SBIR Phase I: Development of a Chip Technology for Cheaper and Easier Photonic Device Manufacturing

SBIR 第一阶段：开发芯片技术以实现更便宜、更容易的光子器件制造

• 批准号: 2304400
• 负责人: Juniyali Nauriyal
• 金额: $ 27.5万
• 依托单位: PHOTONECT INTERCONNECT SOLUTIONS INC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-06-15 至 2024-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2304400&HistoricalAwards=false
• 关键词: SBIR; Phase; Development; Chip; Technology

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase I project is the advancement of manufacturing technologies for industries such as telecommunications, data communications, sensors. and defense. Most of the internet relies on data centers to process data, and this processing is accomplished via a device called an optical transceiver. These transceivers house an optical fiber, which is as thin as a single strand of human hair, attached to a chip device to transfer information to/from the data centers. The optical fiber is so small that it is very difficult to precisely connect the fiber to the chip, often resulting in performance losses. With 100,000 transceivers per data center and 2,700 data centers in the United States, it is important to have good fiber connection for reduced power consumption and increased performance. Technology companies are also looking for chips with multiple fibers, making the need for better fiber placement even greater. In this project, the company focuses a new technology that makes fiber placement on a chip faster, more accurate, and cheaper. This new technology uses a special component that enables fiber placement with precision while improving the device performance 4 times. This Small Business Innovation Research (SBIR) Phase I project addresses major pain points for optical transceiver companies: cost and time to package an optical fiber to a silicon photonic chip. The proposed product consists of a fusion splicing machine and a novel silicon dioxide mode converter. The mode converter localizes heat from the laser, enabling fusion while simultaneously decreasing the loss level. This technology packages silicon photonic devices without compromising performance. It significantly improves packaging speed from 10 minutes to 2 minutes, increases power efficiency by 4X, and provides a 50% savings. The company has demonstrated coupling losses lower than the industry standard of 3 dB on specialty chips. The research objectives involve improving coupling losses to around 1 dB, demonstrating splicing with foundry chips, and improving the strength of the fusion splice for improved reliability. The completion of these objectives will result in extremely low loss photonic packaging applicable for use with foundry chips, increasing the commercialization potential of the technology. This technology will enable customers to package single or multi-fiber devices with high efficiency, low cost, and at high volumes, ultimately increasing production capacity across many industries.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这个小企业创新研究（SBIR）第一阶段项目的更广泛的影响/商业潜力是电信、数据通信、传感器等行业的制造技术的进步。和国防。大多数互联网依赖于数据中心来处理数据，而这种处理是通过一种称为光收发器的设备来完成的。这些收发器装有一根像人类头发一样细的光纤，连接在芯片设备上，用于向数据中心和数据中心之间传输信息。光纤非常小，很难将光纤精确地连接到芯片上，往往会造成性能损失。在美国，每个数据中心有100,000个收发器，而数据中心有2,700个，因此拥有良好的光纤连接对于降低功耗和提高性能非常重要。科技公司也在寻找具有多种光纤的芯片，这使得对更好的光纤放置的需求更加迫切。在这个项目中，该公司专注于一项新技术，使光纤在芯片上的放置更快、更准确、更便宜。这项新技术使用了一种特殊的组件，可以精确地放置光纤，同时将设备性能提高4倍。这个小型企业创新研究（SBIR）第一阶段项目解决了光收发器公司的主要痛点：将光纤封装到硅光子芯片的成本和时间。所提出的产品由融合拼接机和新型二氧化硅模式转换器组成。模式转换器将来自激光的热量定位，使聚变成为可能，同时降低损耗水平。该技术在不影响性能的情况下封装硅光子器件。它显着将封装速度从10分钟提高到2分钟，将功率效率提高4倍，并提供50%的节省。该公司已经证明，在特种芯片上的耦合损耗低于3db的行业标准。研究目标包括将耦合损耗降低到1db左右，展示与代工芯片的拼接，以及提高融合拼接的强度以提高可靠性。这些目标的完成将导致极低损耗的光子封装适用于代工芯片，增加该技术的商业化潜力。该技术将使客户能够以高效率、低成本和大批量封装单光纤或多光纤设备，最终提高许多行业的生产能力。该奖项反映了美国国家科学基金会的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。