Collaborative Research: High-order Phonon Scattering and Highly Nonequilibrium Carrier Transport in Two-dimensional Electronic and Optoelectronic Materials

合作研究:二维电子光电材料中的高阶声子散射和高度非平衡载流子输运

基本信息

  • 批准号:
    2015954
  • 负责人:
  • 金额:
    $ 24.18万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2020
  • 资助国家:
    美国
  • 起止时间:
    2020-07-15 至 2023-09-30
  • 项目状态:
    已结题

项目摘要

Semiconductor research and development over the past several decades have enabled widespread use of electronic devices in society. However, the semiconductor industry is facing significant challenges, such as the difficulty in dissipating the large amount of heat generated in silicon electronic chips. The challenges have motivated the investigation of emerging two-dimensional (2D) electronic materials because of their superior electronic and thermal properties. One representative 2D material is graphene that is made of a single layer of carbon atoms. However, compared to the abundant knowledge of silicon electronics, there is only limited understanding of heat dissipation in 2D electronic materials. Therefore, the goal of this project is to establish an in-depth understanding of the distinctly different heat generation and dissipation processes in 2D materials and devices. The obtained knowledge will be used to develop open-source simulation tools, enhance online courses and classroom instruction, and develop hands-on outreach activities to improve the recruitment and training of a diverse population of next-generation workforce in thermal engineering.The goal of this project is to understand the unique fundamental mechanisms underlying heat generation and conduction processes in emerging 2D electronic and optoelectronic materials, including graphene and transition metal dichalcogenides (TMD). Specifically, three outstanding questions that are relevant to the performance and thermal reliability of 2D electronic and optoelectronic materials will be addressed: (1) the importance of four-phonon scattering processes in graphene and other 2D materials; (2) the length scales for different phonon polarizations and electronic excitations to establish local thermal equilibrium in 2D semiconductors; and (3) the phonon mode conversion and transmission processes across the dimensionally mismatched interfaces between a 2D layer and its 3D support. The questions will be addressed via first principles and atomistic theoretical calculations that resolve the modal scattering and coupling behaviors of phonons and electrons, in conjunction with thermal transport and inelastic light scattering measurements of graphene and TMD. Improved understanding of the three specific questions helps to build the foundation for modeling and controlling heat dissipation processes in 2D materials and devices.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
在过去的几十年中,半导体的研发已使社会中的电子设备广泛使用。但是,半导体行业面临着巨大的挑战,例如难以消除硅电子芯片中产生的大量热量。挑战激发了由于其优越的电子和热性能而对出现的二维(2D)电子材料进行研究。一种代表性的2D材料是石墨烯,由单层碳原子制成。但是,与对硅电子学的丰富知识相比,对2D电子材料中对热量耗散的了解有限。因此,该项目的目的是对2D材料和设备中截然不同的热量产生和耗散过程建立深入的理解。获得的知识将用于开发开源模拟工具,增强在线课程和课堂教学,并开发动手外展活动,以改善热量工程中各种下一代劳动力的招聘和培训。二分法(TMD)。具体而言,将解决与2D电子和光电材料的性能和热可靠性相关的三个杰出问题:(1)在石墨烯和其他2D材料中四频散射过程的重要性; (2)不同声子极化和电子激发的长度尺度,以在2D半导体中建立局部热平衡; (3)跨尺寸不匹配的界面及其3D支撑之间的尺寸不匹配的接口的声子模式转换和传输过程。这些问题将通过第一原理和原子理论计算解决,这些计算可以解决声子和电子的模态散射和耦合行为,并结合热传输和石墨烯和TMD的无弹性光散射测量。对这三个特定问题的了解得到了深入的了解,有助于建立建模和控制2D材料和设备中的散热过程的基础。该奖项反映了NSF的法定任务,并被认为是值得通过基金会的知识分子和更广泛影响的评估评估的评估来支持的。

项目成果

期刊论文数量(5)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Effects of hot phonons and thermal stress in micro-Raman spectra of molybdenum disulfide
  • DOI:
    10.1063/5.0122945
  • 发表时间:
    2022-06
  • 期刊:
  • 影响因子:
    4
  • 作者:
    Peter Sokalski;Zherui Han;G. Fleming;Brandon Smith;Sean E. Sullivan;R. Huang;X. Ruan;Li Shi
  • 通讯作者:
    Peter Sokalski;Zherui Han;G. Fleming;Brandon Smith;Sean E. Sullivan;R. Huang;X. Ruan;Li Shi
Prediction of hot zone-center optical phonons in laser-irradiated molybdenum disulfide with a semiconductor multitemperature model
  • DOI:
    10.1103/physrevb.107.l041407
  • 发表时间:
    2022-06
  • 期刊:
  • 影响因子:
    3.7
  • 作者:
    Zherui Han;Peter Sokalski;Li Shi;X. Ruan
  • 通讯作者:
    Zherui Han;Peter Sokalski;Li Shi;X. Ruan
Differential multi-probe thermal transport measurements of multi-walled carbon nanotubes grown by chemical vapor deposition
  • DOI:
    10.1016/j.ijheatmasstransfer.2023.124535
  • 发表时间:
    2023-02
  • 期刊:
  • 影响因子:
    5.2
  • 作者:
    Qi-jin Jia;Yuanyuan Zhou;Xun Li;L. Lindsay;Li Shi
  • 通讯作者:
    Qi-jin Jia;Yuanyuan Zhou;Xun Li;L. Lindsay;Li Shi
Raman Linewidth Contributions from Four-Phonon and Electron-Phonon Interactions in Graphene
  • DOI:
    10.1103/physrevlett.128.045901
  • 发表时间:
    2022-01-25
  • 期刊:
  • 影响因子:
    8.6
  • 作者:
    Han, Zherui;Yang, Xiaolong;Ruan, Xiulin
  • 通讯作者:
    Ruan, Xiulin
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Li Shi其他文献

The puzzle of migrant labour shortage and rural labour surplus in China
中国农民工短缺与农村劳动力剩余之谜
  • DOI:
    10.1016/j.chieco.2011.01.006
  • 发表时间:
    2011-12-01
  • 期刊:
  • 影响因子:
    6.8
  • 作者:
    Knight, John;Deng Quheng;Li Shi
  • 通讯作者:
    Li Shi
Modeling meso-scale-void formation during through-thickness flow in liquid composite molding
模拟液体复合材料成型中全厚度流动过程中细观尺度空隙的形成
  • DOI:
    10.3144/expresspolymlett.2020.7
  • 发表时间:
    2020
  • 期刊:
  • 影响因子:
    3.3
  • 作者:
    Yang Bo;Bi Fengyang;Wang Shilong;Ma Chi;Wang Sibao;Li Shi
  • 通讯作者:
    Li Shi
The Virtual Prototype Modeling Research of a Wind Tunnel Test Platform with Member Flexibility
构件柔性风洞试验平台虚拟样机建模研究
  • DOI:
    10.4028/www.scientific.net/amr.655-657.425
  • 发表时间:
    2013
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Lanlei Zhao;Wen Jia Chen;Li Shi;Luyang Li;Y. He
  • 通讯作者:
    Y. He
Land Rights Insecurity and Temporary Migration in Rural China Www.pse.ens.fr Land Rights Insecurity and Temporary Migration in Rural China
中国农村的土地权利不安全和临时移民 Www.pse.ens.fr 中国农村的土地权利不安全和临时移民
  • DOI:
  • 发表时间:
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Maëlys de la Rupelle;Quheng Deng;Shi Li;Vendryes;Thomas;Quheng Deng;Li Shi;M. Gurgand;Loren Brandt;M. Fournier;Sandra Poncet;A. Robilliard;Chris Udry;Sylvie Lambert;A. Safir;S. Démurger;M. Ravallion;Zhong Yuan
  • 通讯作者:
    Zhong Yuan
Tropical forcing of Australian extreme low minimum temperatures in September 2019
2019 年 9 月澳大利亚极端低温的热带强迫
  • DOI:
  • 发表时间:
    2021
  • 期刊:
  • 影响因子:
    4.6
  • 作者:
    E. Lim;H. Hendon;Li Shi;Catherine O. de Burgh;D. Hudson;A. King;B. Trewin;Morwenna Griffiths;A. Marshall
  • 通讯作者:
    A. Marshall

Li Shi的其他文献

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{{ truncateString('Li Shi', 18)}}的其他基金

Quantized Phonon Conductance of One-dimensional Systems
一维系统的量子化声子电导
  • 批准号:
    2231376
  • 财政年份:
    2024
  • 资助金额:
    $ 24.18万
  • 项目类别:
    Standard Grant
Collaborative Research: Thermal Transport via Four-Phonon and Exciton-Phonon Interactions in Layered Electronic and Optoelectronic Materials
合作研究:层状电子和光电材料中四声子和激子-声子相互作用的热传输
  • 批准号:
    2321302
  • 财政年份:
    2023
  • 资助金额:
    $ 24.18万
  • 项目类别:
    Standard Grant
Collaborative Research: FuSe: Heterogeneous Integration of III-Nitride and Boron Arsenide for Enhanced Thermal and Electronic Performance
合作研究:FuSe:III族氮化物和砷化硼的异质集成以增强热和电子性能
  • 批准号:
    2329107
  • 财政年份:
    2023
  • 资助金额:
    $ 24.18万
  • 项目类别:
    Continuing Grant
Workshop on Emerging Opportunities at the Intersection of Quantum and Thermal Sciences
量子与热科学交叉点的新兴机遇研讨会
  • 批准号:
    2136242
  • 财政年份:
    2021
  • 资助金额:
    $ 24.18万
  • 项目类别:
    Standard Grant
Collaborative Research: Hydrodynamic Thermal Transport in Graphitic Materials
合作研究:石墨材料中的流体动力热传输
  • 批准号:
    1707080
  • 财政年份:
    2017
  • 资助金额:
    $ 24.18万
  • 项目类别:
    Standard Grant
Probing Highly Non-equilibrium Thermal Transport in Nanostructures and Devices
探索纳米结构和器件中的高度非平衡热传输
  • 批准号:
    1336968
  • 财政年份:
    2013
  • 资助金额:
    $ 24.18万
  • 项目类别:
    Standard Grant
Workshop: The Seventh US-Japan Joint Workshop on Nanoscale Transport Phenomena, Izu, Japan, June 26-29, 2011
研讨会:第七届美日纳米尺度输运现象联合研讨会,日本伊豆,2011 年 6 月 26-29 日
  • 批准号:
    1125957
  • 财政年份:
    2011
  • 资助金额:
    $ 24.18万
  • 项目类别:
    Standard Grant
Collaborative Research: NSF/DOE Thermoelectric Partnership: High-Performance Thermoelectric Devices Based on Abundant Silicide Materials for Vehicle Waste Heat Recovery
合作研究:NSF/DOE 热电合作伙伴关系:基于丰富硅化物材料的高性能热电器件,用于汽车废热回收
  • 批准号:
    1048767
  • 财政年份:
    2010
  • 资助金额:
    $ 24.18万
  • 项目类别:
    Continuing Grant
High Throughput Nanoimprint Manufacturing of Shape-Specific, Stimuli-Responsive Polymeric Nanocarriers for Drug and Imaging Agent Delivery
用于药物和显像剂输送的形状特异性、刺激响应性聚合物纳米载体的高通量纳米压印制造
  • 批准号:
    0900715
  • 财政年份:
    2009
  • 资助金额:
    $ 24.18万
  • 项目类别:
    Standard Grant
Electronic Thermal Transport in Nanoscale Conductors
纳米级导体中的电子热传输
  • 批准号:
    0933454
  • 财政年份:
    2009
  • 资助金额:
    $ 24.18万
  • 项目类别:
    Standard Grant

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