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Conference: The First International Symposium on Integrated Magnetics (iSIM-1)

Conference: The First International Symposium on Integrated Magnetics (iSIM-1)
会议:第一届国际集成磁学研讨会(iSIM-1)
批准号:
2309935
负责人:
Nian Sun
金额:
$1.5万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2023
资助国家:
美国
项目状态:
已结题
起止时间:
2023-03-01 至 2024-08-31

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中文摘要
翻译
随着传感器、存储器、电源、射频、微波和毫米波电子的磁性材料、器件和微系统的研究和开发的快速发展,物联网、5G、智能手机等领域的集成磁学面临着巨大的新机遇。iSIM(国际集成磁学研讨会)系列的启动是为了满足IEEE磁学学会快速增长的需求,接触其他IEEE社会和行业,将磁学科学技术推向市场和公众。ISIM将促进科学讨论并促进创新和合作伙伴关系,以显著提高我们对在硅衬底和印刷电路板(印刷电路板)上集成磁性材料的挑战和潜在解决方案的理解。ISIM-1和未来的年度iSIM研讨会将引起IEEE磁学协会和公众对集成磁学主题的关注。集成磁学是半导体技术的一个关键话题,与芯片和科学法案很好地结合在一起,这是一项国家战略和历史性投资,旨在大幅提高美国制造半导体的产量,解决供应链漏洞,在美国制造更多商品,重振美国的科学研究和技术领先地位,并加强美国国内外的经济和国家安全。硅和印刷电路板上的磁性材料如果实现,可以导致磁电感和变压器在芯片上或在封装中显著减小尺寸和成本,并提高性能。尽管磁性材料和器件的研究取得了长足的进步,但集成的磁电感和变压器还没有应用于商业射频集成电路,更很少应用于功率集成电路。表面贴装分立元件广泛应用于电源管理电路和RFIC中,导致成本和尺寸等方面的巨大问题。迫切需要召开一次关于集成磁性元件(如iSIM)的研讨会。拟议中的ISIM-1将是2023年5月14日至15日与2023年5月15日至19日在日本仙台举行的2023年IEEE国际磁学会议(INTERMAG)同时举办的第一次卫星研讨会。INTERMAG是基础和应用磁学的主要国际会议,但涉及集成磁学的主题的带宽有限。ISIM-1将与INTERMAG 2023在同一地点举行,重点讨论用于芯片上电源(PwrSoC)、封装电源(PWRSIP)、RFIC、片上磁传感器、柔性磁电子学、磁存储器等主题的集成磁学。预计iSIM将作为未来INTERMAG会议的卫星研讨会每年连续举行。ISIM-1的一个关键输出将是对集成磁学有直接影响的高影响力、多学科的立场论文。ISIM-1将促进讨论并确定集成电路、片上磁性传感器、柔性磁性电子学、磁存储器等磁性材料和器件的下一个前沿领域的创新。同时,iSIM-1将为美国国民提供充足的培训机会,重点是未被充分代表的群体,包括女性和少数族裔学生。该奖项反映了NSF的法定使命,并通过使用基金会的智力优势和更广泛的影响审查标准进行评估,被认为值得支持。
英文摘要
With the rapid progress in the research and development of magnetic materials, devices, and microsystems for sensors, memories, power, radio frequency, microwave, and millimeter wave electronics, there are great new opportunities for integrated magnetics in IoT, 5G, smartphones, etc. The iSIM (International Symposium on Integrated Magnetics) series are started to serve the fast-growing needs of the IEEE Magnetics Society to reach out to other IEEE societies and industries and bring the science and technology on magnetics to the market and the public. The iSIM will foster scientific discussion and catalyze innovation and partnerships to significantly enhance our understanding of the challenges and potential solutions to integrating magnetic materials on Si substrates and PCBs (print circuit boards). The iSIM-1, and the future annual iSIM symposiums, will call attention to the IEEE Magnetics Society and the public on the topics of integrated magnetics. Integrated magnetics is a key topic for semiconductor technologies, well aligned with The CHIPS and Science Act, a national strategic and historic investment to surge production of American-made semiconductors, tackle supply chain vulnerabilities to make more goods in America, revitalize America’s scientific research and technological leadership, and strengthens America’s economic and national security at home and abroad. Magnetic materials on Si and on PCBs, if realized, can lead to magnetic inductors and transformers on-chip or in package with significantly reduced sizes and costs, and improved performance. Despite the significant progress of research on magnetic materials and devices, integrated magnetic inductors and transformers have not been applied on commercial RFICs (radio frequency integrated circuits), and rarely on power integrated circuits. Surface mount discrete components are widely used in power management circuits and RFICs, leading to significant costs and sizes, etc. There is a critical need for a symposium on integrated magnetics such as iSIM. The proposed iSIM-1 will be the first satellite symposium being organized for May 14-15, 2023, in conjunction with the IEEE International Magnetics Conference (INTERMAG) 2023 in Sendai, Japan, being held from May 15 ~ 19, 2023. INTERMAG is the premier international conference on fundamental and applied magnetism but has limited bandwidth to cover topics on integrated magnetics. The iSIM-1 will be at the same venue as the INTERMAG 2023, with focused coverage on topics for integrated magnetics for power supply on chip (PWRSOC), power supply in package (PWRSIP), RFICs, on-chip magnetic sensors, flexible magnetic electronics, magnetic memory, etc. It is expected that the iSIM will be held continuously every year as a satellite symposium of the future INTERMAG conferences. A key output of iSIM-1 will be high-impact, multi-disciplinary position papers with direct implications for integrated magnetics. The iSIM-1 will foster discussion and identify innovations for the next frontier of magnetic materials and devices for integrated circuits, on-chip magnetic sensors, flexible magnetic electronics, magnetic memory, etc. At the same time, iSIM-1 will provide ample training opportunities for U.S. nationals with a focus on underrepresented groups, including women and minority students.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
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FuSe/Collaborative Research: Heterogeneous Integration in Power Electronics for High-Performance Computing (HIPE-HPC)
  • 批准号:
    2329062
  • 项目类别:
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  • 资助金额:
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  • 财政年份:
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Collaborative Research: PIPP Workshop: Pandemic Readiness for Emerging Pathogens(PREP) to be Held February 15-19, 2021.
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NCS-FO: Nanomagnetic Stimulation Capability for Neural Investigation and Control
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  • 负责人:
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国内基金
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