Transien Liquid Phase Bonding of Aluminum Alloy-Based Composites Using Thin Film as Insert Metal

以铜薄膜为插入金属的Al_2O_3颗粒增强A6061合金基复合材料的瞬态液相键合铜薄膜是铝合金基复合材料TLP键合的最佳插入金属。在铜箔厚度为0.5 ~ 3.0 mm，键合温度为570℃，键合时间为0.3ks，压力为1.0 mpa的条件下，接头的力学性能达到最佳。与Cu薄膜结合的复合材料接头在抗拉强度方面与母材基本相同。焊接后对接头进行T6热处理，提高了接头的抗拉强度。采用Cu薄膜防止了Al_2O_3颗粒在界面上的偏析。ii .以Cu薄膜为插入金属的SiC颗粒增强AC3A合金基复合材料与AC3A的瞬态液相结合当铜箔厚度为3.0 mm，连接温度为560℃，连接时间为0.6ks，连接压力为19.6 mpa时，接头的力学性能达到最佳。由于Al-Cu共晶液相共存，导致Coase - Si颗粒在键合界面处偏析。

I.Transient Liquid Phase Bonding of Al_2O_3 Particle Reinforced A6061 Alloy-Based Composites Using Copper Thin Film as Insert Metal1.Copper thin film was oputimal for the insert metal of TLP bonding of the aluminum alloy based composites.2.Maximum Mechanical properties of joints were obtaind by the following conditions : Cu foil thickness of 0.5-3.0mum, bonding temperature 570ﾟC,bonding time of 0.3ks, and pressure of 1.0MPa.3.The joint of composites bonded with Cu thin film has been almost the same as the base metal in point of the tensile strength.4.Tensile strength of the joint were increased by T6 heat treatment after bonding.5.The segregation of Al_2O_3 particles at the bobd interface were prevented by using thin Cu film.II.Transient Liquid Phase Bonding of SiC Particle Reinforced AC3A Alloy-Based Composite to AC3A Using Copper Thin Film as Insert Metal1.Maximum mechanical properties of joints were obtaind by the following conditions : Cu foil thickness of 3.0mum, bonding temperature 560ﾟC,bonding time of 0.6ks, and pressure of 19.6MPa.2.Coase Si particles were segregated at the bond interface result from coexisting of Al-Cu eutectic liquid phase.