STUDIES ON COMPOSIT PLATING AS A FABRICATING PROCESS FOR FUNCTIONAL THIN FILM

复合电镀作为功能薄膜制造工艺的研究

• 批准号: 06650805
• 负责人: HAYASHI Hidetaka
• 金额: $ 1.28万
• 依托单位: OKAYAMA UNIVERSITY
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for General Scientific Research (C)
• 财政年份: 1994
• 资助国家: 日本
• 起止时间: 1994 至 1995
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-06650805/
• 关键词: composit plating; dispersion coating; codeposition

Composite coating gives various functional properties, such as wear resistance, self-lubricating, corrosion or oxidation resistance etc.to the plated surface. Although the composite coatings are used in many industrial processes, the mechanism of codeposition of dispersoid is not fully elucidated.In this research project, the following results were obtained ; At first, the dependence of the codeposition of oxide particles, such as titanium dioxide particles, on the kind and the amount of adsorbed mental ion was elucidated. An acid copper sulfate bath with titanium dioxide particles was mainly used for this investigation. The surface OH group of the titanium dioxide particle reacts with Cu^<2+> in the bath, which results in H^+ production and the adsorption of Cu^<2+> on the particle. This reaction depends both on the concentration of Cu^<2+> and on the pH of the solution. It was found that the amount of codeposited titanium dioxide increased with increasing pH of the bath, which indicates that the amount of codepositing particles depends upon the amount of Cu^<2+> adsorbed on the particle. Relation between the codeposition behavior and the nature of depositing metal ion is also discussed.

复合镀层赋予镀层各种功能特性，如耐磨性、自润滑性、抗腐蚀性或抗氧化性。etc.to虽然复合镀层在许多工业过程中得到了应用，但分散体共沉积的机理还没有完全阐明，本研究取得了以下结果：首先，阐明了氧化物颗粒如二氧化钛颗粒的共沉积与吸附金属离子的种类和量的关系。本研究主要使用含二氧化钛颗粒的酸性硫酸铜浴。二氧化钛颗粒表面的OH基团与镀液中的Cu^<2+>反应，产生H^+，并使Cu^<2+>吸附在颗粒上。该反应取决于Cu^<2+>的浓度和溶液的pH值。结果发现，共沉积的二氧化钛的量随着镀液pH值的增加而增加，这表明共沉积颗粒的量取决于吸附在颗粒上的Cu^<2+>的量。并讨论了共沉积行为与沉积金属离子性质的关系。

项目成果

林 秀孝: "分散めっきにおける共析機構" 表面技術. 45. 1250-1253 (1994)

Hidetaka Hayashi：“分散电镀中的共析机制”表面技术 45. 1250-1253 (1994)。