Conference: The First International Symposium on Integrated Magnetics (iSIM-1)

会议：第一届国际集成磁学研讨会（iSIM-1）

• 批准号: 2309935
• 负责人: Nian Sun
• 金额: $ 1.5万
• 依托单位: Northeastern University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-03-01 至 2024-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2309935&HistoricalAwards=false
• 关键词: Conference; First; International; Symposium; Integrated

With the rapid progress in the research and development of magnetic materials, devices, and microsystems for sensors, memories, power, radio frequency, microwave, and millimeter wave electronics, there are great new opportunities for integrated magnetics in IoT, 5G, smartphones, etc. The iSIM (International Symposium on Integrated Magnetics) series are started to serve the fast-growing needs of the IEEE Magnetics Society to reach out to other IEEE societies and industries and bring the science and technology on magnetics to the market and the public. The iSIM will foster scientific discussion and catalyze innovation and partnerships to significantly enhance our understanding of the challenges and potential solutions to integrating magnetic materials on Si substrates and PCBs (print circuit boards). The iSIM-1, and the future annual iSIM symposiums, will call attention to the IEEE Magnetics Society and the public on the topics of integrated magnetics. Integrated magnetics is a key topic for semiconductor technologies, well aligned with The CHIPS and Science Act, a national strategic and historic investment to surge production of American-made semiconductors, tackle supply chain vulnerabilities to make more goods in America, revitalize America’s scientific research and technological leadership, and strengthens America’s economic and national security at home and abroad. Magnetic materials on Si and on PCBs, if realized, can lead to magnetic inductors and transformers on-chip or in package with significantly reduced sizes and costs, and improved performance. Despite the significant progress of research on magnetic materials and devices, integrated magnetic inductors and transformers have not been applied on commercial RFICs (radio frequency integrated circuits), and rarely on power integrated circuits. Surface mount discrete components are widely used in power management circuits and RFICs, leading to significant costs and sizes, etc. There is a critical need for a symposium on integrated magnetics such as iSIM. The proposed iSIM-1 will be the first satellite symposium being organized for May 14-15, 2023, in conjunction with the IEEE International Magnetics Conference (INTERMAG) 2023 in Sendai, Japan, being held from May 15 ~ 19, 2023. INTERMAG is the premier international conference on fundamental and applied magnetism but has limited bandwidth to cover topics on integrated magnetics. The iSIM-1 will be at the same venue as the INTERMAG 2023, with focused coverage on topics for integrated magnetics for power supply on chip (PWRSOC), power supply in package (PWRSIP), RFICs, on-chip magnetic sensors, flexible magnetic electronics, magnetic memory, etc. It is expected that the iSIM will be held continuously every year as a satellite symposium of the future INTERMAG conferences. A key output of iSIM-1 will be high-impact, multi-disciplinary position papers with direct implications for integrated magnetics. The iSIM-1 will foster discussion and identify innovations for the next frontier of magnetic materials and devices for integrated circuits, on-chip magnetic sensors, flexible magnetic electronics, magnetic memory, etc. At the same time, iSIM-1 will provide ample training opportunities for U.S. nationals with a focus on underrepresented groups, including women and minority students.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

随着用于传感器、存储器、功率、射频、微波和毫米波电子的磁性材料、器件和微系统的研究和开发的快速进展，物联网、5G、智能手机、等等，iSIM（国际集成磁性研讨会）系列开始服务于快速-IEEE磁学协会的需求不断增长，需要与其他IEEE协会和行业联系，并将磁学科学和技术推向市场和公众。iSIM将促进科学讨论并促进创新和合作伙伴关系，以显着增强我们对在Si衬底和PCB（印刷电路板）上集成磁性材料的挑战和潜在解决方案的理解。iSIM-1和未来的年度iSIM研讨会将引起IEEE磁学协会和公众对集成磁学主题的关注。集成磁性是半导体技术的一个关键主题，与CHIPS和科学法案保持一致，这是一项国家战略和历史性投资，旨在增加美国制造的半导体产量，解决供应链漏洞，在美国制造更多产品，振兴美国的科学研究和技术领导地位，并加强美国国内外的经济和国家安全。如果实现Si和PCB上的磁性材料，则可以导致芯片上或封装中的磁性电感器和变压器，其具有显著减小的尺寸和成本以及改进的性能。 尽管磁性材料和器件的研究取得了重大进展，但集成磁电感和变压器尚未应用于商业RFIC（射频集成电路），更很少应用于功率集成电路。表面贴装分立元件广泛应用于电源管理电路和RFIC，导致成本和尺寸显著增加等。拟议中的iSIM-1将是2023年5月14日至15日组织的第一次卫星研讨会，与2023年5月15日至19日在日本仙台举行的IEEE国际磁学会议（INTERMAG）2023一起举办。INTERMAG是基础磁学和应用磁学的主要国际会议，但带宽有限，无法涵盖集成磁学的主题。iSIM-1将与INTERMAG 2023在同一地点举行，重点报道片上电源（PWRSOC）集成磁性器件、封装电源（PWRSIP）、RFIC、片上磁传感器、柔性磁电子器件、磁存储器等主题。预计iSIM将作为未来INTERMAG会议的卫星研讨会每年持续举办。iSIM-1的一个关键产出将是高影响力的多学科立场文件，对集成磁性有直接影响。iSIM-1将促进讨论，并确定用于集成电路，片上磁传感器，柔性磁性电子器件，磁性存储器等的磁性材料和器件的下一个前沿的创新。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。