I-Corps: Cutting Tool Wear Monitoring Sensor
I-Corps:切削刀具磨损监测传感器
基本信息
- 批准号:1926275
- 负责人:
- 金额:$ 5万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:2019
- 资助国家:美国
- 起止时间:2019-04-15 至 2020-02-29
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
The broader/commercial impact of this I-Corps project involves exploring the commercial potential of cutting tool wear monitoring sensors. Cutting tool manufacturers, machine tool manufacturers, and CNC machine operating companies can potentially benefit through improved cutting tool production processes and saving tooling time needed for production. There is a potential growing industrial customer need to accurately, precisely, and inexpensively sense and diagnose cutting tool wear, damage, and/or cutting edge quality. However, there are few reliable instruments available in the market with the required accuracy, resolution, cost, and on-machine usage. The proposed sensor allows for high-resolution monitoring and diagnosis of edge quality by providing quantitative information on morphological properties, including tool edge quality and wear related to abrasion, attrition, and chipping.This I-Corps project bridges a knowledge gap existing between the state-of-the-art instrumentation technologies and cutting tool inspection methods. Existing methods do not typically provide a quantitative measure to monitor the health of precision cutting tools in a convenient and time/cost-effective manner. The knife-edge interferometer developed in this project allows for precision cutting tool wear measurement and monitoring by providing quantitative information on morphological properties including abrasion, attrition, and chipping. This project enables a new cutting tool wear monitoring paradigm, producing new knowledge in instrumentation and characterization. This research will create a new transformative wear diagnosis principle for precision cutting tools to improve manufacturing reliability and the automation process.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
这个I-Corps项目的更广泛/商业影响包括探索切削刀具磨损监测传感器的商业潜力。切削刀具制造商、机床制造商和数控机床运营公司可以通过改进切削刀具生产工艺和节省生产所需的加工时间而受益。潜在的不断增长的工业客户需要准确、精确且廉价地感测和诊断切削刀具磨损、损坏和/或切削刃质量。然而,市场上很少有可靠的仪器具有所需的精度,分辨率,成本和机器使用。建议的传感器允许高分辨率的监测和诊断边缘质量的形态属性,包括工具的边缘质量和磨损相关的磨损,磨损,和chipping.This I-Corps项目之间存在的知识差距的桥梁国家的最先进的仪器技术和切削刀具检测方法提供定量信息。现有方法通常不提供定量测量以方便且时间/成本有效的方式监测精密切削工具的健康。在这个项目中开发的刀口干涉仪允许精密切削刀具磨损测量和监测提供定量信息的形态属性,包括磨损,磨损,和碎裂。该项目实现了一种新的切削刀具磨损监测模式,产生了仪器和表征方面的新知识。这项研究将为精密切削刀具创建一个新的变革性磨损诊断原则,以提高制造可靠性和自动化过程。该奖项反映了NSF的法定使命,并通过使用基金会的知识价值和更广泛的影响审查标准进行评估,被认为值得支持。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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ChaBum Lee其他文献
Multifunctional and flexible graphene oxide/silk sericin/carbon nanotube thin films on polyimide for real-time humidity sensing
聚酰亚胺上用于实时湿度传感的多功能柔性氧化石墨烯/丝胶蛋白/碳纳米管薄膜
- DOI:
10.1016/j.eurpolymj.2025.113731 - 发表时间:
2025-02-14 - 期刊:
- 影响因子:6.300
- 作者:
Chanui Lee;Hyeonho Cho;Jihye Choi;ChaBum Lee;Sangmin Lee;Dong Kyu Kim;Sunghan Kim - 通讯作者:
Sunghan Kim
Silicon-via (Si-via) hole metrology and inspection by grayfield edge diffractometry
通过灰场边缘衍射法进行硅通孔(Si-via)孔径测量和检测
- DOI:
10.1016/j.jmapro.2024.11.086 - 发表时间:
2025-01-17 - 期刊:
- 影响因子:6.800
- 作者:
Kuan Lu;Byunggi Kim;Masahiro Nomura;Jiyong Park;ChaBum Lee - 通讯作者:
ChaBum Lee
Qualitative Edge Topology Inspection and Interpretation by Enhanced Knife-Edge Interferometry
通过增强型刀口干涉测量法进行定性边缘拓扑检查和解释
- DOI:
- 发表时间:
2021 - 期刊:
- 影响因子:0
- 作者:
Zhikun Wang;ChaBum Lee - 通讯作者:
ChaBum Lee
Line-edge-roughness characterization of photomask patterns and lithography-printed patterns
- DOI:
10.1016/j.precisioneng.2024.02.006 - 发表时间:
2024-06-01 - 期刊:
- 影响因子:
- 作者:
Zhikun Wang;Pengfei Lin;Phuc Nguyen;Jingyan Wang;ChaBum Lee - 通讯作者:
ChaBum Lee
A first review of optical edge-diffraction technology for precision dimensional metrology
- DOI:
10.1007/s00170-019-03319-8 - 发表时间:
2019-02-01 - 期刊:
- 影响因子:3.100
- 作者:
ChaBum Lee - 通讯作者:
ChaBum Lee
ChaBum Lee的其他文献
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{{ truncateString('ChaBum Lee', 18)}}的其他基金
Collaborative Research: Data-Driven Metrology and Inspection Technology for Semiconductor Wafer-Level Manufacturing
合作研究:用于半导体晶圆级制造的数据驱动计量和检测技术
- 批准号:
2124999 - 财政年份:2021
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
Photomask Defect Inspection and Metrology for Semiconductor Lithography Technology
半导体光刻技术的光掩模缺陷检测和计量
- 批准号:
1855473 - 财政年份:2019
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
Collaborative Research: Improved Freeform Measurement through Fiber-based Metrology
合作研究:通过基于光纤的计量改进自由形状测量
- 批准号:
1902697 - 财政年份:2018
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
Collaborative Research: Edge Surface Topography Characterization for Precision Sensing Technology
合作研究:精密传感技术的边缘表面形貌表征
- 批准号:
1902686 - 财政年份:2018
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
Collaborative Research: Improved Freeform Measurement through Fiber-based Metrology
合作研究:通过基于光纤的计量改进自由形状测量
- 批准号:
1663210 - 财政年份:2017
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
Collaborative Research: Edge Surface Topography Characterization for Precision Sensing Technology
合作研究:精密传感技术的边缘表面形貌表征
- 批准号:
1463502 - 财政年份:2015
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
Collaborative Research: Edge Surface Topography Characterization for Precision Sensing Technology
合作研究:精密传感技术的边缘表面形貌表征
- 批准号:
1564254 - 财政年份:2015
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
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