SBIR Phase II: Radio-Frequency-Identification Based Seal & Packaging Methods To Eliminate Counterfeiting And Tampering Of Physical Goods

这个小企业创新研究(SBIR)第二阶段项目的更广泛影响将导致全球范围内假冒实物商品的减少，服务于包括制药、国防和其他行业在内的行业。假冒商品的泛滥正在以惊人的速度增长，2017年估计为1.2万亿美元，预计到2020年将达到1.8万亿美元。此外，每年约有30万儿童死于接受治疗疟疾、肺炎和其他疾病等食品的假药。拟议的技术将减轻假冒商品扩散给组织、政府和个人造成的经济损失，并改善与假冒或篡改商品风险相关的健康和安全。这一创新将制造成本低廉，并可广泛应用。此外，供应链中的任何人，即使是拥有普通智能手机的最终消费者，都可以确保使用这一创新技术的产品是真实的和未被篡改的。拟议的项目将继续开发一种新的射频识别(RFID)增强技术，将数字加密的概念应用于物理封条或产品包装，以检测屏障是否已被破坏。该项目将通过解决两个关键的开发和工程挑战来推动这项技术的发展。首先，该项目旨在将其目前的印刷电路板(PCB)体系结构微型化为单一专用集成电路(ASIC)。虽然印刷电路板架构可以正常工作，但其部件数量将减少95%。这将使每台设备的成本降低数量级，并确保适当的制造产量。其次，该项目将优化篡改传感方法的开发。该奖项反映了NSF的法定使命，并通过使用基金会的智力优势和更广泛的影响审查标准进行评估，被认为值得支持。

The broader impact of this Small Business Innovation Research (SBIR) Phase II project will result in a reduction of counterfeit physical goods on a global scale, serving industries including pharmaceutical, defense, and others. The proliferation of counterfeit goods is growing at an alarming rate, estimated at $1.2 trillion in 2017 and expected to reach $1.8 trillion by 2020. Furthermore, approximately 300,000 children die each year from receiving fake medicines to treat aliments such as malaria, pneumonia, and other diseases. The proposed technology will mitigate economic loss incurred from the proliferation of counterfeit goods for organizations, governments, and individuals, and improve the health and safety associated with the risk of counterfeit or tampered goods. This innovation will be inexpensive to manufacture and can be widely applied. Additionally, anyone in the supply chain, even an end-consumer with a common smart phone, can ensure that a product enabled with this innovation is authentic and untampered.The proposed project will continue development of a novel enhancement to Radio Frequency Identification (RFID) that applies the concept of digital encryption to a physical seal or product packaging to detect if the barrier has been compromised. The project will advance the development of this technology by addressing two key development and engineering challenges. First, the project aims to miniaturize its current Printed-Circuit-Board (PCB) architecture into a single Application Specific Integrated Circuit (ASIC). While the PCB architecture is functional, its part count will be reduced by 95%. This will provide an orders-of-magnitude reduction in per-device cost and ensure suitable manufacturing yields. Second, the project will optimize the development of a tamper-sensing method.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.