Analysis of bonding mechanisms in iron copper compound casting products

金属复合材料具有复杂的性能特征，这是整体产品无法实现的。双金属局部地具有单块材料的特性。在整体结构之间具有平坦界面的复合材料中，粘结机制可以是多种多样的。已知的机制是混合晶体的形成、扩散、结构和多晶型转变以及微正接触。复合铸造是一种生产金属复合材料的节能和资源节约型技术。高工艺温度通过激活粘结机制支持连接。铁铜复合材料通过将黑色金属的高强度和低价格与铜合金的导热性和导电性以及抗菌效果相结合而具有相当大的经济和技术重要性。由于目前的技术水平，对复合铸造生产的铁铜复合材料的结合机理缺乏全面的了解。该研究项目的重点是系统地分析材料和工艺边界条件，键合机制和键合性能之间的相关性。基于这些因果链，定义了一个模型来预测键合特性。铁铜复合材料是通过重力压铸生产的。一个固体铁镶嵌连接到铜铸造材料。在实验设计中，边界条件是变化的。通过力学、光学和热测试方法，从微观结构、结合强度和界面厚度等方面分析了该复合材料的界面特性。热力学和动力学计算以及力学模拟有助于理解键合机制。

Metallic composites have a complex property profile, that can’t be achieved by monolithic products. Bimetals locally feature the characteristic monolithic material behaviour. Bonding mechanisms in composites with flat interface between the monolithic structures can be manifold. Known mechanisms are the formation of mixed crystals, the diffusion, the structural and polymorphic transformation and the micro-positive contact. Compound casting constitutes an energy- and resource-efficient technology for the production of metallic composites. High process temperatures support the joining by activating bonding mechanisms. Iron copper composites assume considerable economical and technical importance by combining the high strength and low price of a ferrous metal with the thermal and electrical conductivity and the antimicrobial effect of a copper alloy. Due to the current state of the art there is a lack of comprehensive understanding of the bonding mechanisms in iron copper composites produced by compound casting. This research project focuses on the systematic analysis of correlations between the material and process boundary conditions, the bonding mechanisms and the bonding properties. Based on these cause and effect chains a model is defined to predict the bonding character. The iron copper composite is produced by gravity die casting. A solid ferrous inlay is connected to a copper cast material. Within the design of experiments boundary conditions are varied. The interface character of the bimetallic composites is analysed by means of mechanical, optical and thermal testing methods with regard to its microstructure, bonding strength and interface thickness. Thermodynamic and kinetic calculations as well as mechanical simulations help to understand the bonding mechanisms.