Study of Specimen Sizes Needed for Estimating Strength of Dissimilar Joint

估算异种接头强度所需试样尺寸的研究

• 批准号: 04650669
• 负责人: TERASAKI Toshio
• 金额: $ 1.09万
• 依托单位: Kyushu Institute of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for General Scientific Research (C)
• 财政年份: 1992
• 资助国家: 日本
• 起止时间: 1992 至 1993
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-04650669/
• 关键词: Dissimilar Joint; Estimating Strength; Specimen Sizes; Resin; Shear Test; Tensile Test; Exfoliation Temperature; 界面強度; インプラント試験片; エネルギー解放率; 境界要素法

Experiments on removing temperature at an interface of bonded joint have been made for estimating the joint strength of dissimilar materials and the effect of specimen sized on the strength. The joint was made by a resin curing on a steel. The removing temperature was measured by a thermo-couple and a visual observation. It is shown from the experimental results that the removing temperature becomes constant when the width of resin is greater than 8 times as long as the thickness of resin and the thickness of steel is greater than twice as long as that of resin. The energy release rate g -value of a virtual crack length, which exists within the singular field in the vicinity of the corner caused by a combination of dissimilar materials and a wedge angle, is useful parameter for predicting the removing temperature.

为了估算异种材料的接头强度以及试件尺寸对接头强度的影响，进行了接头界面脱温实验。接头是由树脂固化在钢上制成的。采用热电偶和目测相结合的方法测量了去除温度。实验结果表明，当树脂宽度大于树脂厚度的8倍，钢材厚度大于树脂厚度的2倍时，去除温度趋于恒定。虚拟裂纹长度的能量释放率g值是预测去除温度的有用参数，它存在于由不同材料和楔形角组合而成的拐角附近的奇异场内。

项目成果

寺崎 俊夫: "異材接合継手の剥離温度に及ぼす試験片寸法の影響" 日本機械学会論文集(A編). 59. 2717-2722 (1993)

Toshio Terasaki：“试样尺寸对异种金属接头剥离温度的影响”日本机械工程师学会会刊（A 版）59. 2717-2722 (1993)。

寺崎 俊夫,秋山 哲也: "異材継手の界面強度に関する基礎的研究" 溶接学会論文集. 10. 291-296 (1992)

Toshio Terasaki、Tetsuya Akiyama：“异种金属接头界面强度的基础研究”日本焊接学会会议录 10. 291-296 (1992)。

寺崎 俊夫: "異材接合界面の強度評価方法の提案" 日本金属学会誌. 57. 699-705 (1993)

Toshio Terasaki：“异种材料粘合界面强度评估方法的提案”日本金属学会杂志 57. 699-705 (1993)。

T.TERASAKI: "Model for Estimating of Interfacial Strength of Bonded Dissimilar Materials" J.Japan Inst.Metals. Vol.57, No.6. 699-705 (1993)

T.TERASAKI：“粘合异种材料界面强度的估算模型”J.Japan Inst.Metals。

T.TERASAKI: "Effect of Specimen Sizes on Exfoliation Temperature of Joint Bonded from Two Dissimilar Materials" Trans.JSME. Vol.59, No.567. 2717-2722 (1993)

T.TERASAKI：“样本尺寸对两种不同材料粘合接头剥离温度的影响”Trans.JSME。