Fun2D+ | 3D functional mesoscopic system based on 2D materials

有趣的2D |

• 批准号: 441728806
• 负责人: Dr.-Ing. Matthias Albert
• 金额: --
• 依托单位: Institut für Halbleiter- und Mikrosystemtechnik (IHM)
• 依托单位国家: 德国
• 项目类别: Research Grants
• 资助国家: 德国
• 项目状态: 未结题
• 来源: https://gepris.dfg.de/gepris/projekt/441728806?language=en
• 关键词: Fun2D+; 3D; functional; mesoscopic; system

The miniaturization of functional systems continues to be achieved by increasing the integration density of the individual system components. However, little exploited so far in the field of monolithic integration is the third geometric dimension. For a long time, there has been a desire to achieve higher packing density with system-in-package, system-on-chip, and other 3D packaging concepts, but packaging and substrate materials dominate current system designs. The aim of this proposal is to build a significantly higher integrated system consisting of power supply, data processing, sensor system and data transmission. For this purpose, the non-conventional method of MEMS origami will be used. This method allows integration of all necessary components in the 2-dimensional state and subsequent transformation of it into the much more compact 3-dimensional state. The internal volume of the final 3-dimensional structure will be used for elements that are usually difficult to miniaturize, such as energy supply (e.g., 3-dimensional coils) and energy storage (capacitors). In order to enable highly miniaturized systems with low energy consumption and highly functional 2-dimensional materials are consistently used as a future-oriented technology platform for electronics.

通过增加各个系统组件的集成密度，不断实现功能系统的小型化。然而，迄今为止，在单片集成领域中，第三几何维度的开发还很少。长期以来，人们一直希望通过封装系统、片上系统和其他 3D 封装概念来实现更高的封装密度，但封装和基板材料主导着当前的系统设计。该提案的目的是建立一个由电源、数据处理、传感器系统和数据传输组成的高度集成的系统。为此，将使用非常规的MEMS折纸方法。该方法允许集成 2 维状态中的所有必要组件，并随后将其转换为更紧凑的 3 维状态。最终 3 维结构的内部体积将用于通常难以小型化的元件，例如能量供应（例如 3 维线圈）和能量存储（电容器）。为了实现具有低能耗和高功能的高度小型化系统，二维材料始终被用作面向未来的电子技术平台。