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Extrusion of electrically conductive, thermoplastic films and ultrasonic embossing to electronic circuits

Extrusion of electrically conductive, thermoplastic films and ultrasonic embossing to electronic circuits
将导电热塑性薄膜挤出并通过超声波压花形成电子电路
批准号：
272137833
负责人：
Professor Dr.-Ing. Christian Hopmann
金额：
$0.0万
依托单位：
Institut für Kunststoffverarbeitung (IKV) in Industrie und Handwerk an der RWTH Aachen
依托单位国家：
德国
项目类别：
Research Grants
财政年份：
2015
资助国家：
德国
项目状态：
已结题
起止时间：
2014-12-31 至 2018-12-31
来源：
https://gepris.dfg.de/gepris/projekt/272137833?language=en
关键词：
Extrusionelectricallyconductivethermoplasticfilms

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中文摘要
翻译
该项目的目标是在导电热塑性塑料的复合和挤出领域创造知识。通过这种方法，可以生产出具有可调节导电性的薄膜。这些薄膜可以通过超声波压印来生产贴片电路板。SMD是在压花过程中集成的。因此，生产过程更加精简。此外，由于避免了腐蚀性化学废物，并且不再需要焊料，因此可持续性得到改善。
英文摘要
Aim of the project, is the creation of knowledge in the field of compounding and extrusion of electrically conductive thermoplastics. By that, films with an adjustable conductivity are producible. These films can be used to produce circuit boards with mounted SMD via ultrasonic embossing. The SMD are integrated during the embossing process itself. Hence, the production process is leaner. Additionally, the sustainability is improved, since corrosive chemical waste is avoided and solder is not necessary anymore.
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Interactions in laser joining of metals to polymers
Development of a databased model for the prediction of effective mechanical and thermal properties of injection-moulded semi-crystalline thermoplastics by means of an artificial neural network (KNN) taking into account the microstructure
Analysis and modeling of the damage behavior of long-fibre-reinforced semi-crystalline thermoplastics considering fibre length and fibre curvature
Simulation of the development of the microstructure of injection-moulded semi-crystalline thermoplastics by means of a multi-scale approach under consideration of shear-induced crystal forms (alpha and beta)
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