Phase III IUCRC at University of Houston: Center for Electromagnetic Compatibility

休斯顿大学 IUCRC 第三阶段：电磁兼容性中心

• 批准号: 1922389
• 负责人: Ji Chen
• 金额: $ 25.24万
• 依托单位: University of Houston
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2019
• 资助国家: 美国
• 起止时间: 2019-12-15 至 2024-11-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1922389&HistoricalAwards=false
• 关键词: Phase; III; IUCRC; University; Houston

Electromagnetic compatibility (EMC) and Signal/Power Integrity (SI/PI) problems can significantly decrease the reliability, increase the cost, and delay the development schedules of modern electronic systems. Design for EMC ensures an electronic system can function in the presence of external electromagnetic noise and at the same time its radiated electromagnetic interference does not impact the functionality of other devices. SI/PI design ensures proper circuit operation at high speeds. Good EMC/SI/PI design is essential to industry for successful product development and customer satisfaction. The mission of the Center for Electromagnetic Compatibility is to support EMC/SI/PI research and education projects with a goal of developing the knowledge base, tools and people necessary to solve today’s EMC/SI/PI problems and address the EMC/SI/PI problems of the future. Advancing the EMC/SI/PI technologies has significant societal impacts in the internet and information era, and can significantly increase the economic competitiveness of the US. The research activities in the center can bring a disruptive advancement in the hardware level to the new technologies of 5G wireless, autonomous driving, smart city, etc., and can have profound impacts on human society and improve national security as our society is more dependent on data connection and internet of everything. With emerging technology trends, the need for EMC/SI/PI research and education grows rapidly. Not only new challenges occur due to higher data rates, greater design density, and lower power, but also new scopes are required to address the issues such as novel ways for high-frequency EMC measurements and hardware related security problems. EMC becomes truly essential to enable and support technology revolutions and development. The NSF IUCRC Center for Electromagnetic Compatibility (CEMC) in Phase III will focus on five thrust areas: 1) EMI, ESD and Immunity; 2) Signal and Power Integrity; 3) Intra-System EMI and RF Desense; 4) Photonics-Based Microwave Measurement; and 5) Hardware Security, Safety and Trust. Underlying noise physics and coupling mechanisms will be studied for various issues such as radiated electromagnetic interference, electrostatic discharge, radio-frequency interference, and hardware security. Based on the gained understanding, engineering design tools, models and methodologies for achieving ESD-robust, immunity-enhanced, SI/PI-ensured, EMI and noise mitigated, safe and secured design will be investigated, developed, and dissimilated throughout the industry. The CEMC will continue serving as a resource center for the EMC community, facilitating research collaborations, disseminating results, and transferring knowledge.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

电子兼容性（EMC）和信号/功率完整性（SI/PI）问题可以显着降低可靠性，提高成本并延迟现代电子系统的开发时间表。 EMC的设计确保电子系统可以在存在外部电子噪声的情况下起作用，同时它的辐射电子干扰不会影响其他设备的功能。 SI/PI设计可确保高速行驶的正确电路操作。良好的EMC/SI/PI设计对于成功的产品开发和客户满意度对于行业至关重要。电子兼容中心的使命是支持EMC/SI/PI研究和教育项目，目的是开发知识库，工具和人员，以解决当今的EMC/SI/PI问题并解决未来的EMC/SI/PI问题。推进EMC/SI/PI技术在互联网和信息时代具有重大的社会影响，并且可以显着提高美国的经济竞争力。该中心的研究活动可以在硬件层面上带来破坏性的进步，到5G无线，自动驾驶，智能城市等的新技术，并且可以对人类社会产生深远的影响，并改善国家安全，因为我们的社会更依赖于所有事物的数据连接和互联网。随着新兴技术趋势，对EMC/SI/PI研究和教育的需求迅速增长。不仅是由于较高的数据速率，更高的设计密度和较低的功率引起的新挑战，而且还需要新的范围来解决诸如高频EMC测量和与硬件相关的安全问题的新方法。 EMC对于启用和支持技术的革命和发展是真正至关重要的。 NSF IUCRC电子兼容性中心（CEMC）阶段将重点放在五个推力区域：1）EMI，ESD和免疫； 2）信号和功率完整性； 3）系统内EMI和RF DeSense； 4）基于光子学的微波测量； 5）硬件安全性，安全性和信任。将研究诸如放射性电磁干扰，静电放电，射频干扰和硬件安全性等各种问题的基本噪声物理和耦合机制。基于获得的理解，工程设计工具，模型和方法用于实现ESD，免疫增强，SI/PI-ENSURE，EMI和噪声，降低，安全且有安全的设计，将研究，开发和散布在整个行业中。 CEMC将继续担任EMC社区的资源中心，支持研究合作，传播结果并转移知识。该奖项反映了NSF的法定任务，并通过评估该基金会的知识分子优点和更广泛的影响来审查标准。

项目成果

Magnetic resonance conditionality of abandoned leads from active implantable medical devices at 1.5 T

1.5 T 下有源植入式医疗器械废弃导线的磁共振条件

• DOI: 10.1002/mrm.28967
• 发表时间: 2021
• 期刊: Magnetic Resonance in Medicine
• 影响因子: 3.3
• 作者: Wang, Yu;Guo, Ran;Hu, Wei;Zheng, Jianfeng;Wang, Qingyan;Jiang, Jay;Kurpad, Krishna K. N.;Kaula, Norbert;Long, Stuart;Chen, Ji
• 通讯作者: Chen, Ji

Body‐loop related MRI radiofrequency‐induced heating hazards: Observations, characterizations, and recommendations

身体循环相关 MRI 射频引起的加热危害：观察、特征和建议

• DOI: 10.1002/mrm.28954
• 发表时间: 2021
• 期刊: Magnetic Resonance in Medicine
• 影响因子: 3.3
• 作者: Yang, Xiaolin;Zheng, Jianfeng;Wang, Yu;Long, Stuart A.;Kainz, Wolfgang;Chen, Ji
• 通讯作者: Chen, Ji

Dual-Frequency High-Electric-Field Generator for MRI Safety Testing of Passive Implantable Medical Devices

用于无源植入医疗器械 MRI 安全测试的双频强电场发生器

• DOI: 10.1109/tmtt.2020.3030789
• 发表时间: 2020
• 期刊: IEEE Transactions on Microwave Theory and Techniques
• 影响因子: 4.3
• 作者: Song, Shuo;Zheng, Jianfeng;Wang, Yu;Wang, Qingyan;Kainz, Wolfgang;Long, Stuart A.;Chen, Ji
• 通讯作者: Chen, Ji

A Cascaded Heterogeneous Equivalent Network for Evaluating RF-Induced Hazards on Active Implantable Medical Devices

用于评估有源植入医疗设备上射频诱发危害的级联异构等效网络

• DOI: 10.1109/temc.2021.3121203
• 发表时间: 2021
• 期刊: IEEE Transactions on Electromagnetic Compatibility
• 影响因子: 2.1
• 作者: Liu, Jingshen;Wang, Yu;Guo, Ran;Wang, Qingyan;Zheng, Jianfeng;Kurpad, Krishna;Kainz, Wolfgang;Chen, Ji
• 通讯作者: Chen, Ji

A Fast and Accurate Transfer Function Validation Strategy Using Optimized Rotation-Invariant Lead Trajectories

• DOI: 10.1109/temc.2020.3039488
• 发表时间: 2021-06
• 期刊: IEEE Transactions on Electromagnetic Compatibility
• 影响因子: 2.1
• 作者: Yu Wang;Jianfeng Zheng;Qingyan Wang;Ji Chen;W. Kainz