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CAREER: Supply Chain Security for Integrated Circuits

CAREER: Supply Chain Security for Integrated Circuits
职业:集成电路供应链安全
批准号:
1749845
负责人:
Daniel Holcomb
金额:
$59.62万
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
2018
资助国家:
美国
项目状态:
已结题
起止时间:
2018-02-01 至 2024-01-31

项目摘要

项目成果

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中文摘要
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英文摘要
The integrated circuits (ICs) that underpin critical systems in modern society are produced by a global supply chain that involves a variety of actors in many countries. Some of the actors are trusted, but others are not. Untrusted actors give rise to supply chain threats such as counterfeit ICs of uncertain quality or the possibility of malicious changes to the function of ICs. To secure electronic systems in defense, critical infrastructure, and healthcare, it is increasingly important to secure the global IC supply chain. This research project pursues new strategies for securing ICs against supply chain threats. This research explores a new framework for supply chain security organized around three main thrusts. The first thrust explores application-specific designs with post-fabrication programmability to prevent targeted Trojan insertion by an untrusted foundry. The second thrust of the work addresses the design side of the supply chain, and seeks new formal abstractions for reasoning about, and protecting against, entire classes of malicious circuit modifications. The third thrust addresses the distribution side of the supply chain with a low-cost authentication technique to verify the provenance of packaged ICs. This research project has the potential to positively impact national security and well-being of individuals by helping to keep malicious parts out of critical systems such as defense aircraft and medical devices. The work supports economic competitiveness of US semiconductor companies by trying to prevent billions of dollars in annual losses from counterfeits. The project supports cybersecurity education through a variety of contest-based learning activities, and through a supply chain testbed for lab courses that supports both education and research. Public data, tools, and design artifacts associated with this project will be made publicly available through the completion of the project at https://github.com/danholcomb/supply-chain-security.
期刊论文(8)
专著(0)
科研奖励(0)
会议论文
Efficient Register Renaming Architectures for 8-bit AES Datapath at 0.55 pJ/bit in 16-nm FinFET
16 nm FinFET 中 0.55 pJ/位的 8 位 AES 数据路径的高效寄存器重命名架构
DOI: 10.1109/tvlsi.2020.2999593
发表时间: 2020
期刊: IEEE Transactions on Very Large Scale Integration (VLSI
影响因子: --
作者: [Dhanuskodi, Siva Nishok, Allen, Samuel, Holcomb, Daniel E.]
通讯作者: Holcomb, Daniel E.
Know Time to Die – Integrity Checking for Zero Trust Chiplet-based Systems Using Between-Die Delay PUFs
了解死亡时间 — 使用芯片间延迟 PUF 对基于零信任 Chiplet 的系统进行完整性检查
DOI: 10.46586/tches.v2022.i3.391-412
发表时间: 2022
期刊: IACR Transactions on Cryptographic Hardware and Embedded Systems
影响因子: --
作者: [Deric, Aleksa, Holcomb, Daniel]
通讯作者: Holcomb, Daniel
COUNTERFOIL: Verifying Provenance of Integrated Circuits using Intrinsic Package Fingerprints and Inexpensive Cameras
COUNTERFOIL:使用固有封装指纹和廉价相机验证集成电路的来源
DOI: --
发表时间: 2020
期刊: 29th USENIX Security Symposium (USENIX Security 20
影响因子: --
作者: [Dhanuskodi, Siva Nishok, Li, Xiang, Holcomb, Daniel]
通讯作者: Holcomb, Daniel
Precise Fault Injection to Enable DFIA for Attacking AES in Remote FPGAs
精确的故障注入使 DFIA 能够攻击远程 FPGA 中的 AES
DOI: 10.1109/fccm53951.2022.9786154
发表时间: 2022
期刊: 2022 IEEE 30th Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM
影响因子: --
作者: [Li, Xiang, Tessier, Russell, Holcomb, Daniel]
通讯作者: Holcomb, Daniel
8
    Travel: NSF Student Travel Grant Proposal for 2022 New England Hardware Security Day (NEHWS2022)
    • 批准号:
      2222326
    • 项目类别:
      Standard Grant
    • 资助金额:
      $0.56万
    • 财政年份:
      2022
    • 负责人:
      Daniel Holcomb
    • 依托单位:
    STARSS: Small: SecureDust -- The Physical Limits of Information Security
    • 批准号:
      1619558
    • 项目类别:
      Standard Grant
    • 资助金额:
      $30.81万
    • 财政年份:
      2016
    • 负责人:
      Daniel Holcomb
    • 依托单位:
    国内基金
    海外基金
    Supply Chain Collaboration in addressing Grand Challenges: Socio-Technical Perspective
    • 批准号:
      --
    • 项目类别:
      外国青年学者研究基金项目
    • 资助金额:
      --
    • 批准年份:
      2024
    • 负责人:
      Lim Jia Jia
    • 依托单位:
    不确定条件下基于Supply-Hub的装配系统协同补货策略研究
    • 批准号:
      71102174
    • 项目类别:
      青年科学基金项目
    • 资助金额:
      20.5万元
    • 批准年份:
      2011
    • 负责人:
      李果
    • 依托单位:
    基于Supply-Hub的供应物流协同的理论与方法研究
    • 批准号:
      71072035
    • 项目类别:
      面上项目
    • 资助金额:
      26.0万元
    • 批准年份:
      2010
    • 负责人:
      马士华
    • 依托单位: