Shear thickening under high shear using bimodal dispersions

使用双峰分散体在高剪切下剪切增稠

• 批准号: 2154284
• 负责人: Matthew Liberatore
• 金额: $ 36.78万
• 依托单位: University of Toledo
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2022
• 资助国家: 美国
• 起止时间: 2022-07-01 至 2025-06-30
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2154284&HistoricalAwards=false
• 关键词: Shear; thickening; under; shear; using

Semiconductor manufacturing is an essential technology for US competitiveness in the global economy, especially as chip shortages continue to make headlines worldwide. Chemical Mechanical Polishing (CMP) is a critical processing technology that is used by the semiconductor industry to manufacture a wide variety of materials and devices, including wafers, logic devices, memory chips, and microelectronic machines (MEMs). The CMP process uses concentrated suspensions of stable particles that create abrasion and remove waste materials when polishing surfaces at very high shear rates. High shear processing is also critical in other manufacturing operations such as coating, spraying, and lubrication flows. Previous research in high shear rheology (10,000 s-1) has helped explain the underlying mechanisms leading to large increases in the viscosity of concentrated suspensions, which is commonly called shear thickening. This project will use a series of experiments to characterize the shear thickening behaviors of suspensions composed of mixtures of relatively small and large particles under a wide range of high shear conditions. Finding the mechanisms by which smaller and larger particles interact to modify and, in some cases, eliminate shear thickening under high shear conditions is an important, fundamental particle science problem. The goal of this project is to determine mechanisms underlying the dynamics of particle mixtures under flow in sufficient detail that findings can be generalized to other particle systems and flow types, including polishing, pipe, and nozzle flows. Using high shear rheology combined with scattering experiments to monitor structure formation in the suspension, the project has potential to demonstrate a new mechanism for high shear particle flow that can result in jamming of pipes and nozzles and the formation of defects in polishing. Ultimately, this research has potential to impact a wide range of industries, including large area silicon manufacturing for flat panel displays and solar cells, uniform application of paper filler and coatings, improved processing of soldering inks, ceramics, composites, and stabilization of time-release pharmaceutical formulations. The project will form the basis for training graduate and undergraduate students in the fields of rheology as well as particle and surface science. The project will also provide opportunities for middle and high school teachers to gain hands-on laboratory experience and to translate research to their classrooms.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

半导体制造是美国在全球经济中竞争力的关键技术，特别是在芯片短缺继续成为全球头条新闻的情况下。化学机械抛光（CMP）是半导体工业用来制造各种材料和器件（包括晶片、逻辑器件、存储器芯片和微电子机器（MEM））的关键处理技术。CMP工艺使用稳定颗粒的浓缩悬浮液，当在非常高的剪切速率下抛光表面时，这些颗粒产生磨损并去除废料。高剪切加工在其他制造操作中也是至关重要的，例如涂覆、喷涂和润滑流。先前在高剪切流变学（10，000 s-1）方面的研究有助于解释导致浓缩悬浮液粘度大幅增加的潜在机制，这通常被称为剪切增稠。该项目将使用一系列实验来表征由相对较小和较大颗粒的混合物组成的悬浮液在宽范围的高剪切条件下的剪切增稠行为。 寻找更小和更大的颗粒相互作用以改变并在某些情况下消除高剪切条件下的剪切增稠的机制是一个重要的基本颗粒科学问题。这个项目的目标是确定机制的动力学颗粒混合物下流动的足够详细的调查结果可以推广到其他颗粒系统和流动类型，包括抛光，管道和喷嘴流。使用高剪切流变学结合散射实验来监测悬浮液中的结构形成，该项目有可能展示高剪切颗粒流的新机制，该机制可能导致管道和喷嘴堵塞以及抛光缺陷的形成。最终，这项研究有可能影响广泛的行业，包括平板显示器和太阳能电池的大面积硅制造，纸张填料和涂层的均匀应用，焊接油墨，陶瓷，复合材料的改进处理以及定时释放药物制剂的稳定化。 该项目将成为培养流变学以及颗粒和表面科学领域的研究生和本科生的基础。该项目还将为初中和高中教师提供机会，以获得动手实验室的经验，并将研究成果转化到他们的课堂上。该奖项反映了NSF的法定使命，并已被认为是值得通过使用基金会的智力价值和更广泛的影响审查标准进行评估的支持。