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Analysis and extension of the limits of application in metal forming based recycling of aluminum chips

铝屑金属成型回收应用局限性分析与拓展

基本信息

批准号：
284095688
负责人：
Professor Dr.-Ing. A. Erman Tekkaya
金额：
--
依托单位：
Institut für Umformtechnik und Leichtbau (IUL)
依托单位国家：
德国
项目类别：
Research Grants
财政年份：
2016
资助国家：
德国
起止时间：
2015-12-31 至 2018-12-31
项目状态：
已结题

来源：
https://gepris.dfg.de/gepris/projekt/284095688?language=en
关键词：
Analysis extension limits application metal

项目摘要

Due to the high potential of improving the resource efficiency, the direct recycling of aluminum alloy machining chips by hot extrusion is a promising alternative to the energy intense remelting of the chips with subsequent casting. It was shown in a previous research project that the bulk metal forming process of hot extrusion is capable of producing extrudates based on aluminum alloy machining chips having mechanical properties comparable to extruded cast material. The aim of the proposed project is to overcome the process limits of chip extrusion. For an extended applicability of the chip-based extrudates, further research is necessary to determine the dynamic mechanical behavior and the mechanical properties of extrudates fabricated from chips depending on the type and direction of load. Currently, it is not possible to predict the resulting mechanical properties of chip-based extrudates depending on the hot extrusion parameters. In order to predict the interdependency of hot extrusion parameters, state variables and the resulting mechanical properties, the development of a holistic numerical model of the chip extrusion process is aspired. In order to influence the state variables and to increase the quality of chip welding, both aiming on improving the mechanical properties of the chip-based extrudates, the hot extrusion dies are redesigned based on numerical results of the developed model.

由于提高资源效率的潜力很大，通过热挤压直接回收铝合金加工切屑是一种有前途的替代方案，以高能量重熔的芯片与随后的铸造。在先前的研究项目中表明，热挤压的块体金属成形工艺能够生产基于铝合金机加工切屑的挤压件，其具有与挤压铸造材料相当的机械性能。拟议项目的目的是克服芯片挤出的工艺限制。为了扩展基于芯片的挤出物的适用性，需要进一步的研究来确定由芯片制造的挤出物的动态机械行为和机械性能，这取决于负载的类型和方向。目前，它是不可能的，以预测所得到的基于芯片的挤出物的机械性能取决于热挤压参数。为了预测热挤压参数，状态变量和由此产生的机械性能的相互依赖性，芯片挤压过程的整体数值模型的发展是渴望。为了影响状态变量和提高芯片焊接质量，都旨在提高芯片基挤出物的力学性能，热挤压模具的数值计算结果的基础上重新设计的发展模型。