Fabrication of specifically organized composite film by using anisotropic graphite particle

利用各向异性石墨颗粒制备特定组织复合薄膜

• 批准号: 18560696
• 负责人: HAYASHI Hidetaka
• 金额: $ 2.46万
• 依托单位: Okayama University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2006
• 资助国家: 日本
• 起止时间: 2006 至 2007
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-18560696/
• 关键词: Composite plating; graphite; specifically ordered structure; 粒子の疎水性; 電位差滴定法

The electrodeposition of Cu-graphite composite film from copper sulfate bath containing graphite particle has been studied. The graphite particles were oxidized with nitric acid in order to introduce surface oxides. The role of the functional groups on the graphite edge during Cu-graphite composite plating was evaluated by the potentiometric titration method. The titration curve obtained in the presence of graphite particles and that without graphite particles crossed over each other at the pH2.45 which is probably pKa of the compound in the presence of Cu^<2+>in the bath. However, this value is found to be lower than the pH3in the same solution without Cu^<2+>ion. This phenomena might be recognized by the adsorption of Cu^<2+>ion on the functional group of the graphite at the pH higher than the pKa value. Upon analyzing the surface morphology of the Cu-graphite composite coating, it is found that the specifically ordered structure of the coating can be fabricated by controlling the pH of the bath.

研究了在含石墨颗粒的硫酸铜镀液中电沉积铜-石墨复合膜。用硝酸氧化石墨颗粒以引入表面氧化物。采用电位滴定法研究了石墨边缘官能团在铜-石墨复合电镀过程中的作用。在pH = 2.45时，有石墨颗粒和无石墨颗粒的滴定曲线相互交叉，这可能是该化合物在镀液中存在Cu^2+时的pKa值。然而，发现该值低于不含Cu^<2+>离子的相同溶液的pH 3。这一现象可能是在pH值高于pKa值时，Cu^<2+>离子在石墨官能团上的吸附所致。通过对铜-石墨复合镀层表面形貌的分析，发现通过控制镀液的pH值，可以获得具有特定有序结构的镀层。

项目成果

複合めっき-共析のメカニズムと最新応用

复合电镀-共析机理及最新应用

• 发表时间: 2006
• 期刊: 表面技術 57
• 作者: 林 秀考

Surface modification of graphite particles for Cu based composite plating

铜基复合电镀用石墨颗粒的表面改性

• 发表时间: 2006
• 作者: Shigeru KASHIMURA;Hidetaka HAYASHI;Akira KISHIMOTO
• 通讯作者: Akira KISHIMOTO

Composite plating - codeposition mechanism and new application

复合电镀-共沉积机理及新应用

• 发表时间: 2006
• 期刊: Hyomen gijutsu Vol. 57
• 作者: 林 秀考;吉武 優;柳澤栄治;大橋俊寛;Hidetaka HAYASHI
• 通讯作者: Hidetaka HAYASHI

銅複合めっきに用いるグラファイト粉末の表面改質と応用

铜复合电镀用石墨粉的表面改性及应用

• 发表时间: 2007
• 作者: 樫村 茂;林 秀考;岸本 昭
• 通讯作者: 岸本 昭

Electrodeposition of the composite film of nickel and hydrophobic graphite particle

镍与疏水性石墨颗粒复合膜的电沉积

• 发表时间: 2006
• 期刊: Hyomen gijutsu Vol. 57
• 作者: Hidetaka HAYASHI;Masaru YOSHITAKE;Eiji YANAGISAWA;Toshihiro OHASHI
• 通讯作者: Toshihiro OHASHI