究（SBIR）第一阶段项目的更广泛的影响/商业潜力是将显示和照明产品的功耗降低90%。它将通过在此类产品中广泛使用发光二极管（led）来实现这一目标。与其他显示/照明技术相比，led消耗的功率要少得多，而且还具有诸如卓越的图像或照明质量以及更长的使用寿命等优点。这种产品出现的首要障碍是难以经济地将大量led放置到产品网格上。例如，如果使用当前的方法来制造全高清显示器，其组装将需要大约一个月的时间，其成本远远超出市场所能接受的范围。该项目的创新解决了这一问题，采用了基于激光的超高速LED放置解决方案。除了这种直接应用之外，它还将进一步提高该行业相对于电子元件组装的技术能力。基于芯片的LED显示屏和照明产品的商业潜力预计将在五年内达到约100亿美元。在同一时间段内，支持这些产品的LED放置解决方案的市场规模将达到约10亿美元。提出的项目通过展示超高速LED放置方法来解决上述问题，该方法可以将上述示例中一个月的组装时间缩短到一分钟。与其他正在开发的解决方案不同，该解决方案将led的放置率提高了10,000倍，并包括预屏幕和替换非功能led的能力。该项目将展示该解决方案的核心方面，包括使用单个激光脉冲衍射成多个扫描光束来放置多个非常小的led（“微型led”）。它将使用这种解决方案来演示基于量子点的微型led显示器的极快组装。该项目将建立在一个相关的，先前证明的能力应用于更大的硅模具。该技术的每个方面（晶圆制备、单激光束放置、多激光束放置）都将针对尺寸更小、基于蓝宝石的微型led所施加的新条件进行单独优化。这种新的LED定制能力将用于演示在一秒钟内组装4000像素的微型LED显示屏，从而实现项目的目标，展示5000万个/小时的LED放置率。

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase I project is to reduce the power consumption of display and lighting products by 90%. It will do so by enabling the pervasive use of light emitting diodes (LEDs) in such products. LEDs consume substantially less power than other display/lighting technologies and also offer benefits such as superior picture or lighting quality and longer lifespan. The foremost barrier to the emergence of such products is the difficulty of economically placing large quantities of LEDs onto a product grid. For example, if current-day methods are used to create a full high definition display, its assembly would take about a month and drive its cost far beyond what the market could accept. This project's innovation addresses this problem with a laser-based, ultra-high speed LED placement solution. Beyond this immediate application, it will further the industry's technical capabilities relative to electronics component assembly in general. The commercial potential for chip-based LED display and lighting products is expected to reach about $10 billion within five years. The market for LED placement solutions in support of these products will be about $1 billion in this same time frame.The proposed project addresses the above problem by demonstrating an ultra-high speed LED placement method that can reduce the one month assembly time in the example above to just one minute. This solution, unlike others in development, increases the placement rate of LEDs by a factor of 10,000 and includes the ability to pre-screen and replace non-functional LEDs. This project will demonstrate the core aspect of this solution involving the placement of multiple, very small LEDs ("microLEDs") using a single laser pulse diffracted into multiple scanned beams. It will use this solution to demonstrate the extremely fast assembly of a quantum dot-based microLED display. The project will build upon a related, previously demonstrated capability applied to larger, silicon dies. Each aspect of the technology (wafer preparation, single laser beam placement, multi-beam placement) will be individually optimized for the new conditions imposed by the smaller sized, sapphire-based microLEDs. This new, LED-tailored capability will then be used to demonstrate the assembly of a four thousand pixel microLED display in under one second thereby achieving the project's goal of demonstrating a 50M units/hour LED placement rate.