Fun2D+ | 3D functional mesoscopic system based on 2D materials

功能系统的小型化继续通过增加单个系统组件的集成密度来实现。然而，迄今为止，在单片集成领域很少开发的是第三几何维度。长期以来，人们一直希望利用系统级封装、片上系统和其他3D封装概念来实现更高的封装密度，但是封装和衬底材料主导当前的系统设计。该提案的目的是建立一个更高的集成系统，包括电源，数据处理，传感器系统和数据传输。为此，将使用MEMS折纸的非常规方法。这种方法允许在2维状态下集成所有必要的组件，并随后将其转换为更紧凑的3维状态。最终三维结构的内部体积将用于通常难以分解的元件，例如能量供应（例如，3-三维线圈）和能量存储（电容器）。为了实现具有低能耗和高功能的高度小型化系统，二维材料一直被用作面向未来的电子技术平台。

The miniaturization of functional systems continues to be achieved by increasing the integration density of the individual system components. However, little exploited so far in the field of monolithic integration is the third geometric dimension. For a long time, there has been a desire to achieve higher packing density with system-in-package, system-on-chip, and other 3D packaging concepts, but packaging and substrate materials dominate current system designs. The aim of this proposal is to build a significantly higher integrated system consisting of power supply, data processing, sensor system and data transmission. For this purpose, the non-conventional method of MEMS origami will be used. This method allows integration of all necessary components in the 2-dimensional state and subsequent transformation of it into the much more compact 3-dimensional state. The internal volume of the final 3-dimensional structure will be used for elements that are usually difficult to miniaturize, such as energy supply (e.g., 3-dimensional coils) and energy storage (capacitors). In order to enable highly miniaturized systems with low energy consumption and highly functional 2-dimensional materials are consistently used as a future-oriented technology platform for electronics.