SBIR Phase I: Development of a Chip Technology for Cheaper and Easier Photonic Device Manufacturing

SBIR 第一阶段：开发芯片技术以实现更便宜、更容易的光子器件制造

• 批准号: 2304400
• 负责人: Juniyali Nauriyal
• 金额: $ 27.5万
• 依托单位: PHOTONECT INTERCONNECT SOLUTIONS INC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-06-15 至 2024-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2304400&HistoricalAwards=false
• 关键词: SBIR; Phase; Development; Chip; Technology

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase I project is the advancement of manufacturing technologies for industries such as telecommunications, data communications, sensors. and defense. Most of the internet relies on data centers to process data, and this processing is accomplished via a device called an optical transceiver. These transceivers house an optical fiber, which is as thin as a single strand of human hair, attached to a chip device to transfer information to/from the data centers. The optical fiber is so small that it is very difficult to precisely connect the fiber to the chip, often resulting in performance losses. With 100,000 transceivers per data center and 2,700 data centers in the United States, it is important to have good fiber connection for reduced power consumption and increased performance. Technology companies are also looking for chips with multiple fibers, making the need for better fiber placement even greater. In this project, the company focuses a new technology that makes fiber placement on a chip faster, more accurate, and cheaper. This new technology uses a special component that enables fiber placement with precision while improving the device performance 4 times. This Small Business Innovation Research (SBIR) Phase I project addresses major pain points for optical transceiver companies: cost and time to package an optical fiber to a silicon photonic chip. The proposed product consists of a fusion splicing machine and a novel silicon dioxide mode converter. The mode converter localizes heat from the laser, enabling fusion while simultaneously decreasing the loss level. This technology packages silicon photonic devices without compromising performance. It significantly improves packaging speed from 10 minutes to 2 minutes, increases power efficiency by 4X, and provides a 50% savings. The company has demonstrated coupling losses lower than the industry standard of 3 dB on specialty chips. The research objectives involve improving coupling losses to around 1 dB, demonstrating splicing with foundry chips, and improving the strength of the fusion splice for improved reliability. The completion of these objectives will result in extremely low loss photonic packaging applicable for use with foundry chips, increasing the commercialization potential of the technology. This technology will enable customers to package single or multi-fiber devices with high efficiency, low cost, and at high volumes, ultimately increasing production capacity across many industries.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这项小型企业创新研究（SBIR）I期项目的更广泛的影响/商业潜力是针对电信，数据通信，传感器等行业的制造技术的进步。和防御。大多数互联网都依靠数据中心来处理数据，并且该处理是通过称为光学收发器的设备来完成的。这些收发器容纳了一种光纤，该光纤与单链人的头发一样薄，该光纤连接到芯片设备上，以将信息传输到数据中心/从数据中心传输。光纤是如此之小，以至于很难将纤维精确地连接到芯片上，通常会导致性能损失。每个数据中心有100,000个收发器，在美国有2,700个数据中心，重要的是要具有良好的纤维连接，以减少功耗和提高性能。技术公司还在寻找具有多种纤维的芯片，因此需要更大的纤维放置。在该项目中，该公司集中了一项新技术，该技术使纤维放置在芯片上的速度更快，更准确和更便宜。这项新技术使用了一种特殊的组件，该组件可以精确地放置光纤，同时改善设备性能4次。这项小型企业创新研究（SBIR）I阶段项目介绍了光学收发器公司的主要疼痛点：将光纤将光纤包装到硅光子芯片中的成本和时间。提出的产品由融合剪接机和新型二氧化硅模式转换器组成。模式转换器将热量从激光器定位，同时降低损耗水平，从而实现融合。该技术包装硅光子设备而不会损害性能。它可显着提高包装速度，从10分钟到2分钟，将功率效率提高4倍，并节省50％。该公司的耦合损失低于专业芯片上3 dB的行业标准。研究目标涉及将耦合损失提高到1 dB左右，证明使用铸造芯片剪接，并提高融合剪接的强度以提高可靠性。这些目标的完成将导致非常低的光子包装适用于铸造芯片，从而增加了技术的商业化潜力。这项技术将使客户能够包装具有高效率，低成本和大量的单纤维设备，最终提高了许多行业的生产能力。该奖项反映了NSF的法定任务，并被认为是通过基金会的知识分子优点和更广泛的影响审查标准通过评估来进行评估的。