Model-based ultrasonic imaging for dimensional measurements of cracks within heterogeneous composite structures (C09)

嵌入的压电陶瓷模块和周围的无源材料之间的不希望出现的裂缝会导致智能复合材料结构中机电耦合的降低。因此，异质结构正在失去功能，不再满足要求。TP C09子项目解决了这些裂纹的非破坏性定位以及通过超声波显微镜测量其横向延伸的尺寸。为了达到所需的空间分辨率，考虑了超声换能器的压力场，并建立了合适的模型。目标是对裂纹对智能复合材料结构功能的影响进行定性和定量的评估。

Undesired cracks between embedded piezoceramic modules and the surrounding passive material cause a decreasing electromechanical coupling within smart composite structures. As a result, the heterogeneous structures are losing functionality and do not meet the requirements anymore. The subproject TP C09 addresses non-destructive localization of those cracks as well as the dimensional measurement of their lateral extension by means of ultrasonic microscopy. To achieve the necessary spatial resolution, the pressure field of the ultrasonic transducer is considered with an appropriate model. The goal is the qualitative as well as quantitative assessment of the impact of cracks on the functionality of smart composite structures.