PVD cluster tool

微米和纳米系统研究需要一个三室集群工具，用于共溅射金属、反应溅射层（如AlN和金属氧化物）的沉积和蒸发。通过将这些工艺组合成一个集群，可以将不同的工艺应用于晶片而不损失真空。目前还没有类似的系统，但对未来的研究是必要的。鲁尔大学波鸿微系统技术教授职位成立于2017年。这位前材料和纳米电子学主席曾在1平方厘米的基板上工作，唯一可用的PVD工艺是蒸发。我们提供合适的洁净室，目前已扩展至200 mm晶圆处理。金属在MEMS中起着布线、加热元件和温度传感器的关键作用，几乎所有微系统工艺都要求金属具有可重现的参数。纳米厚度的镍和铝等金属的多层体系也是MEMS组装中反应焊接的一种有趣的新选择。反应溅射层，特别是氮化铝（AlN），是功能薄膜的重要改进。AlN具有化学和机械稳定性，并具有压电特性，它以c轴取向沉积。它应用于驱动器以及能量采集器，并允许在硅上实现高度稳定的膜系统。 蒸发与预结构化模板的组合导致一种自组织纳米结构的掠射角沉积。它们在应用于微系统时表现出独特的性质。这些性质不能通过溅射来达到。所要求的集群涵盖了MEMS的所有三种基本物理沉积工艺，并允许在不离开真空的情况下存款任意组合的层。安全地防止了源以及衬底的表面氧化。其中一个腔室将携带一个反向溅射蚀刻工具，用于在第一次沉积发生之前进行基板清洁。该系统设计用于100 - 200 mm晶圆直径，因为它必须与结合原子层沉积、原子层蚀刻、反应离子蚀刻和等离子体增强化学气相沉积的2D材料集群工具兼容。该集群目前在BMBF ForLab计划（ForLab项目PICT 2DES）内建立，旨在用于200 mm晶圆。它有一个接口到Forschungsfabrik Mikroelektronik Deutschland。

Micro- and nanosystems research requires a three-chamber cluster tool for the deposition of co-sputtered metals, reactive sputter layers such as AlN and metal oxides and evaporation. By combining those processes into a cluster, the different processes can be applied to a wafer without loss of vacuum. A comparable system is not yet available, but necessary for future research. The Chair for microsystems technology at Ruhr-Universität Bochum was established in 2017. The former Chair for materials and nanoelectronics has worked on substrates of 1 cm2 size, and the only available PVD process was evaporation. A suitable clean room is available and is currently extended for 200 mm wafer handling.Metals play a key role as wiring, heating elements and temperature sensors for MEMS and are required with reproducible parameters for almost all microsystems processes. Multi-layer systems from metals such as nickel and aluminium at nanometer thickness are also an interesting new alternative for a reactive soldering in the assembly of MEMS.Reactively sputtered layers, especially aluminium nitride (AlN), are an important amendment of functional thin films. AlN is chemically and mechanically stable and exhibits piezoelectric properties, it is deposited with c-axis orientation. It is applied in actuators as well as energy harvesters and allows also highly stable membrane systems on silicon. Evaporation in combination with pre-structured templates causes a kind of glancing angle deposition of self-organizing nanostructures. They show unique properties when applied to microsystems. These properties cannot be reached by sputtering. The requested cluster covers all three basic physical deposition processes for MEMS and allows to deposit arbitrary combinations of layers without leaving the vacuum. The surface oxidation of the sources as well as of the substrates is prevented safely. One of the chambers will carry an inverse sputter etching tool for substrate cleaning before the first deposition takes place. The system is designed for 100 – 200 mm wafer diameter as it has to be compatible to a cluster tool for 2D materials combining atomic layer deposition, atomic layer etching, reactive ion etching and plasma-enhanced chemical vapour deposition. This cluster is currently established within the BMBF ForLab initiative (ForLab-project PICT2DES) and intended for use with 200 mm wafers. It has an interface to the Forschungsfabrik Mikroelektronik Deutschland.