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STTR Phase I: PIC: Electro-luminescence and doping of black phosphorus for printed lasers on silicon photonic chips

STTR Phase I: PIC: Electro-luminescence and doping of black phosphorus for printed lasers on silicon photonic chips
STTR 第一阶段:PIC:硅光子芯片上印刷激光器的电致发光和黑磷掺杂
批准号:
2136800
负责人:
Chad Husko
金额:
$25.6万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2021
资助国家:
美国
项目状态:
已结题
起止时间:
2021-12-01 至 2023-04-30

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中文摘要
翻译
这个小企业技术转移(STTR)第一阶段项目的更广泛的影响/商业潜力是证明使用印刷纳米材料油墨的硅光子学片上激光器的新制造工艺的可行性。制造片上多色激光器的可扩展方法的困难是硅光子学市场面临的主要挑战。具体来说,今天的标准制造光子芯片不包括片内激光器。如果没有集成激光引擎来驱动电路,光芯片的市场潜力就会受到设计和价格的限制。这里开发的技术可以让代工厂大规模生产激光芯片,并为硅光子学开辟多个新市场,包括可穿戴光子传感器、光学数据传输、自动车辆光探测和测距、量子信息、光纤陀螺仪,以及免疫分析测试和医学成像等医疗保健应用。这个小型企业技术转移第一阶段项目开发片上嵌入式激光器,使全功能硅光子芯片制造成为可能。目前,用于硅光子学的激光解决方案包括键合激光器和异质集成。组装硅光子学模块的系统集成商通常依赖于将单个激光器粘合到硅芯片上的繁琐方法,这使得成本居高不下,产量远低于预期水平。这里开发的光子油墨将通过晶圆级增材制造实现铸造激光解决方案,从而克服这一挑战。这种光子墨水可以发射覆盖可见光到近红外范围的广谱光,并且可以通过改变原子层的数量,在与不同市场相关的特定波长波段上进行定制。这个第一阶段项目的目标是演示由掺杂的,少层纳米材料制成的p-n结的电致发光。该奖项反映了美国国家科学基金会的法定使命,并通过使用基金会的知识价值和更广泛的影响审查标准进行评估,被认为值得支持。
英文摘要
The broader impact/commercial potential of this Small Business Technology Transfer (STTR) Phase I project is to demonstrate the viability of a new manufacturing process for on-chip lasers for silicon photonics using printed nanomaterial inks. The difficulty of a scalable method for fabricating on-chip, multi-color lasers is a major challenge for the silicon photonics market. Specifically, today's standard manufacturing of photonic chips does not include on-chip lasers. Without integration of laser engines to drive the circuits, the market potential of light chips is constrained by design and price. The technology developed here can allow foundries to mass produce chips with lasers and open multiple new markets for silicon photonics including wearable photonic sensors, optical data transfer, autonomous vehicle light detection and ranging, quantum information, fiber-optic gyroscopes, and healthcare applications such as immunoassay tests and medical imaging.This Small Business Technology Transfer Phase I project develops on-chip embedded lasers to enable fully functional silicon photonic chip manufacturing. Currently, the laser solutions being employed in silicon photonics include bonded lasers and heterogeneous integration. The system integrators that assemble silicon photonics modules rely on often cumbersome methods of gluing individual lasers to silicon chips, keeping costs high and throughput well below desired levels. The photonic inks developed here will overcome this challenge by enabling an in-foundry laser solution via wafer-scale additive manufacturing. The photonic ink emits broad-spectrum light covering the visible to the near-infrared range and can be tailored to emit at specific wavelength bands relevant to different markets by altering the number of atomic layers. The goals of this Phase I project are to demonstrate electroluminescence from a p-n junction made from doped, few-layer nanomaterials.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
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