Analysis of bonding mechanisms in iron copper compound casting products

金属复合材料具有复杂的性能特征，这是单片产品无法实现的。双金属局部表现出单片材料的特性。在单片结构之间具有平面界面的复合材料中，键合机制是多种多样的。已知的机制是混合晶体的形成、扩散、结构和多态转变以及微正接触。复合铸造是一种能源和资源高效的金属复合材料生产技术。高温通过激活键合机制来支持连接。铁铜复合材料结合了铁金属的高强度和低价格以及铜合金的导热性和导电性以及抗菌效果，具有相当大的经济和技术重要性。由于目前的技术水平，对复合铸造生产的铁铜复合材料的结合机制缺乏全面的了解。本研究项目侧重于系统分析材料和工艺边界条件、键合机制和键合性能之间的相关性。基于这些因果链，定义了一个模型来预测键合特性。铁铜复合材料是通过重力压铸生产的。固体铁嵌体连接到铜铸造材料上。在实验设计中，边界条件是变化的。采用力学、光学和热测试等方法对双金属复合材料的微观结构、结合强度和界面厚度进行了界面特性分析。热力学和动力学计算以及力学模拟有助于理解键合机制。

Metallic composites have a complex property profile, that can’t be achieved by monolithic products. Bimetals locally feature the characteristic monolithic material behaviour. Bonding mechanisms in composites with flat interface between the monolithic structures can be manifold. Known mechanisms are the formation of mixed crystals, the diffusion, the structural and polymorphic transformation and the micro-positive contact. Compound casting constitutes an energy- and resource-efficient technology for the production of metallic composites. High process temperatures support the joining by activating bonding mechanisms. Iron copper composites assume considerable economical and technical importance by combining the high strength and low price of a ferrous metal with the thermal and electrical conductivity and the antimicrobial effect of a copper alloy. Due to the current state of the art there is a lack of comprehensive understanding of the bonding mechanisms in iron copper composites produced by compound casting. This research project focuses on the systematic analysis of correlations between the material and process boundary conditions, the bonding mechanisms and the bonding properties. Based on these cause and effect chains a model is defined to predict the bonding character. The iron copper composite is produced by gravity die casting. A solid ferrous inlay is connected to a copper cast material. Within the design of experiments boundary conditions are varied. The interface character of the bimetallic composites is analysed by means of mechanical, optical and thermal testing methods with regard to its microstructure, bonding strength and interface thickness. Thermodynamic and kinetic calculations as well as mechanical simulations help to understand the bonding mechanisms.