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Programming Ink Deposition Dynamically: The New Science of Direct Ink Writing

动态编程墨水沉积：直接墨水书写的新科学

基本信息

批准号：
1825626
负责人：
Yayue Pan
金额：
$ 42.59万
依托单位：
University of Illinois at Chicago
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
2018
资助国家：
美国
起止时间：
2018-08-15 至 2023-07-31
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=1825626&HistoricalAwards=false
关键词：
Programming Ink Deposition Dynamically New

项目摘要

Direct Ink Writing (DIW) is a class of three-dimensional (3D) printing that builds a 3D object by depositing functional and/or structural liquid materials (ink) onto a substrate in a layer-by-layer approach. This award supports fundamental research to provide new knowledge for control of ink deposition on substrates or previously printed layers. The research will advance DIW technology toward a higher achievable resolution, more flexible ink design, higher print quality, and a much wider choice of substrates. DIW has applications in a number of industries, including health care, electronics, automotive, aerospace and defense, and therefore this research directly impacts economic welfare and national security. Furthermore, the developed knowledge of ink deposition control could be applied to almost any droplet- or liquid filament-based process. 45.6 percent of undergraduate students in the UIC College of Engineering are from groups traditionally underrepresented in STEM. The PIs will work actively to involve underrepresented minority students in workshops, seminars, and mini-symposiums that are created from this project. Research outcomes will be incorporated into three engineering courses at UIC, the Engineering Summer Camp at UIC, and the 3D printing learning modules for Women In Engineering (WIEP) K-12 outreach programs. Dynamic and localized control of ink wettability on substrates or previously printed layers is pivotal for addressing current tolerance and repeatability challenges and advancing DIW technologies. The objective of this project is to test the hypothesis that wetting properties of leaky dielectric liquid droplets/filaments on substrates change dynamically when an electric field is applied, thus enabling accurate direct writing of inks on a wide range of substrates. The applied electric field is programmed in a pixel-by-pixel and layer-by-layer way, so that it manipulates ink deposition at any location, in any layer, and on any substrate. The research team will perform multiphysics modeling and experiments to understand the ink electrowetting dynamics, design and construct electric mask (e-Mask) generation systems, establish a novel e-Mask assisted DIW system and process, and assess the new DIW system.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

直接墨水书写（DIW）是一类三维（3D）打印，其通过以逐层方法将功能和/或结构液体材料（墨水）沉积到基底上来构建3D物体。该奖项支持基础研究，为控制基材或先前印刷的层上的油墨沉积提供新的知识。该研究将推动DIW技术朝着更高的可实现分辨率，更灵活的油墨设计，更高的打印质量和更广泛的基材选择方向发展。DIW在许多行业都有应用，包括医疗保健、电子、汽车、航空航天和国防，因此这项研究直接影响经济福利和国家安全。此外，所开发的油墨沉积控制知识可以应用于几乎任何基于液滴或液体粘附剂的工艺。45.6 UIC工程学院的本科生中有10%来自传统上在STEM中代表性不足的群体。PI将积极工作，让代表性不足的少数民族学生参加由该项目创建的讲习班，研讨会和小型研讨会。研究成果将被纳入UIC的三个工程课程，UIC的工程夏令营，以及女性工程（WIEP）K-12外展计划的3D打印学习模块。动态和局部控制油墨在基材或先前印刷层上的润湿性对于解决当前公差和可重复性挑战以及推进DIW技术至关重要。该项目的目的是测试以下假设：当施加电场时，基底上的漏电介质液滴/细丝的润湿特性动态变化，从而能够在各种基底上准确地直接写入墨水。所施加的电场以逐像素和逐层的方式编程，使得其操纵在任何位置、任何层中和任何基板上的油墨沉积。该研究团队将进行多物理场建模和实验，以了解油墨电润湿动力学，设计和构建电子掩模（e-Mask）生成系统，建立一个新的e-Mask辅助DIW系统和过程，并评估新的DIW系统。该奖项反映了NSF的法定使命，并通过使用基金会的智力价值和更广泛的影响审查标准进行评估，被认为值得支持。