Temperature Difference for Exfoliation of Three-Dimensional Bonded Joint of Dissimilar Materials

异种材料三维粘接接头剥离的温差

• 批准号: 07650846
• 负责人: TERASAKI Toshio
• 金额: $ 1.15万
• 依托单位: Kyushu Instutute of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 1995
• 资助国家: 日本
• 起止时间: 1995 至 1996
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-07650846/
• 关键词: Thermal Stress; Interface Strength; Joint; Dissimilar Materials; G-value; Estimation of Strength; 界面

Experiments on the temperature difference for exfoliation of a three-dimensional joint have been performed to investigate crack initiation and the difference between two-and three-dimensional joints (2D and 3D) using specimens made from resin and steel. When the edge angle is less than 90 degrees, a crack initiates as the side ; therefore, the temperature difference for exfoliation of the 3D joint equals that for exfoliation of the 2D joint. When the edge angle is greater than or equal to 90 degrees, a crack initiates at the corner and the temperature difference of the 3D joint is slightly less than that of the 2D joint.

实验上的温度差剥离的三维接头已经进行了调查裂纹的萌生和两个和三维接头（2D和3D）之间的差异，使用由树脂和钢制成的标本。当棱角小于90度时，裂纹从侧面开始;因此，3D接头剥落的温差等于2D接头剥落的温差。当棱角大于或等于90度时，裂纹在拐角处开始，并且3D接头的温差略小于2D接头的温差。

项目成果

寺崎,秋山,栗山: "三次元界材接合体の剥離温度差について" 日本機械学会論文集. 61. 2393-2398 (1995)

Terasaki、Akiyama、Kuriyama：“关于三维界面材料接合体的剥离温度差”日本机械工程学会会刊 61. 2393-2398 (1995)。

Terasaki,Akiyama: "Temperatune Difference for Exfoliation of 3D Bonded Joint" JSME International Journal. A,40,1. 51-57 (1997)

Terasaki、Akiyama：“3D 粘合接头剥离的温差”JSME 国际期刊。

寺崎,秋山,栗山: "三次元異材接合体の剥離温度差について" 日本機械学会論文集. 61. 2393-2398 (1995)

Terasaki、Akiyama、Kuriyama：“关于三维异种金属接头中的剥离温度差”日本机械工程师学会会刊 61. 2393-2398 (1995)。

寺崎,秋山,果山: "Temperature Difference for Exfaliation of 3D Bonded Joint" JSME International Journal. A,40,No1. 51-57 (1997)

Terasaki、Akiyama、Kayama：“3D 粘合接头膨胀的温度差异”JSME 国际杂志 A，40，No1（1997）。

Toshio Terasaki: "Temperature Difference for Exfoliation of Three-Dimensional Bonded Joint of Dissimilar Materials" JSME International Journal. A-49. 51-57 (1997)

Toshio Terasaki：“异种材料三维粘合接头剥离的温差”JSME 国际期刊。