Basic research on intra-board broad-band optical interconnects for high-performance system integration

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Intra-board chip-to-chip optical interconnects with wavelength-division multiplexing (WDM) was investigated as one of strong candidates for solving the so-cold pin-bottle-neck problem occurred in future high-performance system integration.An integration of focusing grating couplers (FGCs) and distributed Bragg reflectors (DBRs) for constructing optical add-drop multiplexers in an optical waveguide board was theoretically and experimentally investigated and demonstrated. An interference exposure system was also designed and constructed to integrate DBRs with precise control of the grating periods.Reduction of insertion loss was discussed and tried for high-bit-rate signal transmission of Gbps. New structure was proposed for both reduction of the insertion loss and enhancement of the wavelength multiplexing range. Novel fabrication process was developed to fabricate the structure. The loss was reduced by 10dB.WDM signal transmission using two wavelengths in the fabricated optical waveguide was tested. Clear eye patterns were successfully observed.A circuit model of the photodiode has been proposed for design of the optoelectronic systems. The model includes the effects of the photo sensitivity, the transimpedance amplifier, and the bandwidth circuit. The model was applied to a GaAs PIN photodiode with pre-amplifier, and allows that the simulation of the output characteristics at 3.2GHz.Silicon nitride film with considerably low carbon concentration has been deposited from a metalorganic source by a new radical beam deposition method. The refractive index of the deposited film was controlled in the range of 1.79 and 1.89. Large-area deposition applicable to a 12-inch wafer was successfully achieved.