SBIR Phase II: Photopolymer-based Microelectronic Device Transfer Process

这个小型企业创新研究（SBIR）第二阶段项目的更广泛的影响/商业潜力是使电子产品具有巨大的环境效益和社会价值，而这些产品在今天是无法经济地制造的。其中有三个重要的产品类别，可以通过互联网（物联网）实现日常设备的连接及其快速计算能力。首先，可穿戴设备（如智能手表、健康监测器或活动跟踪器）必须比当前版本更小、更薄（通常是灵活的）、更省电。其次，需要具有高亮度的低功耗、高分辨率显示器来可视化结果，即使在阳光直射下也是如此。第三，收集、管理和处理大型数据集的分散式计算机需要能够轻松管理传感器、处理信息和控制设备的设计，以支持智能城市、智能车辆、智能家居和智能应用。该项目的主要重点是实现下一代先进显示器，能够大幅节省能源，并具有更大的视觉吸引力。从广义上讲，这些结果对于实现三种产品类别中每一种的成本效益制造至关重要，这三种产品类别都面临芯片制造的根本挑战，需要在包装和组装方面进行创新，才能在规模上具有商业可行性。拟议的项目主要旨在使更好的显示器成为可能。人们普遍希望制造具有超小型发光二极管（LED）的显示器，从而实现更好的对比度和颜色、日光可视性、更长的寿命、更低的功耗和更低的成本。要做到这一点，必须克服目前尚未解决的芯片制造障碍。主要的障碍是一个成本效益的方法，以放置这样的小LED在所需的像素位置具有足够的精度。该项目的目标是满足这一需求，使用一种独特的非接触式光聚合物方法，以每秒数千个单位的高产量以+/-2 μ m的精度转移10 μ m芯片。该研究将涉及对工艺参数的系统研究，包括聚合物成分和特性、薄膜特性、预转移粘合工艺参数（温度、压力和时间）以及光学系统参数。产量将进行统计测量和改进。虽然证明实际产量需要全尺寸的生产设备，但满足行业要求的目标的可行性将尽可能在实验室规模的设备上得到证明。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase II project is to enable electronic products of great environmental benefit and social value which cannot be economically made today. Among these are three important product classes that can deliver on the promise of the connection of everyday devices via internet (Internet of Things) and their rapid computing power. First, wearable devices (such as smart watches, health monitors, or activity trackers) must be smaller, thinner (often flexible) and less power-hungry than current versions. Second, low-power, high resolution displays with high brightness are needed to visualize results, even in direct sunlight. Third, the decentralized computers which collect, manage and process large datasets require designs that can easily manage sensors, process information, and control devices to support smart cities, smart vehicles, smart homes, and smart applications. The primary focus of this project is to enable the next generation of advanced displays, capable of substantial energy savings coupled with greater visual appeal. Broadly, the results are critical for enabling the cost-effective manufacturing of each of the three product classes, which all suffer from fundamental challenges in chip manufacturing and require innovation in packaging and assembly to be commercially viable at scale.The proposed project is designed primarily to make better displays possible. There is a widespread desire to make displays with ultrasmall light-emitting diodes (LEDs), enabling better contrast and color, sunlight viewability, longer lifetimes, lower power consumption, and lower cost. To do so, currently unsolved chip fabrication obstacles must be overcome. The main impediment is a cost-effective approach to place such small LEDs at desired pixel positions with adequate precision. The objective of the project is to meet this need, using a unique non-contact photopolymer-based method which transfers 10 um die with +/- 2 um accuracy at many thousands of units per second with high yield. The research will involve systematic study of the parameters of the process, including polymer composition and characteristics, film characteristics, pre-transfer bonding process parameters (temperature, pressure and time), and optical system parameters. Yield will be measured statistically and improved. While demonstrating actual throughput requires full-scale production equipment, the feasibility of meeting industry required targets will be demonstrated to the extent possible on lab-scale equipment.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.