Sputter Deposition Cluster Tool

为了制造记忆器件，需要一种高效的用于研究和中试生产的PVD系统。该系统旨在实现各种磁性和非磁性材料的溅射沉积，以及适用于氧化物和氮化物层的反应溅射工艺。为此，该系统应同样适用于导电和非导电/绝缘、磁性和非磁性衬底和衬底材料。具体地说，需要一个有5个独立真空室的系统：一个装载室，一个真空机器人传送室，2个溅射室，总共有6个溅射源(一个用于研究项目，另一个用于中试生产)，用于隧道屏障的氧化室，带有集成的射频偏置，用于衬底清洗。工艺方向应为溅射沉积结构。每个腔都需要一个专用的涡轮分子泵系统。采用共焦磁控溅射电源，采用直流、脉冲直流和射频电源，可以实现薄膜的沉积。可控制的工艺气体入口和可操纵的6英寸衬底平台(旋转、加热、冷却、射频偏置、梯度孔径)也被要求开发用于记忆器件的新型功能层。需要单独可调整的目标/衬底间距，以允许在晶片上沉积具有良好均匀性的薄层。可拆卸的不锈钢挡泥板旨在帮助减少工艺腔内表面不必要的涂层。此外，所要求的系统应通过用户可编程的自动配方控制涂布过程进行控制。这应该允许具有记忆器件的可重复制造。

For the fabrication of memristive devices an efficient PVD system for research and pilot productions is requested. The system is intended to enable the sputter deposition of various magnetic and non-magnetic materials, as well as to be suitable for reactive sputtering processes of oxide and nitride layers. For this purpose, the system should be equally usable for conductive and non-conductive / insulating, magnetic and non-magnetic substrates and substrate materials. Specifically, a system is being requested with 5 independent vacuum chambers: one load look chamber, one vacuum robotic transfer chamber, 2 sputtering chambers with a total of 6 sputtering sources (one used for research projects and the second for pilot production), oxidation chamber for tunnel barriers with integrated RF bias for substrate cleaning. The process direction should be in the sputter-down configuration. A dedicated turbomolecular pumping system for each chamber is desired. The layer deposition should be possible by confocal magnetron sputtering sources with DC, pulsed DC and RF supply. A controllable process gas inlet and manipulatable 6-inch substrate stages (rotating, heating, cooling, RF bias, gradient aperture) are also requested to develop novel functional layers for memristive devices. Individually adjustable target / substrate spacing is desired to allow the deposition of thin layers with a good homogeneity over the wafer. Removable stainless steel fenders are designed to help reduce unwanted coating on the inner process chamber surfaces. In addition, the requested system should be controlled via an automatic, recipe-controlled coating process, which is programmable by the user. This should allow to have a reproducible fabrication of memristive devices.