SiGeSn-Nanostructures for Integrated Quantum Well Infrared Photodetectors

该项目的目标是制造和表征基于n型SiGeSn异质结构的cmos兼容量子阱红外光电探测器，工作在中红外和远红外波长范围内，并可能应用于基于吸收的气体传感和成像。先前基于群- iv量子阱红外探测器的研究主要集中在利用SiGe多量子阱结构，但其光响应无法与基于III-V异质结构量子阱的商用器件相竞争。通过利用三元合金SiGeSn更大的物理参数可调性，我们打算扩展基于iv族探测器的潜力，以展示具有低制造成本的量子阱红外光电探测器，可以直接与CMOS信号调理电路接口，用于开发超紧凑的集成传感解决方案。为此，我们计划通过实验研究相关的材料特性，如三元合金的带隙和带偏移，这些特性到目前为止还没有得到充分的了解。器件实现将基于从材料生长到器件制造过程的理论建模和实验数据。

The project goal is the fabrication and characterization of CMOS-compatible quantum-well infrared photodetectors based on n-type SiGeSn heterostructures operating in the mid-infrared and far-infrared wavelength ranges with possible applications in absorption-based gas sensing and imaging. Previous work on Group-IV based quantum well infrared photodetectors focused on utilizing SiGe multi-quantum well structures, however, the photoresponse cannot compete with commercial devices based on III-V heterostructure quantum wells. By exploiting the larger physical parameter tunability of the ternary alloy SiGeSn we intend to extend the potential of Group-IV-based detectors to demonstrate quantum-well infrared photodetectors with low manufacturing costs that can be interfaced directly with CMOS signal conditioning circuits for the development of ultra-compact integrated sensing solutions. To this end, we plan to experimentally investigate relevant material properties such as bandgap and band offsets of the ternary alloys, which, to date, are not sufficiently understood. Device realization will then be based on theoretical modelling and experimental data from material growth to the device fabrication process.