Elastomeric Polydimethylsiloxane Endcaps to Achieve Solubility and Melt-Processability in DPP-based Polymer Semiconductors

弹性聚二甲基硅氧烷端盖可实现 DPP 基聚合物半导体的溶解度和熔融加工性能

基本信息

项目摘要

Polymer semiconductors (PSCs) combining high charge carrier mobility with superior mechanical properties and solution-processability are ideal candidates to achieve large-area electronic applications on flexible substrates, e.g. displays, sensors or photovoltaics. The electronic performance of PSCs improved considerably in the recent years, and state-of-the-art donor-acceptor (D-A) polymers now routinely achieve charge carrier mobilities exceeding 1 cm2 V-1s-1, the classic benchmark of amorphous silicon. Yet the control over the physical properties of the materials did not progress at the same rate, and current high performance PSCs suffer from a range of shortcomings closely related to the conjugated molecular structure and well-stacked morphology which bestow record-setting charge carrier mobilities: They are strongly aggregated, leading to brittle films and limiting flexible applications, and are furthermore poorly soluble, causing batch-to-batch variations in polymer synthesis and poor reproducibility of device fabrication. Solution-deposition of these materials usually requires elevated temperatures, dilute solutions, and halogenated solvents, conditions which are hampering cost-efficient printing processes. An even more interesting fabrication approach would be the solvent-free processing from polymer melt, which would eliminate toxic solvents from the process and grant higher reproducibility and morphology control. Yet while melt-processing is a standard technique in many fields of polymer research and processing, only few melt-processable D-A PSCs were obtained and investigated so far. So far, the tuning of the physical properties of PSCs, such as solubility, melting point and tensile modulus, is explored by either modifying the backbone or the side chains. Endcap engineering could be a new strategic pathway to improve physical properties, e.g. solubility, tune mechanical characteristics, e.g. stretchability, and enable the melt-processing of PSCs. In this project, we will endcap state-of-the-art diketopyrrolopyrrole (DPP) based PSCs with elastomeric polydimethylsiloxane (PDMS) chains, and investigate the resulting second order block co-polymers physico-chemically, electrically and with regards to their morphology and phase separation. The elastomer-endcapped PSCs are expected to exhibit enhanced solubility and, for higher PDMS-to-PSC ratios, melt-processability.
聚合物半导体(PSC)结合了高电荷载流子迁移率与优异的上级机械性能和溶液可加工性,是在柔性基板上实现大面积电子应用的理想候选物,例如显示器、传感器或光致发光器件。近年来,PSC的电子性能得到了相当大的改善,并且最先进的供体-受体(D-A)聚合物现在通常实现超过1 cm 2 V-1 s-1的电荷载流子迁移率,这是非晶硅的经典基准。然而,对材料的物理性质的控制并没有以相同的速度发展,并且目前的高性能PSC遭受与共轭分子结构和良好堆叠的形态密切相关的一系列缺点,这些结构和形态赋予了创纪录的电荷载流子迁移率:它们强烈聚集,导致脆性膜并限制柔性应用,此外溶解性差,导致聚合物合成中批次间的变化和器件制造的再现性差。这些材料的溶液沉积通常需要高温、稀溶液和卤化溶剂,这些条件阻碍了成本效益高的印刷工艺。一种更有趣的制造方法是从聚合物熔体中进行无溶剂加工,这将消除工艺中的有毒溶剂,并提供更高的再现性和形态控制。然而,尽管熔融加工是聚合物研究和加工的许多领域中的标准技术,但迄今为止仅获得并研究了少数可熔融加工的D-A PSC。到目前为止,PSC的物理性质,如溶解度,熔点和拉伸模量的调整,探索通过修改主链或侧链。端帽工程化可以是改善物理性质(例如溶解性)、调整机械特性(例如拉伸性)并使PSC能够熔融加工的新的战略途径。在这个项目中,我们将用弹性体聚二甲基硅氧烷(PDMS)链封端最先进的二酮基吡咯并吡咯(DPP)PSC,并研究所得的二阶嵌段共聚物的物理化学,电学以及它们的形态和相分离。预期所述聚合物封端的PSC表现出增强的溶解性,并且对于较高的PDMS与PSC比率,表现出熔融加工性。

项目成果

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Professorin Dr. Franziska Lissel其他文献

Professorin Dr. Franziska Lissel的其他文献

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使用激光等离子体软 X 射线对聚二甲基硅氧烷进行直接微加工
  • 批准号:
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通过聚二甲基硅氧烷接枝共聚物的相分离形成透气通道。
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