Fun2D+ | 3D functional mesoscopic system based on 2D materials

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The miniaturization of functional systems continues to be achieved by increasing the integration density of the individual system components. However, little exploited so far in the field of monolithic integration is the third geometric dimension. For a long time, there has been a desire to achieve higher packing density with system-in-package, system-on-chip, and other 3D packaging concepts, but packaging and substrate materials dominate current system designs. The aim of this proposal is to build a significantly higher integrated system consisting of power supply, data processing, sensor system and data transmission. For this purpose, the non-conventional method of MEMS origami will be used. This method allows integration of all necessary components in the 2-dimensional state and subsequent transformation of it into the much more compact 3-dimensional state. The internal volume of the final 3-dimensional structure will be used for elements that are usually difficult to miniaturize, such as energy supply (e.g., 3-dimensional coils) and energy storage (capacitors). In order to enable highly miniaturized systems with low energy consumption and highly functional 2-dimensional materials are consistently used as a future-oriented technology platform for electronics.