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Health assessment of smart patches on hygrothermalpiezoelectric lightweight structures

Health assessment of smart patches on hygrothermalpiezoelectric lightweight structures
湿热压电轻质结构智能贴片的健康评估
批准号:
277522030
负责人:
Professor Dr.-Ing. Wilfried Becker
金额:
$0.0万
依托单位:
依托单位国家:
德国
项目类别:
Research Grants
财政年份:
2015
资助国家:
德国
项目状态:
未结题
起止时间:
2014-12-31 至 --

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中文摘要
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英文摘要
The aim of the proposed research work is to quantify the effect of electrical and static load, temperature and moisture as well on the interface delamination of a basic structural layer with a patch (disposed up on the layer) as a part of energy industrial devices, or to consider the health assessment of a smart lightweight structure with repairing function in automotive and aircraft industries or a basic element in solar panels. Moreover the considered configuration will allow the selection of a criterion for the clear connection between electric gradient and interface debond length. On this basis it makes reason to choose the optimal geometry, material and physical properties and loading by means of a genetic algorithm to estimate its reliability.The novelty of the project is in development of an efficient package of knowledge including (a) mechanical models, analytical solutions and their interpretations; (b) creating the Fortran programs for the calculation of the interface debond lengths for the health assessment of the smart lightweight structure, consisting in a hygrothermalpiezoelectric layer with one patch under combined mechanical and physical load or using Mathematica, MATCAD, etc.; (c) a possible criterion for detecting interface debond length, (d) optimal choice of geometry and material characteristics on the basis of genetic algorithm in regard of the reliability of the structure considered.
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