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RUI: Regenerative Electroless Etching for the Production of Si Nanostructures

RUI: Regenerative Electroless Etching for the Production of Si Nanostructures
RUI:用于生产硅纳米结构的再生化学蚀刻
批准号:
1825331
负责人:
Kurt Kolasinski
金额:
$16.89万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2018
资助国家:
美国
项目状态:
已结题
起止时间:
2018-08-01 至 2022-06-30

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Applications of nanostructured silicon in, e.g., consumer products, nanomedicine and rechargeable batteries, would benefit from economical production of porous silicon powder on the kilogram-to-ton scale needed in new technologies essential for national prosperity. Electroless etching, which is an electrochemical process that is recognized possessing industrial potential but requiring advances in its reproducibility, controllability, purity, cost and scaling. This research will develop a new electrochemical process called regenerative electroless etching (ReEtching), a new concept in electroless wet etching with the capability of producing nanostructured and hierarchically structured semiconductors. ReEtching is a method in which one oxidant is used to continuously regenerate a low concentration of a second oxidant in the reaction mixture which is used in the reaction. These investigations will transform electroless etching from an irreproducible procedure into a process that can produce homogeneous porous films of arbitrary thickness, produce pillared particles of arbitrary length, produce either crystalline or amorphous pillars, produce hierarchical porous materials with nanopores inside of mesopores or nanopores inside of macropores. This work is carried out in a primarily undergraduate institution with strong international components providing the undergraduates involved in the research a unique international research experience.Regenerative electroless etching (ReEtching) is a electroless wet etching process with the capability of producing nanostructured and hierarchically structured semiconductors. ReEtching produces nanostructured semiconductors in a process which an oxidant (Ox1) is used as a catalytic agent to facilitate reaction between a semiconductor and a second oxidant (Ox2) that would be unreactive in the primary reaction. Ox2 is used to regenerate Ox1, which is capable of initiating etching. The extent of reaction is controlled by the amount of Ox2 added and the rate of reaction is controlled by the injection rate of Ox2. A specific example is the production of highly luminescent, nanocrystalline porous Si powder through reaction with V2O5 (the catalytic agent) and H2O2 (the regeneration agent) in HF(aq). Because it facilitates control the rate of reaction independent of the extent of reaction, ReEtching possesses previously unattainable processing capabilities. This grant will transform electroless etching from an irreproducible procedure into a process that can produce homogeneous porous films of arbitrary thickness, produce pillared particles of arbitrary length, produce either crystalline or amorphous pillars, produce hierarchical porous materials with nanopores inside of mesopores or nanopores inside of macropores. These meso-to-nanostructures will be characterized by photoluminescence and correlated with the materials structural parameters. Extension to other semiconductors will be developed.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
期刊论文(9)
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会议论文
DOI: 10.3389/fchem.2018.00651
发表时间: 2019-01-07
期刊: FRONTIERS IN CHEMISTRY
影响因子: 5.5
作者: [Kolasinski,Kurt W., Unger,Bret A., Aindow,Mark]
通讯作者: Aindow,Mark
Effect of Metal-Assisted Catalytic Etching (MACE) on Single-Crystal Si Wafers With Faceted Macropores
金属辅助催化蚀刻 (MACE) 对多面大孔单晶硅片的影响
DOI: 10.1017/s1431927619011358
发表时间: 2019
期刊: Microscopy and Microanalysis
影响因子: 2.8
作者: [Ernst, Alexis T., Kolasinski, Kurt W., Unger, Bret A., Aindow, Mark]
通讯作者: Aindow, Mark
DOI: 10.1021/acsami.9b20514
发表时间: 2020-01-29
期刊: ACS APPLIED MATERIALS & INTERFACES
影响因子: 9.5
作者: [Tamarov, Konstantin, Swanson, Joseph D., Riikonen, Joakim]
通讯作者: Riikonen, Joakim
DOI: 10.3390/surfaces5010007
发表时间: 2022
期刊: Surfaces
影响因子: 2
作者: [DiPietro, Jacklyn A., Kolasinski, Kurt W.]
通讯作者: Kolasinski, Kurt W.
7
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